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Electrochemical analysis of copper-EDTA-ammonia-gold thiosulfate dissolution system

  • Peng-Zhi Xiang and Guo-Hua Ye EMAIL logo
Published/Copyright: August 15, 2023
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Abstract

Ethylenediaminetetraacetic acid disodium (EDTA) can form stable complexes with many metals. To improve the leaching rate of gold and the consumption rate of thiosulfate, EDTA and ammonia were combined with copper ions to form a copper-EDTA-ammonia-thiosulfate system. Electrochemical methods were used to study the effect of thiosulfate, copper ion, EDTA, and polarization voltage. The results showed that increasing the concentrations of thiosulfate, copper ions, and EDTA promoted the dissolution of gold, which changed from electrochemical control to diffusion control after adding EDTA. The order of influence was thiosulfate > EDTA > copper ion. The pure gold leaching experiment showed that the dissolution rate of gold in the EDTA-ammonium-copper thiosulfate system was higher than that in the EDTA-copper-thiosulfuric acid system, thus achieving synergistic gold leaching.

1 Introduction

Thiosulfate gold extraction is the most promising non-cyanide gold extraction method for industrial applications. The copper ammonia-thiosulfate gold dissolution system is the most studied system and can achieve ideal gold dissolution at room temperature [1,2,3]. However, due to the strong oxidation ability of the copper-ammonia complex, the system consumes too much thiosulfate and produces a passivation layer on the gold surface [4].

Ethylenediaminetetraacetic acid disodium (EDTA) exists in aqueous solution in seven forms: H6Y2+, H5Y+, H4Y, H3Y, H2Y2−, HY3−, and Y4−. At pH 10, EDTA mainly exists as HY3−, allowing Y4− and Y4− to coordinate directly with metal ions. HY3− also has a strong coordination ability. Cu2+ and EDTA form a 1:1 [CuY]2− complex. During leaching, the complex oxidizes gold to Au+, which reacts with S 2 O 3 2 to form Au ( S 2 O 3 ) 2 3 via the reactions shown in Eqs. 1 and 2. Au ( S 2 O 3 ) 2 3 is more stable than [CuY]2− and ensures that Eq. 3 proceeds smoothly [5,6]. [CuY]2− is reduced to [CuY]3−, and O2 in the air oxidizes Cu ( S 2 O 3 ) 3 5 to [CuY]2−, which in turn acts as a catalyst, as shown in Eqs. 3 and 4.

(1) Cu 2 + + Y 4 [ CuY ] 2

(2) Au + 2 S 2 O 3 2 + [ CuY ] 2 Au ( S 2 O 3 ) 2 3 + [ CuY ] 3

(3) Au + 5 S 2 O 3 2 + [ CuY ] 2 Au ( S 2 O 3 ) 2 3 + Cu ( S 2 O 3 ) 3 5 + Y 4

(4) 4 Cu ( S 2 O 3 ) 3 5 + O 2 + 4 Y 4 + 2 H 2 O 4 [ CuY ] 2 + 12 S 2 O 3 2 + 4 OH

Thiosulfate is consumed during industrial gold leaching methods. To reduce sulfate consumption, it is necessary to reduce the electrode potential of the copper complex, CuY 2 / Cu ( S 2 O 3 ) 3 5 , whose standard electrode potential is 0.13 V. This is lower than the standard electrode potential of the copper-ammonia complex and can dissolve thiosulfate gold. Therefore, EDTA can be combined with copper ions partially or completely instead of ammonia to reduce the oxidation potential of leaching.

The electrode potential of the copper ion can be conditioned by adjusting the ligand. The need for gold immersion can be satisfied while the consumption of thiosulfate can be reduced. The cupric-ammonia system is one of the most studied systems, whose mixed potential can be regulated by complexing copper ions with two ligands. The synergistic complexation of copper with ammonia by EDTA has rarely been reported.

The leaching of gold is essentially an electrochemical process, so electrochemical methods can be used to study the leaching process of gold [7,8]. In this article, EDTA was used as a ligand, and ammonia or sodium hydroxide was used to adjust the pH of the solution to form two systems: copper-EDTA-thiosulfate system and copper-EDTA-ammonia-thiosulfate system. The influence of various factors on the dissolution of gold in the copper-EDTA-ammonia-thiosulfate system was investigated, including the concentration of thiosulfate, copper ions, and EDTA. The effects of various factors of the two systems on the dissolution of gold were investigated by electrochemical analysis to provide a theoretical basis to improve the thiosulfate gold extraction method [9].

2 Experimental instruments and reagents

2.1 Experimental instruments

The following instruments were used: CHI650E Electrochemical workstation (Shanghai Chenhua); TAS-990 atomic absorption spectrophotometer (Beijing Puxi); and PHS-3C acidity meter (Shanghai Yidian Scientific Instrument Co., Ltd.).

2.2 Experimental reagents

Sodium thiosulfate, copper sulfate, hydrochloric acid, sodium hydroxide, ammonia, and EDTA were analytically pure (Sinopharm Chemical Reagent Co., Ltd.), and double-distilled water was used in all experiments.

3 Experimental methods

3.1 Electrochemical analysis

A three-electrode system was used during electrochemical tests. A gold electrode (CHI101, Chenhua, Shanghai) was used as the working electrode, platinum foil wire was used as the counter electrode, and a saturated calomel electrode was used as the reference electrode. All electrochemical measurements were carried out on an electrochemical workstation (CHI650E, Chenhua, Shanghai).

3.2 Analysis of gold in the leaching solution

A pure gold sheet (an area of 1 cm2, a thickness of 0.1 mm, and a purity of 99.9%) was leached. After leaching, 5 mL of the leaching solution was measured, and a small amount of distilled water was added for dilution. Then, 3 mL of hydrogen peroxide was slowly added for oxidation, so that the thiosulfate in the system was completely oxidized. After 15 min, 2 mL of 1:1 hydrochloric acid was added for acidification. The solution was placed on an electric heating plate, which was heated until clear. Then, three drops of 10% KCl solution were added, and the solution was heated until dry. The volume was adjusted to 250 mL with 5% aqua regia, and the concentration of gold was analyzed by atomic absorption spectrometry (TAS-990, Puxitongyong).

3.3 AC impedance analysis

AC impedance, also known as electrochemical impedance spectroscopy (EIS), was measured with a 5 mV AC disturbance signal, using a frequency range from 100 kHz to 0.1 Hz. The impedance data were simulated and analyzed by ZSIMPWIN software. In the formula, R s represents the solution resistance, R p represents the electrode polarization resistance, R ct represents the dissolved electron transfer impedance of the gold electrode, Q 1 represents the electrode/solution bilayer, Q 2 represents the electrode/solute bilayer, and W represents the Warburg impedance. The equivalent circuit diagram is shown in Figure 1.

Figure 1 
                  The equivalent circuit diagram: (a) R
                     s(Q1(R
                     ct
                     W)), (b) R
                     s(Q
                     1(R
                     ct
                     W))(Q
                     2
                     R
                     2), (c) R
                     s(Q
                     1(R
                     p(Q
                     2
                     R
                     ct))), and (d) R
                     s(Q
                     1(R
                     p(Q
                     2(R
                     ct
                     W)))).
Figure 1

The equivalent circuit diagram: (a) R s(Q1(R ct W)), (b) R s(Q 1(R ct W))(Q 2 R 2), (c) R s(Q 1(R p(Q 2 R ct))), and (d) R s(Q 1(R p(Q 2(R ct W)))).

4 Results and discussion

4.1 Effect of thiosulfate

In the copper-EDTA-ammonia-thiosulfate system, the EDTA concentration was 0.005 M, and the copper ion concentration was 0.005 M. By adjusting the pH of the solution with ammonia, the effect of thiosulfate concentration on the dissolution of gold is analyzed by AC impedance spectroscopy (Figure 2a). The whole process system can be represented by R s(Q 1(R ct W)). The fitting parameters of the circuit diagram are shown in Table 1. It can be seen that Warburg impedance appears in this process, indicating that the gold dissolution reaction was diffusion controlled. R s decreased upon increasing the thiosulfate concentration, indicating an enhanced ionic strength of the solution. Upon increasing the thiosulfate concentration, R ct continually decreased (Figure 2b). In this system, the thiosulfate concentration decreased sharply from 0 to 0.02 M, indicating the need for thiosulfate in the thiosulfate gold dissolution system. When the concentration of thiosulfate increased to 0.1 M, R ct only slightly changed, indicating that it had little effect on the dissolution of gold beyond this concentration. This is consistent with the thiosulfate concentration used during gold leaching in the literature [10]. In addition, upon increasing the thiosulfate concentration, n gradually decreased, indicating that the dispersion degree increased and the gold surface became coarser due to the dissolution of gold [11]. Therefore, increasing the thiosulfate concentration promoted the dissolution of gold in the copper-EDTA-ammonia-thiosulfate system.

Figure 2 
                  AC impedance analysis of different thiosulfate concentrations: (a) Nyquist plots and (b) effects on R
                     ct and W.
Figure 2

AC impedance analysis of different thiosulfate concentrations: (a) Nyquist plots and (b) effects on R ct and W.

Table 1

The fitting data of thiosulfate concentration in the copper-EDTA-ammonia-thiosulfate system

Thiosulfate concentration (M) R s (Ω·cm2) Q (×10−6 S∙s n ∙cm−2) n R ct (×105 Ω∙cm2) W (×10−6 S∙s0.5∙cm−2)
0 1,315 3.002 0.7851 14.71 2.324
0.02 698.9 9.657 0.6545 3.293 10.25
0.04 360 1.994 0.5677 2.932 16.53
0.06 254.1 1.975 0.5790 1.149 12.23
0.08 211.8 1.902 0.5991 1.861 7.980
0.10 182.6 12.65 0.6598 0.4745 13.73
0.12 153 9.882 0.6921 0.4749 12.21

4.2 Influence of copper ion

The copper-EDTA-ammonia-thiosulfate system contained 0.1 M thiosulfate and 0.005 M EDTA, and the pH of the solution was adjusted to 10 using aqueous ammonia. The effect of copper ion concentration on gold dissolution was investigated by AC impedance spectroscopy. The results are shown in Figure 3a. The equivalent circuit diagram of R s(Q 1(R ct W)) was fitted with the same symbols as in the previous section. The circuit diagram shows that the reaction was diffusion controlled. The fitting parameters were obtained according to the equivalent circuit diagram, and the results are shown in Table 2. Upon increasing the copper ion concentration, R s remained basically unchanged, indicating that increasing the copper ion concentration did not significantly change the ionic strength of the solution. Figure 3b shows that R ct always decreased upon increasing the copper ion concentration, which promoted the dissolution of gold [12]. Warburg impedance also appeared upon increasing the copper ion concentration, indicating that the reaction was diffusion-controlled.

Figure 3 
                  AC impedance analysis of different copper ions concentrations: (a) Nyquist plots and (b) effects on R
                     ct and W.
Figure 3

AC impedance analysis of different copper ions concentrations: (a) Nyquist plots and (b) effects on R ct and W.

Table 2

Fitted data for different copper concentrations [R s(Q(R ct W))]

Copper ion concentration (M) R s (Ω·cm2) Q (×10−7 S·s n ·cm−2) n R ct (×105 Ω·cm2) W (×10−6 S·s0.5·cm−2)
0 143.1 8.003 0.9283 2.911 2.554
0.001 144.7 7.518 0.9202 2.719 1.894
0.003 148.2 7.640 0.9085 2.596 2.006
0.005 151.1 8.029 0.9035 1.998 2.162
0.007 156.1 8.547 0.8956 1.829 2.307

The Q value also increased upon increasing the copper ion concentration, indicating that the charge storage capacity increased during the electrochemical reaction, i.e., the equivalent capacitor had a greater charge and discharge capacity during charge transfer. This made the charge transfer process of the entire system faster and accelerated the dissolution of gold. The value of n was close to 1, indicating that the dispersion effect was small, the surface of the gold electrode remained smooth, the surface of the gold electrode was less adsorbed, and there was no obvious passivation phenomenon. In general, the addition of copper ions and increasing the concentration did not greatly change R s and R ct, but this did not mean that the role of copper ions in the gold thiosulfate dissolution system was not very important. The reason for this may be that in the electrochemical system, the dissolution of gold mainly depended on the current, while the copper ions only showed good oxidation performance when they were actually leached. Therefore, R s changed little, while R ct decreased upon increasing the copper ion concentration, which also promoted the dissolution of gold. Warburg impedance appeared upon increasing the copper ion concentration.

4.3 Effect of EDTA

4.3.1 Influence of EDTA in the copper-EDTA-thiosulfate system

In the gold dissolution system containing 0.1 M thiosulfate and 0.005 M copper ions, the pH of the solution was adjusted by NaOH to 10, and the effect of EDTA concentration on the dissolution of gold was investigated. When no EDTA was added, R s(Q 1(R p(Q 2 R ct))) equivalent circuit diagram can be used for fitting, and the fitting data are shown in Table 3. After adding EDTA, the equivalent circuit diagram of R s(Q 1(R ct W)) can be used for fitting, and the fitting data are shown in Table 4. The electrical meaning of each symbol of the above circuits is the same as in the AC impedance analysis in Section 2.3.

Table 3

Fitted data for 0 M EDTA [R s(Q 1(R p(Q 2 R ct)))]

EDTA (M) R s (Ω·cm2) Q 1 (×10−6 S·s n ·cm−2) n R p (×105) Q 2 (×10−6 S·s n ·cm−2) n R ct (×105) X 2 (×10−4)
0 76.13 1.116 0.8233 3.794 3.838 0.9257 4.021 7.36
Table 4

Fitted data for different Cu2+ concentrations [R s(Q(R ct W))]

EDTA (M) R s (Ω·cm2) Q (×10−7 S·s n ·cm−2) n R ct (×105) W (×10−6 S·s0.5·cm−2) X 2 (10−3)
0.002 76.78 1.101 0.8241 3.316 4.417 7.74
0.006 90.56 7.663 0.8611 5.288 3.979 7.18
0.010 82.54 7.598 0.8503 6.021 3.615 6.75
0.015 89.37 7.263 0.8510 6.118 2.893 6.43

R s increased slightly upon increasing the EDTA concentration because some copper ions complexed with EDTA, which reduced the ionic strength of the solution. The dissolution rate of EDTA increased first and then decreased upon increasing the EDTA concentration. After adding EDTA solution, Warburg impedance appeared, indicating that gold dissolution was diffusion controlled.

The above analysis shows that the addition of EDTA promoted the dissolution of gold in the copper-EDTA-ammonia-thiosulfate system, but the concentration of EDTA should be controlled. It can be seen from Table 4 that the optimal concentration of EDTA was 0.002 M in the gold solution system at pH 10 containing 0.1 M thiosulfate and 0.005 M copper ions. When the EDTA concentration was 0.002 M and the copper ion concentration was 0.005 M, copper ions were not completely complexed. Therefore, some copper ions existed in the free state, which decreased the stability of thiosulfate. This shows that it is necessary to strictly control the ratio and concentration of each reagent to improve the leaching effect [13].

4.3.2 Influence of EDTA in the copper-EDTA-ammonia-thiosulfate system

In the solution containing 0.1 M thiosulfate and 0.005 M copper ions, the effect of EDTA concentration on the dissolution of gold was investigated. The pH of the solution was adjusted to 10 with ammonia. Figure 4a shows the EIS spectra represented by a Nyquist plot. Similar to the previous use of sodium hydroxide to adjust the pH of the solution, when EDTA was not added, the equivalent circuit diagram of R s(Q 1(R p(Q 2 R ct))) was used for fitting, and the fitting data are shown in Table 5. After adding EDTA, R s(Q 1(R ct W)) equivalent circuit diagram was used for fitting, and the fitting data are shown in Table 6. The meanings of the above circuit symbols are consistent with the AC impedance analysis in Section 2.3.

Figure 4 
                     AC impedance analysis of different EDTA concentrations: (a) Nyquist plot and (b) effects on R
                        ct.
Figure 4

AC impedance analysis of different EDTA concentrations: (a) Nyquist plot and (b) effects on R ct.

Table 5

Fitted data for different EDTA concentrations [R s(Q 1(R p(Q 2 R ct)))]

EDTA (M) R s (Ω·cm2) Q 1 (×10−8 S·s n ·cm−2) n R p (×105) Q 2 (×10−5 S·s n ·cm−2) n R ct (×105) X 2 (×10−4)
0 14.96 3.9430 1 120.6 2.513 0.5248 6.696 4.881
Table 6

Fitted data for different EDTA concentrations [R s(Q 1(R ct W))]

EDTA (M) R s (Ω·cm2) Q (×10−6 S∙s n ∙cm−2) n R ct (×104) W (×10−5 S∙s0.5∙cm−2) X 2 (×10−3)
0.002 124 6.682 0.677 4.937 12.54 1.20
0.006 160.4 9.32 0.8141 1.288 6.842 1.57
0.010 157.9 8.71 0.8055 1.383 6.712 1.60
0.015 156 8.33 0.8025 1.534 6.307 1.61

Figure 4b shows increasing the EDTA concentration, R s increased, indicating that the ionic strength of the solution decreased, and the conductivity of the solution decreased. The reason may be that Cu ( NH 3 ) 4 2 + became CuY2−, causing the ionic strength to decrease. R ct decreased significantly upon increasing the EDTA concentration, indicating that the addition of EDTA greatly promoted the dissolution of gold in the presence of ammonia. Therefore, whether increasing the EDTA concentration is beneficial to the dissolution of gold depends on the existence of ammonia. If ammonia is not present, EDTA is unfavorable to the dissolution of gold. If ammonia is present, increasing the EDTA concentration promoted the dissolution of gold.

Compared with the above two systems, the equivalent circuit diagram of R s(Q 1(R p(Q 2 R ct))) was used before the addition of EDTA, and R s(Q 1(R ct W)) was used after the addition of EDTA. This indicates that regardless of whether sodium hydroxide or ammonia was used to adjust the pH of the solution, the influence mechanism by which the EDTA concentration changed the dissolution of gold was the same. This shows that the addition of EDTA changed the dissolution of gold from electrochemical control to diffusion control [14]. This means that the migration rate of EDTA became the decisive factor during gold dissolution.

EDTA alone as a ligand is disadvantageous to gold leaching. Figure 4b shows that upon increasing the EDTA concentration, the leaching of gold decreased. First, EDTA complexed with copper ions, reducing the mixed potential of the solution. Second, EDTA has a larger volume and a slower migration rate to the gold surface. Figure 4b shows that in the presence of ammonia, the R ct of the system was much lower than in the presence of sodium hydroxide, indicating that the gold dissolution rate of ammonia and EDTA as the ligand system was faster than when EDTA alone was used as the ligand. It can also be seen from Figure 4b that in the presence of ammonia, adding EDTA more effectively reduced R ct and was more conducive to the dissolution of gold. When the concentration of EDTA is 0.006 M, R ct was stable.

Changing the thiosulfate and EDTA concentrations and adjusting the pH of the solution using ammonia increased the stability of the system. AC impedance analysis also showed that the addition of EDTA and increasing the concentration promoted the dissolution of gold in the presence of ammonia. Therefore, during actual leaching, EDTA and ammonia ligands can be used to form a complex with copper ions to realize the co-leaching of gold. Previous literature has also shown [4] that EDTA can reduce the corrosion potential of gold from −0.253 to −0.302 V. The dissolution rate of gold will be accelerated accordingly.

It can be seen from the above analysis that the optimal concentration of EDTA was 0.006 M, and the molar ratio of EDTA to copper ion was about 1 in the gold solution system containing 0.1 M thiosulfate and 0.005 M copper ion solution at pH 10 adjusted by ammonia. The optimal concentration of EDTA was 0.002 M, and the molar ratio of EDTA to copper ion was 2:5 in the gold solution containing 0.1 M thiosulfate and 0.005 M copper ion solution.

The presence of ammonia determined whether increasing the EDTA concentration promoted the dissolution of gold. When ammonia was not present, EDTA was unfavorable to the dissolution of gold. If ammonia was present, increasing the EDTA concentration promoted the dissolution of gold.

4.4 Influence of polarization voltage

The AC impedance of the system was analyzed by changing the polarization voltage, and the effect of polarization voltage on gold dissolution was examined in the copper-EDTA-ammonia-thiosulfate system at pH 10 using ammonia, containing 0.1 M thiosulfate, 0.005 M copper ions, and 0.006 M EDTA. Figure 5a shows the EIS spectra represented by a Nyquist plot measured by different polarization voltages. The process can be described by equivalent circuit R s(Q 1(R ct W))(Q 2 R 2). The Bode plot indicates a two-step reaction on the surface of the gold electrode. The first step is the dissolution of gold, and the second step is the oxidation of sulfide to sulfate on the surface of the gold electrode. Equations 57 are as follows:

(5) Au + S 2 O 3 2 e Au ( S 2 O 3 ) 3

(6) CuS + 8 OH 8 e Cu 2 + + SO 4 2 + 4 H 2 O

(7) Cu 2 S + 8 OH 10 e 2 Cu 2 + + SO 4 2 + 4 H 2 O

Figure 5 
                  AC impedance analysis with the polarization voltage: (a) Nyquist plots and (b) effects on R
                     ct.
Figure 5

AC impedance analysis with the polarization voltage: (a) Nyquist plots and (b) effects on R ct.

The fitting parameters are shown in Table 7. It can be seen that R ct was the largest in Table 7 and Figure 5b when the polarization voltage was 0.4 V, indicating the most serious surface passivation of the gold electrode. When the polarization potential was greater than 0.4 V, R ct showed a greater decrease, and the passivation layer may have been broken down locally (Eqs. 6 and 7). From the change of R ct, the polarization voltage reached 0.6 V, indicating that the passivation layer was almost completely destroyed when the polarization voltage was −0.2 V [15].

Table 7

Fitted data for polarization voltage [R s(Q 1(R ct W))(Q 2 R 2)]

Voltage (V) R s (Ω∙cm2) Q 1 (×10−7 S·s n ·cm−2) n R ct (×106 Ω·cm2) W (×10−6 S·s0.5·cm−2) Q 2 (×10−9 S·s n ·cm−2) R 2 (Ω·cm2)
−0.2 21.56 3.101 0.8488 3.506 1.201 1.476 1,012
0.2 53.54 2.282 0.8823 1.848 0.227 1.818 992.1
0.3 85.96 1.905 0.9031 4.793 0.248 1.993 979.8
0.4 42.31 2.867 0.8447 8.888 1.446 1.824 953.3
0.5 34.90 2.441 0.8640 5.885 4.880 1.823 965.0
0.6 75.79 2.198 0.8759 3.481 7.542 2.000 937.2

In an actual leaching system, the mixing potential of the leaching solution of the thiosulfate system is usually 0.2–0.3 V [8]. Under the same conditions, the mixing potential of the copper-EDTA-ammonia-thiosulfate system was smaller than that of the copper-ammonia-thiosulfate system, which indicates that the copper-EDTA-ammonia thiosulfate system was less likely to produce passivation during actual leaching than the copper-ammonia-thiosulfate system. Therefore, it can be predicted that the potential for the passivation of the copper-ammonia-thiosulfate and copper-EDTA-ammonia-thiosulfate systems was in the range of 0.2–0.4 V. Thus, the copper-ammonia-thiosulfate system was more likely to be passivated than the copper-EDTA-ammonia-thiosulfate system. This shows that the passivation potential of gold leaching with EDTA and ammonia was higher than that using ammonia as the ligand. The passivation of the copper-EDTA-ammonia-thiosulfate system was more difficult to occur during leaching.

4.5 Validation test

To compare the dissolution rates of gold in the copper-EDTA-thiosulfate and copper-EDTA-ammonia-thiosulfate systems, pure gold tablets were dissolved. In the copper-EDTA-ammonia-thiosulfate system, the optimal EDTA concentration was 0.006 M. To compare the dissolution rate of gold in the two systems, the concentration of EDTA was set to 0.002 M in both systems. Therefore, the leaching conditions of the two systems were as follows: the concentration of thiosulfate was 0.1 M, the concentration of copper ion was 0.005 M, and the concentration of EDTA was 0.002 M. In the first system, ammonia was used to adjust the pH of the solution to 10 to form a copper-EDTA-ammonia-thiosulfate system. The other system used sodium hydroxide to adjust the pH of the solution to 10 to form a copper-EDTA-thiosulfate system. The stirring speed was 300 rpm, and the dissolution rate of gold was examined over 6 h. The results are shown in Figure 6. The leaching rate of gold in the copper-EDTA-ammonia-thiosulfate system was higher than that in the copper-ammonia-thiosulfate system. This result is consistent with that of the copper-EDTA-ammonia-thiosulfate system, in which R ct was much lower than that in the copper-EDTA-thiosulfate system. This also shows that the passivation of the copper-EDTA-ammonia-thiosulfate system was relatively small during leaching [16].

Figure 6 
                  The dissolution rate of gold and the consumption of thiosulfate over time.
Figure 6

The dissolution rate of gold and the consumption of thiosulfate over time.

5 Conclusion

In this article, the effects of various factors on the leaching of gold in copper-ammonia-thiosulfate system with EDTA have been investigated. The results showed that EDTA had certain advantages for coordinating with ammonia and complexing copper ions to catalyze the thiosulfate leaching of gold. The following conclusions were drawn:

  1. The presence of ammonia determined whether increasing the EDTA concentration promoted the dissolution of gold.

  2. The dissolution of gold changed from electrochemical control to diffusion control after adding EDTA. Charge-transfer resistance in the copper-EDTA-ammonia-thiosulfate system was much lower than that in the copper-EDTA-thiosulfate system.

  3. The addition of EDTA reduced the charge-transfer resistance and was more conducive to the dissolution of gold in the presence of ammonia.

  4. Electrochemistry results showed that the factors affecting the dissolution of gold in the copper-EDTA-ammonia-thiosulfate system followed the order thiosulfate > EDTA > copper ion.

  5. The verification experiments of pure gold leaching showed that the copper-EDTA-ammonia-thiosulfate system had a higher gold leaching rate than the copper-EDTA-thiosulfate system.

  1. Funding information: This work was supported by the Yunnan Education Department (2021J1374, 2021J1378) and the Yunnan Open University Scientific Research Fund (21YNOU03).

  2. Author contributions: Xiang Peng Zhi: writing of the original draft and formal analysis; Ye Guo Hua: methodology and funding acquisition.

  3. Conflict of interest: The authors state no conflict of interest.

  4. Data availability statement: All data generated or analyzed during this study are included in this published article.

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Received: 2023-03-09
Revised: 2023-06-27
Accepted: 2023-07-03
Published Online: 2023-08-15

© 2023 the author(s), published by De Gruyter

This work is licensed under the Creative Commons Attribution 4.0 International License.

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