Startseite Damping performance analysis of carbon black/lead magnesium niobite/epoxy resin composites
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Damping performance analysis of carbon black/lead magnesium niobite/epoxy resin composites

  • Ming Chen EMAIL logo , Shuang Cheng , Yanbing Wang und Zhixiong Huang EMAIL logo
Veröffentlicht/Copyright: 12. Juli 2023
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e-Polymers
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Abstract

Piezoelectric damping composites with excellent damping properties were prepared from carbon black (CB), lead magnesium niobate (PMN), epoxy resin, and polyether amine D-400. The tan δ area (TA) analysis method is used to evaluate the leading factors of damping enhancement. This method clearly shows the influence of the maximum loss factor ( tan δ max) and effective damping temperature range on damping performance, and the damping enhancement factors are quantitatively analyzed by TA values. When CB content is less than 8 wt%, viscoelastic damping and frictional energy dissipation are the main factors affecting polymer properties. When CB content reaches 8 wt%, the conductive network gradually forms, and the electric energy generated by PMN through the piezoelectric effect is dissipated by the conductive network, and the piezoelectric effect of PMN becomes the dominant factor. In this case, the maximum tan δ max and TA values of the composite are 1.93 and 27.58, respectively. The damping contribution of PMN and CB reaches 40.21% and 34.41%, respectively.

1 Introduction

Damping materials are widely used for vibration and noise reduction in aerospace, construction, and transportation. Polymer-based damping materials have been studied in various aspects because of their high damping loss factor and the designability of the materials. The matrix is generally made of polymers such as resins and rubbers, and some researchers have modified the matrix for performance enhancement (1). Song et al. improved the damping performance at high temperatures by introducing hindered amines into the NBR/phenolic resin matrix, and with the addition of hindered amines, the damping performance at high temperatures was improved, and the damping temperature range became wider (2). Feng et al. investigated the effect of different mass ratios of polyester prepolymer and polyether prepolymer on the properties of polyurethane and found that the effective damping temperature range of polyurethane materials above 60°C was broadened when the ratio of polyester prepolymer/polyether prepolymer was 40/60 and 45/55, and the maximum value of damping factor could reach 0.65, and the maximum tensile strength is 3.76 and 3.94 MPa, and the maximum tearing strength is 8.87 and 9.97 kN‧m−1 (3). The introduction of a new energy loss mechanism in damping composites has been widely studied. The concept of piezoelectric ceramic/polymer composites was first proposed by Newnham RF in the Materials Laboratory of Penn State University in 1978 (4). According to the different ways of connecting the two phases of materials, composites can be classified into ten basic types such as types 0–3, types 2–2, and types 1–3 (5,6,7,8). The application of piezoelectric composites in the field of damping was then first proposed by Forward, who based on the theory of “piezoelectric shunting” argued that the addition of piezoelectric materials to damping materials could lead to a certain shunt dissipation of energy and become an effective structural damping material (9). Some researchers have introduced conductive fillers as passive electrical networks into piezoelectric ceramic/polymer composites to enhance the damping properties of the materials, such as carbon nanotubes (10,11,12,13,14), CB (15), graphene, and aluminum particles (16). Feng et al. prepared sandwich-type damping composites by modifying reduced graphene oxide with polydopamine. The results showed that the introduction of a graphene core layer in epoxy resin (ER) could improve the damping performance by 50%, and polydopamine could effectively improve the damping ability of graphene (17). Katsiropoulos et al. incorporated different levels of graphene nanosheets in carbon fiber/polymer composites and showed that there is a significant increase in the damping properties of the composites when the concentration of graphene is increased from 0.15 to 1 wt%. On the other hand, the high content of graphene agglomerates and decreases the rate of improvement of the damping properties of the composites (18). Of course, some researchers have also introduced piezoelectric ceramic fillers into fiber-reinforced composites to enhance the vibration damping properties of the materials (19,20,21,22).

Conductive CB is widely used in composite materials due to its large surface area, good dispersion, and excellent conductivity. The CB particles in the composites form chain-like dendritic aggregates between them in the form of chemical bonds, which can improve the electrical conductivity and strength of the composites. Wang et al. prepared piezoelectric damping composites based on carbon black (CB), lead magnesium niobate (PMN), and chloroprene rubber. The results showed that with the increase of CB, the tensile properties improved, the tan δ max decreased, but the damping effective temperature range widened (23). Jian et al. prepared a polymer-based piezoelectric damping composite material with high damping and wide temperature domain using butyl rubber, phenolic resin, piezoelectric ceramics, and CB. It was shown that the addition of CB and piezoelectric ceramics resulted in a significant broadening of the effective damping temperature domain of the composite, and it was experimentally confirmed that the polarized samples had higher damping peaks than the nonpolarized samples (24). Zhang et al. used a numerical prediction method to analyze 0–3 piezoelectric damped composites, which can predict the effective performance of the composites and optimize the damping design (25).

PMN, as a piezoelectric ceramic, has a higher piezoelectric coefficient and dielectric constant. Huang et al. investigated the effect of load stress and vibration frequency on the damping performance of PMN piezoelectric damping composites, and the results showed that the peak value of the loss factor increased and the damping temperature domain became wider as the load stress increased, while the vibration frequency increased and the loss factor decreased instead (26). The damping performance of each component of PMN piezoelectric damping composites was evaluated using TA analysis by Pan et al. PMN damping contribution reached 33.95% for PMN content at 40 wt%, and only 4.28% for PMN content over 60 wt% due to the low matrix percentage content (27).

Polyetheramine can be used as flexible curing agent for epoxy resins due to the flexible ether bond structure in polyethers, which results in improved toughness and damping properties of the cured product. The curing reaction kinetics of polyetheramine curing agents for four different epoxy resins was studied by Zhao et al. They used the Sestak–Berggren kinetic model to fit well the curing system of all epoxy resins, which can provide insight into the curing mechanism of flexible curing agents (28). Bao et al. prepared high- and low-temperature resistant composites from epoxy resin blends, polyetheramine D-400 and m-xylene diamine, and polyetheramine D-400 improved the mechanical properties of the composites at 160°C and −196°C (29). The curing reaction properties of two polyetheramine with hydrogenated bisphenol A epoxy resins were investigated by Wu et al. The addition of polyetheramine resulted in a significant decrease in the gel time of the material and an increase in shear strength, heat resistance, and fracture toughness (30).

In this study, polyetheramine, CB, and PMN were introduced into the epoxy resin matrix to prepare piezoelectric damping composites. Polyetheramine can effectively improve the toughness and damping properties of the material, and the electrical energy generated by the piezoelectric effect of PMN is effectively dissipated through the conductive network, which can effectively improve the damping properties of CB/PMN/EP composites. In this study, the damping effects of the composites with different components were analyzed based on the TA analysis method, and the damping percentage of each component was quantified.

2 Materials and methods

2.1 Materials

The base material used is bisphenol A epoxy resin E51(EP) from Shanghai Autun Chemical Technology Company Limited with the chemical formula ( C 11 H 12 O 3 ) n and epoxy equivalence of 184–195 g‧mol−1. The piezoelectric phase used is PMN from Baoding Hongsheng Acoustic Electronic Equipment Company Limited with an average particle size of 20–40 μm. The conductive phase is CB N330 produced by Huzhe Chemical Factory with an average particle size of 10–30 μm. There are two kinds of curing agents used in the experiments: the first one is polyethylene polyamine produced by Macklin Biochemical Technology Company Limited with the chemical formula is C 12 H 5 N 7 O 12 ; the second one is polyetheramine D-400 produced by Macklin Biochemical Technology Company Limited with the chemical formula is C H 3 CH ( N H 2 ) C H 2 [ OC H 2 CH ( C H 3 ) ] n N H 2 . The coupling agent used is KH-560 silane coupling agent produced by Kangjin New Material Technology Company Limited. The chemical formula is C 9 H 20 O 5 Si .

2.2 Preparation of composites

2.2.1 Preparation of pure resin sample

Polyetheramine D-400 was added to the epoxy resin at a ratio of 50 wt% of the resin, and the sample was thoroughly stirred. After vacuum drying at 60°C to remove bubbles, the sample was cured at 80°C for 2 h and then at 120°C for 3 h. The polyethylene polyamine was added into the epoxy resin with a ratio of 13 wt% of the resin, and the sample was fully stirred. Then, the sample was cured at room temperature for 4 h and 80°C for 2 h.

2.2.2 Preparation of CB/EP composites

CB was added to the EP matrix in the ratio listed in Table 1, stirred magnetically at 60°C for 3 h, followed by ultrasonic dispersion for 1 h. Finally, the vacuum was applied at 80°C to remove air bubbles. Polyetheramine D-400 curing agent with 50 wt% resin content was added at room temperature, and the mixture was cured at 30°C for 4 h, 60°C for 6 h, and 80°C for 2 h to obtain CB/EP composites.

Table 1

Percentage of each component of CB/EP composite

Sample EP + D-400 (wt%) CB (wt%)
A1 100 0
B1 98 2
C1 96 4
D1 92 8
E1 90 10
F1 80 20

2.2.3 Preparation of PMN/EP composites

PMN ceramics were surface modified using a silane coupling agent KH-560 hydroalcoholic solution at 1.5 wt% of the ceramic mass. The water–alcohol volume ratio was 8:2, and the acetic acid solution was added to make the pH value between 3 and 4. After hydrolysis, the ceramics were added to accelerate the coupling by magnetic stirring, and the coupling-treated PMN powder was obtained by drying and sieving. PMN was added to the EP matrix according to the content shown in Table 2, stirred magnetically at 60°C for 3 h, and then ultrasonically dispersed for 1 h. After that, air bubbles were discharged in a vacuum drying oven at 60°C. Finally, 50 wt% of polyetheramine D-400 curing agent was added to the resin at room temperature: 6 h of curing at 30°C, 6 h of curing at 60°C, and 2 h of holding at 80°C to obtain PMN/EP composites.

Table 2

Percentage of each component of PMN/EP composite

Sample EP + D-400 (wt%) PMN (wt%)
A2 100 0
B2 88 12
C2 71 29
D2 60 40
E2 43 57

2.2.4 Preparation of CB/40 wt% PMN/EP composites

The PMN treated with the previous coupling agent was added to the EP at 40 wt%, magnetically stirred for 2 h at 80°C, and ultrasonically dispersed for 1 h. After that, CB was added to the PMN/EP mixture at the content of Table 3, magnetically stirred for 2 h, and ultrasonically dispersed for 1 h. It was placed in a vacuum drying oven at 60°C to remove air bubbles, and finally, 50 wt% polyetheramine D-400 was added at room temperature. Curing agent at room temperature for 6 h at 30°C, 6 h at 60°C, and 2 h at 80°C to obtain three-phase piezoelectric damping composites. Finally, the polarization process was carried out, and the samples were coated with conductive silver paste on both sides for oil bath polarization, and the polarization conditions were 30 min, 80°C, and 8 kV‧mm−1.

Table 3

Percentage of each component of CB/40 wt% PMN/EP composite

Sample EP + PMN+D-400 (wt%) CB (wt%)
A3 100 0
B3 98 2
C3 96 4
D3 92 8
E3 90 10
F3 80 20

2.3 Experimental test methods

The cross-sectional analysis was carried out by scanning electron microscopy (SEM, TESCAN MIRA4). The viscoelastic behavior was studied by means of a dynamic mechanical thermal analyzer (DMA, METTLER TOLEDO SDTA861e) with a sample diameter of 12 mm and a thickness of 2 mm, a test frequency of 1 HZ, and a ramping rate of 2°C‧min−1. Resistivity tests were performed experimentally by means of a conductivity tester (ST2253y). The viscosity test was performed using NDJ-8s digital display rotary viscometer.

2.4 TA analysis method

The TA analysis method was chosen to evaluate the damping characteristics, and the effect of the maximum loss factor and the effective temperature range on the damping characteristics was clearly elucidated. Fradkin et al. (31) proposed the definition of the damping function:

(1) LA = T G T R E '' T ( E G E R ) R ( E ɑ ) avg π 2 T g 2

(2) TA = T G T R tan δ T ( ln E G ln E R ) R ( E ɑ ) avg π 2 T g 2

where E '' is the loss modulus, and tan δ is the loss factor, and T g is the glass transition temperature, and E G and E R are the energy storage modulus of the glassy and rubbery states, and T G and T R are the onset and termination temperatures of the glass transition, and ( E ɑ ) avg is the activation energy of the relaxation process, and R is the gas constant.

The material exhibits significant damping performance when the loss factor near the peak damping value reaches 0.3, which means that the composite material reaches the effective loss factor. Therefore, in this study, we choose the effective damping temperature range ( tan δ ≥ 0.3) as the integration region. T G and T R in Eqs. 1 and 2 are replaced by the initial and endpoint temperatures at which tanδ reaches 0.3. At this point, the TA value is calculated by integrating the loss factor curve over the temperature range.

TA analysis is based on the group contribution method, that is, each molecular group in the molecular structure has a specific contribution to the TA value, so as to establish a relationship between the TA value and the polymer chemical structure. Ogawa and Yamada (32) selected amorphous polymer, semi-crystalline polymer, and single damping peak copolymer as the research object, using the TA analysis method to calculate the TA value of the group. The functional relationship between TA value and the number of specific groups is established as follows:

(3) TA = a 0 + Σ = 1 n a i X i

where X i is the number of group i, a i is the regression coefficient which means the contribution of TA values by each group, and a 0 is a constant.

According to the above analysis, the TA value can be decomposed into the contribution value of each functional group in the molecular structure based on the group contribution method, so the relationship between each independent functional group and the overall damping performance of the material can be established. By applying this calculation method to piezoelectric damping composites, TA values of single-phase, two-phase and three-phase composites can be calculated according to the DMA test results of composites with different component phase contents, and the damping contribution ratio of each component phase in the damping composites can be further calculated, as shown in the following formula:

(4) T A i = T A C T A C , 0

(5) D i = T A i T A c × 100 %

where D i is the damping percentage of component i, T A i and T A C are the TA value of component i and composite, and T A C , 0 is the TA value of composite at 0 wt% content of component i.

3 Results and discussion

3.1 Comparison of curing agents

Figure 1 shows the damping curves and flexural strength of the polyethylene polyamine and polyetheramine D-400 cured epoxy resins. It can be seen that polyetheramine D-400 cause the T g of the samples to decrease and tan δ max to increase considerably and the damping factor to reach a maximum of 1.4 with a damping temperature range of 25–60°C, whereas the polyethylene polyamine cured samples can only reach a maximum damping factor of 0.6 with a damping temperature range of 75–105°C. This suggests that polyetheramine D-400 will enhance the damping properties of the material but will also reduce the mechanical properties of the sample. The bending strength of the polyethylene polyamine cured sample is 100 MPa at room temperature as seen in Figure 1b, while the bending strength of the polyetheramine D-400 cured sample is only 45.34 MPa, a significant decrease in mechanical properties. The piezoelectric damping composites are mainly used in automotive, construction, marine, and other fields. After considering the use environment and conditions, it is considered that the material should be used at an ambient temperature of 20–60°C. The effective damping temperature range of the polyetheramine D-400 cured samples meets this condition, and the composite samples behind use polyetheramine D-400 as the curing agent to provide some effective reference for the actual production.

Figure 1 
                  Damping curves (a) and flexural strength (b) of resin samples cured with different curing agents.
Figure 1

Damping curves (a) and flexural strength (b) of resin samples cured with different curing agents.

3.2 CB/EP composites

Figure 2 shows the cross-section of the CB/EP composite. CB is well dispersed in the CB/EP composite, which increases the interfacial frictional energy dissipation of the composite. At a CB content of 4 wt%, the content is low, and the dispersion is good with few particles exhibited within the cross-section. When the CB content reached 10 wt%, the observed region became significantly more particles, but no significant agglomeration was observed in the matrix. As the CB content continues to increase up to 20 wt%, some areas of CB agglomerative contact appear, as shown in Figure 2c. The large increase in CB content increases the frictional energy dissipation within the material but also makes the interface increase and agglomerative contact increase.

Figure 2 
                  Fracture surfaces of CB/EP composites at different CB contents: (a) 4 wt%, (b) 10 wt%, and (c) 20 wt%.
Figure 2

Fracture surfaces of CB/EP composites at different CB contents: (a) 4 wt%, (b) 10 wt%, and (c) 20 wt%.

In Figure 3, we can see the viscosity of CB/EP composite blends with different CB contents at different temperatures, and the viscosity shows a non-linear decrease with the increase in temperature. With the increasing CB content, the solids in the mixture increase, and the friction between the filler and the matrix increases, which makes the viscosity of the solution show a rising phenomenon. When the CB content reaches 20 wt% and the temperature reaches 30°C, the viscosity can reach the maximum value of 26,773 mPa·s. The increasing viscosity of the mixture will make the combination of CB and matrix insufficient, and the composite material is easy to produce more defects after curing, which makes the damping properties and mechanical properties of the material decrease.

Figure 3 
                  Viscosity of CB/EP composites with different CB contents at different temperatures.
Figure 3

Viscosity of CB/EP composites with different CB contents at different temperatures.

The damping characteristics of CB/EP composites are shown in Figure 4. In general, the damping material reaches the maximum loss factor ( tan δ max) at the glass transition temperature (T g). TA value is selected as the damping performance parameter, which clearly illustrates the influence of tan δ max and damping temperature domain on damping performance. According to the loss factor curve of CB/EP composites, TA values of composites with different CB contents were obtained, as shown in Figure 4b; TA value increases first and then decreases. TA value of CB/EP composites reaches the maximum value when CB content is 4 wt%, and the damping contribution percentage of CB also reaches the maximum value 26.82%. When CB content continues to increase to 8 wt%, the tan δ max of the material is the same as that of the material when CB content is 4 wt%, but the damping temperature range decreases, resulting in a decrease of TA value and the contribution percentage of CB decreases to 23.28%. As shown in Table 4, when CB content is increased to 10 wt%, the agglomeration of CB in the epoxy resin matrix and the decrease of the percentage of CB in the matrix will lead to the decrease of tan δ max, but the effective temperature range is obviously expanded, so the decrease of TA value is not large, and the damping contribution percentage of CB reaches 19.43%. When the content of CB is 20 wt%, the agglomeration increases and the viscosity of the mixed solution increases sharply. The addition of a large amount of CB reduces the proportion of the matrix. At the same time, the intrinsic damping of the matrix and the friction energy dissipation in the material are affected by the agglomeration caused by the addition of a large number of fillers, which makes the damping temperature range of the material increase, T g increase and tan δ max decrease sharply, only 1.21. TA value also decreased sharply, reaching 11.68, even lower than TA value of pure resin sample, making the damping contribution percentage of CB −8.3%, indicating that when CB content reaches 20 wt%, the damping performance of the material has a negative impact.

Figure 4 
                  Damping characteristics of CB/EP composites as a function of CB content: (a) loss factor curve and (b) TA value and damping percentage of CB/EP composites.
Figure 4

Damping characteristics of CB/EP composites as a function of CB content: (a) loss factor curve and (b) TA value and damping percentage of CB/EP composites.

Table 4

Damping properties of CB/EP composites

CB (wt%) T g (°C) tan δ max TA ΔT( tan δ 0.3 ) (°C)
0 44 1.35 12.65 23.5
2 44 1.50 15.24 25
4 44 1.67 17.21 25.7
8 44 1.67 16.49 25.5
10 45 1.45 15.7 27
20 51 1.21 11.68 27.5

3.3 PMN/EP composites

As shown in Figure 5, PMN has good dispersion in the matrix and strong interfacial compatibility with epoxy resin. When PMN reaches 40 wt%, the interface between PMN and matrix is clear, the filler and matrix are well combined, and the cross section is smooth. As can be seen from Figure 6, when PMN is added to the mixed solution, the viscosity of the mixed solution increases significantly, and the viscosity of 20 wt% CB/40 wt% PMN/EP can reach 78,385 mPa·s at 30°C. When PMN reaches 57 wt%, the solution viscosity increases, the binding force between PMN and epoxy resin weakens, and it can be seen that PMN begins to agglomerate, the interface between filler and matrix is not clear, and a large number of PMN agglomerates will lead to the decrease of damping and mechanical properties of the material.

Figure 5 
                  Fracture surfaces of PMN/EP composites at different PMN contents: (a) 29 wt%, (b) 40 wt%, and (c) 57 wt%.
Figure 5

Fracture surfaces of PMN/EP composites at different PMN contents: (a) 29 wt%, (b) 40 wt%, and (c) 57 wt%.

Figure 6 
                  Viscosity of CB/PMN/EP blends and CB/EP blends at different temperatures.
Figure 6

Viscosity of CB/PMN/EP blends and CB/EP blends at different temperatures.

It can be seen from Figure 7 that the tan δ max and TA values of PMN/EP composites first increase and then decrease with the increasing of PMN content, and the effective damping temperature range keeps widening. The piezoelectric effect of PMN ceramics is caused by external force. Bound charges exist on the surface of the crystal and cannot be converted into other forms of energy due to the lack of a conductive network. Therefore, the improvement of damping performance is mainly achieved through the interface friction of PMN ceramics. It can be seen in Table 5 that when PMN content increases to 40 wt%, tan δ max reaches the maximum value of 1.70, TA also reaches the maximum value of 18.09, and the damping contribution percentage of PMN reaches 30.07%. When the PMN content reached 57 wt%, tan δ max decreased sharply, while Tg increased. The bulk increase of PMN reduced the volume proportion of the matrix, resulting in the decrease of viscoelastic damping of the resin matrix. The increase of friction energy dissipation was offset by the decrease of viscoelastic damping of the epoxy resin matrix, and the tan δ max and TA values decreased significantly. The TA value of the sample was lower than that of the pure epoxy resin sample. A large amount of PMN decreases the damping performance of the whole material, and the damping contribution of PMN is −46.41%.

Figure 7 
                  Damping characteristics of PMN/EP composites as a function of PMN content: (a) loss factor curve and (b) TA value and damping percentage of PMN/EP composites.
Figure 7

Damping characteristics of PMN/EP composites as a function of PMN content: (a) loss factor curve and (b) TA value and damping percentage of PMN/EP composites.

Table 5

Damping properties of PMN/EP composites

PMN (wt%) T g (°C) tan δ max TA ΔT( tan δ 0.3 ) (°C)
0 44 1.35 12.65 23.5
12 45 1.45 16.01 27
29 46 1.53 17.09 27
40 45 1.70 18.09 27.2
57 56 0.85 8.64 28.5

3.4 CB/PMN/EP composites

Figure 8 shows the SEM photos of CB/40 wt% PMN/EP composites with different CB content. It can be seen that at low CB content, CB and PMN are evenly dispersed in the epoxy resin matrix, and the boundary between filler and matrix is obvious. With the increase of carbon black content, the solution viscosity increases, and the boundary between filler and matrix becomes fuzzy. When CB content reaches 20 wt%, as shown in Figure 8c2 , there are many pores and folds between the filler and the matrix, the holes also increase, and the section is uneven, indicating that there is agglomeration between the filler and the matrix, and the binding force between the filler and the matrix decreases, which degrades the performance of the sample.

Figure 8 
                  Fracture surfaces of CB/40 wt% PMN/EP composites at different CB contents: (a) 4 wt%, (b) 10 wt%, and (c) 20 wt%.
Figure 8

Fracture surfaces of CB/40 wt% PMN/EP composites at different CB contents: (a) 4 wt%, (b) 10 wt%, and (c) 20 wt%.

Figure 9a shows the loss factor curve of CB/40 wt% PMN/EP composites. The influence of PMN and CB on the damping characteristics of composite materials has two aspects. On the one hand, the interfacial friction between filler and matrix effectively promotes the energy dissipation. On the other hand, the piezoelectric effect caused by external force on PMN leads to the enrichment of positive and negative charges on the crystal surface, and the electric energy will be dissipated through the conductive network. When CB content is less than 8 wt%, CB exists as an independent filler rather than a conductive network, and the bound charge generated on the piezoelectric ceramic surface cannot be converted into electrical energy. The friction energy dissipation between filler and matrix is the main factor. We can see in Table 6 that with the increase of CB content, tan δ max first increased and then decreased, TA value also increased and then decreased, and the temperature range continuously widened. When CB content reaches 8 wt%, tan δ max reaches 1.93, TA also reaches 27.58, damping contribution percentage of CB is 34.41%, and damping contribution percentage of PMN is 40.21%. In this case, a conductive network is gradually generated. The charge generated by PMN is converted into heat and dissipated in the form of heat through CB conductive network. PMN becomes the main factor of damping enhancement, and the damping performance is the best at this time. When CB content continues to increase, the viscosity of the mixture will increase, and the volume proportion of the matrix will decrease, which will lead to the agglomeration behavior of the filler and affect the damping performance of the material. In addition, the high content of CB will form a short circuit network, which will reduce the energy conversion efficiency. As a result, Tg will move to the high-temperature region, tan δ max decreases, and TA value decreases accordingly. The damping contribution ratio of PMN and CB also decreased.

Figure 9 
                  Damping characteristics of CB/40 wt% PMN/EP composites as a function of CB content: (a) loss factor curve, (b) TA value and damping percentage of CB/40 wt% PMN/EP composites.
Figure 9

Damping characteristics of CB/40 wt% PMN/EP composites as a function of CB content: (a) loss factor curve, (b) TA value and damping percentage of CB/40 wt% PMN/EP composites.

Table 6

Damping properties of CB/40 wt% PMN/EP composites

CB (wt%) T g (°C) tan δ max TA ΔT( tan δ 0.3 ) (°C)
0 45 1.70 18.09 27.2
2 44 1.73 23.13 28.8
4 44 1.79 25.95 32
8 44 1.93 27.58 31.6
10 49 1.85 23.47 33
20 54 1.39 21.52 35

As shown in Figure 10, when the content of CB reaches 8 wt%, the resistance value decreases significantly, which means that CB particles gradually contact with each other at 8 wt%, forming a conductive network. When CB content exceeds 8 wt%, the CB network will slowly form a short circuit, so that the electric energy generated by PMN piezoelectric effect cannot be dissipated effectively. Therefore, the piezoelectric effect of PMN weakens the enhancement of damping characteristics.

Figure 10 
                  Resistivity of CB/40 wt% PMN/EP composites with different CB content.
Figure 10

Resistivity of CB/40 wt% PMN/EP composites with different CB content.

4 Conclusions

In this study, piezoelectric damping composite material was prepared with polyether amine as a curing agent, which effectively improved the damping performance of the material. The quantitative analysis of damping performance based on the TA analysis method can provide a reference for the research of damping performance of related damping materials. Both tan δ max and damping temperature range affect the damping properties of materials. It is difficult to evaluate the overall damping properties of materials by using tan δ max as the only damping property index. Therefore, in this study, the TA value was selected to evaluate the damping performance. The effect of the maximum loss factor ( tan δ max) and effective damping temperature range on damping characteristics is clearly clarified by TA analysis. The synergistic effect of the piezoelectric phase and conductive phase is further studied.

  1. Polyether amine can effectively improve the damping performance of materials and reduce Tg, but it will affect the mechanical properties of materials. Therefore, the scope of use of materials should be considered comprehensively when used.

  2. When the carbon black content is 4 wt%, the maximum TA value of the composite material is 17.21, the maximum tan δ max is 1.67, the damping contribution percentage of CB is 26.82%, and the effective temperature range is expanded.

  3. When the content of PMN is 40 wt%, the maximum TA value of the composite is 18.09, the maximum tan δ max is 1.70, and the damping contribution percentage of PMN is 30.07%. When the PMN content exceeds 40 wt%, the increase in frictional energy dissipation is offset by the decrease of viscoelastic damping of the matrix, and the damping performance decreases.

  4. When the CB content of CB/40 wt% PMN/EP composites is less than 8 wt%, the interface effect of CB becomes the main factor to enhance damping. With the increase of CB content, the piezoelectric effect of PMN becomes the main factor of damping enhancement. When CB content reaches 8 wt%, the TA value reaches the maximum value of 27.58, tan δ max reaches the maximum value of 1.93, and the damping contribution percentage of PMN and CB is 40.21% and 34.41%, respectively. When the CB content continues to increase, the viscosity of the material will make the filler agglomerate, and the high CB content will form a short circuit network, which cannot effectively dissipate energy.

  1. Funding information: This work was supported by the Research Project of Wuhan University of Technology Chongqing Research Institute (ZD2021-02) and the Fundamental Research Funds for the Central Universities (2021-zy-001).

  2. Author contributions: Ming Chen: experimentation – sample preparation, sample testing; writing – original draft, charting, reviewing, and revising; Shuang Cheng: writing – original draft, charting, reviewing, and revising; Yanbing Wang: writing – reviewing, revising, and advising on articles; Zhixiong Huang: writing – reviewing, revising, and advising on articles.

  3. Conflict of interest: The authors state no conflict of interest.

  4. Data availability statement: The data sets generated during and/or analyzed during the current study are available from the corresponding author on reasonable request.

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Received: 2023-02-16
Revised: 2023-05-12
Accepted: 2023-05-05
Published Online: 2023-07-12

© 2023 the author(s), published by De Gruyter

This work is licensed under the Creative Commons Attribution 4.0 International License.

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