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Synthesis and properties of PI composite films using carbon quantum dots as fillers

  • Yuyin Zhang , Hongtao Guo , Shaohua Jiang EMAIL logo , Zhaoyu Hu , Guojun Zha , Kunming Liu and Haoqing Hou EMAIL logo
Published/Copyright: July 12, 2022
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e-Polymers
From the journal e-Polymers Volume 22 Issue 1

Abstract

Polyimide (PI) is widely used in the field of microelectronics because of its excellent thermal, mechanical, optical, and electrical properties. With the development of electronics and information industry, PI as a dielectric material needs to possess low dielectric loss. PI/carbon quantum dots (PI/CQDs) composite films with low dielectric loss were prepared by introducing CQDs into PI matrix. At 25°C and 1 kHz voltage, the dielectric loss of pure PI film is about 0.0057. The dielectric loss of PI/CQDs composite film is about 0.0018, which is about 68% lower than that of pure PI film. The dielectric loss of PI/CQD composite film is greatly reduced while the mechanical properties and thermal properties of PI/CQDs composite film roughly remain unchanged. Due to the cross-linking structure formed between CQDs and PI molecular chain, the relative movement of PI molecular chain is hindered.

Keywords: PI; CQDs; composites; dielectric properties; mechanical properties

1 Introduction

Polymide (PI) is a kind of high-performance polymer with excellent thermal property and mechanical property (1). The PI can be prepared from the polycondensation from an equal molar ratio of dianhydride and diamine followed by imidization. Its molecular chain usually contains a very stable imide ring and aromatic heterocyclic structure (2). PI was first synthesized in 1908 and first commercialized in 1961 (3). Later, PI gradually is applied in paint, adhesives, foam, fiber, and other commodities. There are many methods to synthesize PI, such as one-step, two-step, three-step, vapor deposition, and so on (4,5). This article adopts a two-step method to synthesize PI. Today, PI has been widely used in microelectronics, national defense, aerospace, energy, and electronic and electric industries.

With the development of the electronic information industry, dielectric materials are required to possess the characteristics such as high density, high stability, and large capacity. We need to obtain a film with high dielectric constant, low dielectric loss, and soft and easy processing. PI is favored for its excellent mechanical and thermal properties since the dielectric properties of PI are relatively poor. Therefore, it is necessary to improve the dielectric properties of PI films (6,7,8). The dielectric permittivity of pure PI can be changed by changing the chemical structure of the PI molecular chain while the influence is very small (9). Moreover, the process of synthesizing new monomers is complicated, and the cost is high. Therefore, it is an effective method to synthesize PI matrix composites by adding other particles to the PI matrix. As high dielectric constant fillers, BaTiO3 (10), CCTO (11,12), TiO2 (13), and other ceramic fillers can be added to PI matrix (14,15,16,17). The dielectric permittivity increases, meanwhile, the dielectric loss also increases correspondingly, and its mechanical property will achieve a large loss (14,15,16). Conductive fillers, such as graphene (18), CNTs (5,19), carbon spheres (20), porous carbon (21), silver (22,23), Mxenes (24), and other conductive fillers can be added to the PI matrix, the dielectric permittivity will increase greatly till approaching to the percolation threshold, but the enhancement on mechanical properties is not obviously (2,25–29). All organic high dielectric materials were prepared by mixing two kinds of organic materials with different dielectric properties (7,30,31). The advantage of this method has of good dispersion. The disadvantage is that the dielectric properties of the composite film can only be limited to two kinds of organic matter (32–37).

Carbon quantum dots (CQDs) was discovered in 2004, which is a zero-dimensional carbon nanomaterial, the micro particle size of CQDs is less than 10 nm, and the surface is rich in the amino, carboxyl, hydroxyl, and other organic functional groups, and low toxicity, high stability, easy functionalization, precursor variety, renewable (38–41). There are many synthetic methods of CQDs, which can be roughly divided into bottom-up method and top-down method (42). Bottom-up method includes electrochemical method, microwave method, and hydrothermal solvothermal method. Top-down methods include laser ablation, arc discharge, chemical etching, and so on. It has been reported that CQDs can be used as compatibilizers or fillers for compatibilization of incompatible polymer blends (43). CQDs are also reported to adjust the band structure of PI aerogel and promoted the generation and separation of photogenerated electrons and holes (44). In another report, as one kind of CQDs, graphene quantum dots were added to PI to form composite membranes for solvent-resistant nanofiltration (45). These reports indicated that the CQDs have a good dispersibility with the PI. However, these reports did not provide an investigation of the dielectric properties of CQDs/PI composites.

In this work, the PI was synthesized by a two-step method with the first synthesis of polyamic acid (PAA) and then thermal imidization. The PI/CQD composite films with high dielectric properties were prepared by introducing CQDs into the PI matrix. The dielectric loss of pure PI film is about 0.0057. The dielectric loss of PI/CQD composite film can reach 0.0018, which is about 68% lower than pure PI films. Under the premise of relatively stable dielectric permittivity and mechanical property and thermal property, dielectric loss is reduced.

2 Experimental

2.1 Materials

3,3′,4,4′-Biphenyltetracarboxylic dianhydride (BPDA, 99.00%), 4,4′-oxydianiline (ODA, 99.0%), N,N-dimethylacetamide (DMAc, AR), urea (CON2H4, 99.50%), citric acid (C6H8O7, AR), deionized water (H2O, σ < 0.056 μS·cm−1), and anhydrous ethanol (C2H5OH, AR).

2.2 Synthesis of carbon quantum dots (CQDs)

6 g Citric acid, 3 g urea, and 60 mL deionized water were added to a 100 mL reactor, and the mixture solution was stirred evenly (46,47). Then, the mixture solution was reacted at 165°C for 4 h. After cooling to room temperature, the reaction solution was transferred to 150 mL anhydrous ethanol, which was evenly mixed and centrifuged at a speed of 10,000 rpm. After removing the turbidity liquid from the upper layer, the precipitation was mixed evenly with anhydrous ethanol and centrifuged again and then repeated many times until the liquid from the upper layer is clear. The precipitate was freeze-dried for 12 h to obtain CQDs. The production yield of the CQDs is about 57%.

2.3 Synthesis of polyimide/carbon quantum dots (PI/CQDs) composite films

5.95 g BPDA, 4.05 g ODA, and 90.00 g DMAc were added into a three-neck flask, and the mixture solution was stirred at −5°C for 12 h to obtain polyamide acid solution (PAA, ω = 10%) (3). PAA was diluted with DMAc into 3 wt%, and then CQDs was added to the PAA solution in proportion. The mixed dispersion is stirred evenly to form a homogenous dispersion and coated on the glass plate. Then, the samples were dried in the oven at 100°C for 4 h to evaporate the solvent. Finally, the glass plates are placed at 335°C for 20 min to obtain PI/CQDs composite films (Figure 1).

Figure 1 Schematic diagram of the preparations of PI/CQDs.
Figure 1

Schematic diagram of the preparations of PI/CQDs.

2.4 Characterizations

High-resolution transmission electron microscope (TEM; JEM 2100) was used to observe the microscopic morphology of CQDs. Fourier transform infrared spectrometer (FT-IR; TENSOR-27) was used to characterize the chemical bond structure. LCR precision digital bridge (KEYSIGHT-E4980A) was used to characterize the dielectric properties of materials. Microcomputer controlled electronic universal testing machine (SGCIS 09001) was used to characterize the mechanical properties of materials. Thermogravimetric thermal analyzer (TGA-55) was used to characterize the thermal properties of materials (test temperature range, 50–800°C; heating rate, 10°C·min−1; the work environment, N2). Dynamic thermomechanical analyzer (DMA; Perkin–Elmer Diamond) was used to characterize the glass transition temperature of composite films (test temperature range: 50–350°C, heating rate: 10°C·min−1, the work environment: N2).

3 Results and discussion

The morphology of CQDs is characterized using TEM. Figure 2 depicts that CQDs are distributed in nano-forms with a particle size of about 4.5 nm. HRTEM images show that CQDs have obvious lattice fringes with a lattice gap of 0.21 nm, which proves that CQDs possess a carbon core structure similar to graphite carbon (100).

Figure 2 TEM images of the CQDs.
Figure 2

TEM images of the CQDs.

The preparation of PI requires imidization at 335°C. To investigate the stability of CQDs at high temperatures, we annealed CQDs at 200°C, 250°C, and 335°C, respectively, and marked the samples as CQDs T200, CQDs T250, and CQDs T335. CQDs under different conditions were analyzed using FT-IR (Figure 3). The annealed CQDs contained carboxyl group (1,706 cm−1), hydroxyl, and amino group (3,437 cm−1). The absorption peaks of functional groups of CQDs treated by annealing at different temperatures remained roughly the same, indicating that the structure of CQDs remained stable in the process of imidization.

Figure 3 FT-IR image of CQDs.
Figure 3

FT-IR image of CQDs.

The imidization degree of PAA has a great influence on the mechanical and dielectric properties of PI/CQD composite films. The chemical structures of PAA, PI, PI/CQD composite films were characterized using FT-IR technique. Figure 4a depicts that the stretching vibration absorption peaks of carboxyl group (1,709 cm−1) and amide group (1,661 cm−1) in PAA are transformed into asymmetric stretching vibration peak (1,776 cm−1) and symmetrical stretching vibration peak (1,717 cm−1) after high-temperature imidization, and the FT-IR spectra of PI possessed the bending vibration absorption peak (745 cm−1) of imide structure. As the chemical bonds between CQDs and PI produce bond cooperation, the position of the functional group of CQDs is offset. As shown in the following SEM images (Figure 4b and c), the CQDs were well dispersed in PI, where no obvious aggregation of CQDs in PI was observed.

Figure 4 (a) FT-IR spectra of PAA, PI, PI/CQDs, (b) SEM image of the PI fracture surface, and (c) SEM image of the PI/CQD fracture surface.
Figure 4

(a) FT-IR spectra of PAA, PI, PI/CQDs, (b) SEM image of the PI fracture surface, and (c) SEM image of the PI/CQD fracture surface.

Figure 5 shows the dielectric properties of PI/CQD composite films. The dielectric permittivity of pure PI film is about 3.4, and dielectric loss is about 0.0057. The dielectric permittivity of PI/CQD composite film can reach more than 4.5 at CQDs account for 10%, which is about 32% higher than pure PI film, and higher than the reported fluorinated PI (48). The dielectric loss is about 0.0018 at CQDs account for 4%, which is about 68% lower than pure PI film and other PI-related materials, such as PI–Yb complex (49), PI/CCTO@Ag composites (12), and PI-clay (50).

Figure 5 Dielectric property of PI/CQD composites: (a) dielectric permittivity at different frequencies, (b) dielectric loss at different frequencies, (c) dielectric property on the weight fraction at 1 kHz, and (d) the Weibull distribution of dielectric breakdown strength.
Figure 5

Dielectric property of PI/CQD composites: (a) dielectric permittivity at different frequencies, (b) dielectric loss at different frequencies, (c) dielectric property on the weight fraction at 1 kHz, and (d) the Weibull distribution of dielectric breakdown strength.

When the amount of CQDs is relatively low, it can quickly adapt to the change of external electric field through the deviation of its own electron cloud, so the energy loss is diminished. In addition, the bond cooperation between CQDs and PI molecular chain prevents the relative movement of the PI molecular chain, resulting in the reduction of dielectric loss. When the proportion of CQDs is high, there will be an obvious phase interface between CQDs and PI chain segment, and interface polarization will occur under the action of the electric field, leading to large energy loss.

Breakdown strength is a physical quantity that is used to characterize the maximum electric field strength of the material, mainly determined by its own physical and chemical properties. The two-parameter Weibull distribution was used to analyze the breakdown strength data and related formulas are as follows (Eqs. 1–3):

(1) P = 1 − exp ⁡ [ − E E 0 β ]

(2) P i = i − 0 . 44 n + 0 . 25 × 100 %

(3) log [ − In ( 1 − P ) ] = β log   E − β log   E 0

where P is the cumulative probability density of electrical breakdown of the sample, β is the shape factor, E 0 is the scaling factor, i is the result of ordering E from smallest to largest, and N is the number of samples (51,52). Figure 5d shows the linear fitting results of PI/CQD composite films and the breakdown strength of PI/CQD composite films calculated at 63.2% failure possibility. As shown in Table 1, with the increase in CQD content, the breakdown strength first increases and then decreases, which is consistent with the changing trend of dielectric loss, confirming the above statement. When the content of CQDs is 4%, the breakdown strength of PI/CQD composite film reaches the maximum 222.46 kV·mm−1. When the content of CQDs is 10%, the breakdown strength of PI/CQD composite film is reduced to 138.04 kV·mm−1.

Table 1

Weibull analysis of breakdown strength

Weight fraction of CQDs (%) Shape parameter Weibull E break (kV·mm−1)
0 14.17 168.66
2 12.61 217.27
3 10.88 222.47
4 11.25 226.46
5 13.47 224.35
6 14.96 186.21
8 11.64 152.05
10 14.05 138.04

Mechanical properties are an important consideration for high dielectric polymer matrix composites. Figure 6 shows that with the increase of CQD content, the mechanical properties of PI/CQD composite films decrease slightly. The tensile strength of pure PI film is 209 kPa, and when CQD content is 10%, the tensile strength decreases to 150 kPa. The elongation at break of pure PI film is 12.8%, which decreases to 6.2% when CQD content is 10%. Due to the phenomenon of uneven distribution occurring when the content of CQDs is high, part of the mechanical property of PI/CQD composite film is lost.

Figure 6 Mechanical properties of PI/CQD composite films: (a) stress–strain curve, (b) the variation trend of stress and strain with CQD content.
Figure 6

Mechanical properties of PI/CQD composite films: (a) stress–strain curve, (b) the variation trend of stress and strain with CQD content.

Figure 7 shows the relevant thermal properties of PI/CQD composite films. Figure 7a and b shows TGA analysis of PI/CQD composite membrane. The T5% of pure PI is 556°C, and the composite films decrease slightly as the fraction of CQDs increases. When the content of CQDs is 10%, the T5% is 535°C. At 800°C, the residual rate of PI/CQDs decreases with the increase in CQD content. The residual rate of pure PI is 59.7%, and when the fraction of CQDs is 10%, the residual rate of PI/CQD composite films is 51.2%. The heat resistance of PI/CQD composite film decreases compared with that of PI. Because CQDs will degrade at higher temperatures, the heat resistance of PI/CQD composite film will decrease.

Figure 7 Thermal properties of PI/CQD composite films: (a) TGA analysis of PI/CQD composite films, (b) residual rate of PI/CQD composite films at different temperatures, and (c) DMA analysis of PI/CQD composite films.
Figure 7

Thermal properties of PI/CQD composite films: (a) TGA analysis of PI/CQD composite films, (b) residual rate of PI/CQD composite films at different temperatures, and (c) DMA analysis of PI/CQD composite films.

DMA can measure the relationship between the mechanical loss factor and temperature of the polymer under vibration load. Figure 7c is the DMA analysis of PI/CQD composite films. As the temperature increases, the glass transition temperature of PI/CQD composite film increases slightly. The loss factor increased obviously. The glass transition temperature increased from 291°C to 303°C by 4.12%. The loss factor was increased from 0.25 to 0.38 by 52%. It can be seen that the addition of CQDs reduces the heat resistance of PI film. Because the crosslinked structure between CQDs and PI can inhibit the vibration of the PI molecular chain, the glass transition temperature of PI/CQD composite film increases slightly. The introduction of CQDs reduces the heat resistance of PI, so the loss factor of PI/CQD composite film increases.

4 Conclusion

In this work, PI/CQDs composite films are prepared by introducing CQDs into the PI matrix. Through characterizations, it is found that compared with pure PI film, PI/CQD composite film possesses lower dielectric losses. When the content of CQDs is 4%, the dielectric loss of PI/CQDs composite film is the lowest, which is 0.0018 at 1 kHz voltage, reducing by 68%. Under the premise of relatively stable dielectric permittivity, and good mechanical and thermal properties, dielectric loss is reduced. The formation of the cross-linked structure between CQDs and PI molecules hinders the relative movement of the PI molecular chain and could be attributed to the dielectric loss of the PI/CQD composite film.

  1. Funding information: This work is financially supported by the Natural Science Foundation of China (52173006, 21975111), and the Jiangxi Provincial Natural Science Foundation (No. 20202BABL213007, No. 20212BAB203013).

  2. Author contributions: Yuyin Zhang: writing – original draft, writing – review and editing, formal analysis; methodology, investigation; Hongtao Guo: writing – review and editing, visualization; Haoqing Hou: methodology, formal analysis, project administration; Shaohua Jiang: analysis, project administration; Guojun Zha: visualization, project administration; Kunming Liu: visualization, resources; Zhaoyu Hu: methodology.

  3. Conflict of interest: One of the corresponding authors of this article (Shaohua Jiang) is an Associate Editor of e-Polymers.

  4. Data availability statement: The data and the experimental details during the current study are available from the corresponding author.

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Received: 2022-04-12
Revised: 2022-05-18
Accepted: 2022-05-23
Published Online: 2022-07-12

© 2022 Yuyin Zhang et al., published by De Gruyter

This work is licensed under the Creative Commons Attribution 4.0 International License.

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  7. Fabrication of flexible conductive silk fibroin/polythiophene membrane and its properties
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https://doi.org/10.1515/epoly-2022-0054
Keywords for this article
PI; CQDs; composites; dielectric properties; mechanical properties
Creative Commons
BY 4.0

Articles in the same Issue

  1. Research Articles
  2. The effect of isothermal crystallization on mechanical properties of poly(ethylene 2,5-furandicarboxylate)
  3. The effect of different structural designs on impact resistance to carbon fiber foam sandwich structures
  4. Hyper-crosslinked polymers with controlled multiscale porosity for effective removal of benzene from cigarette smoke
  5. The HDPE composites reinforced with waste hybrid PET/cotton fibers modified with the synthesized modifier
  6. Effect of polyurethane/polyvinyl alcohol coating on mechanical properties of polyester harness cord
  7. Fabrication of flexible conductive silk fibroin/polythiophene membrane and its properties
  8. Development, characterization, and in vitro evaluation of adhesive fibrous mat for mucosal propranolol delivery
  9. Fused deposition modeling of polypropylene-aluminium silicate dihydrate microcomposites
  10. Preparation of highly water-resistant wood adhesives using ECH as a crosslinking agent
  11. Chitosan-based antioxidant films incorporated with root extract of Aralia continentalis Kitagawa for active food packaging applications
  12. Molecular dynamics simulation of nonisothermal crystallization of a single polyethylene chain and short polyethylene chains based on OPLS force field
  13. Synthesis and properties of polyurethane acrylate oligomer based on polycaprolactone diol
  14. Preparation and electroactuation of water-based polyurethane-based polyaniline conductive composites
  15. Rapeseed oil gallate-amide-urethane coating material: Synthesis and evaluation of coating properties
  16. Synthesis and properties of tetrazole-containing polyelectrolytes based on chitosan, starch, and arabinogalactan
  17. Preparation and properties of natural rubber composite with CoFe2O4-immobilized biomass carbon
  18. A lightweight polyurethane-carbon microsphere composite foam for electromagnetic shielding
  19. Effects of chitosan and Tween 80 addition on the properties of nanofiber mat through the electrospinning
  20. Effects of grafting and long-chain branching structures on rheological behavior, crystallization properties, foaming performance, and mechanical properties of polyamide 6
  21. Study on the interfacial interaction between ammonium perchlorate and hydroxyl-terminated polybutadiene in solid propellants by molecular dynamics simulation
  22. Study on the self-assembly of aromatic antimicrobial peptides based on different PAF26 peptide sequences
  23. Effects of high polyamic acid content and curing process on properties of epoxy resins
  24. Experiment and analysis of mechanical properties of carbon fiber composite laminates under impact compression
  25. A machine learning investigation of low-density polylactide batch foams
  26. A comparison study of hyaluronic acid hydrogel exquisite micropatterns with photolithography and light-cured inkjet printing methods
  27. Multifunctional nanoparticles for targeted delivery of apoptin plasmid in cancer treatment
  28. Thermal stability, mechanical, and optical properties of novel RTV silicone rubbers using octa(dimethylethoxysiloxy)-POSS as a cross-linker
  29. Preparation and applications of hydrophilic quaternary ammonium salt type polymeric antistatic agents
  30. Coefficient of thermal expansion and mechanical properties of modified fiber-reinforced boron phenolic composites
  31. Synergistic effects of PEG middle-blocks and talcum on crystallizability and thermomechanical properties of flexible PLLA-b-PEG-b-PLLA bioplastic
  32. A poly(amidoxime)-modified MOF macroporous membrane for high-efficient uranium extraction from seawater
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  35. The role of natural rubber endogenous proteins in promoting the formation of vulcanization networks
  36. The impact of viscoelastic nanofluids on the oil droplet remobilization in porous media: An experimental approach
  37. A wood-mimetic porous MXene/gelatin hydrogel for electric field/sunlight bi-enhanced uranium adsorption
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  50. Study on composting and seawater degradation properties of diethylene glycol-modified poly(butylene succinate) copolyesters
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  52. Facile synthesis of a triazine-based porous organic polymer containing thiophene units for effective loading and releasing of temozolomide
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  54. Preparation and properties of nano-TiO2-modified photosensitive materials for 3D printing
  55. Mechanical properties and thermal analysis of graphene nanoplatelets reinforced polyimine composites
  56. Preparation and in vitro biocompatibility of PBAT and chitosan composites for novel biodegradable cardiac occluders
  57. Fabrication of biodegradable nanofibers via melt extrusion of immiscible blends
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  68. Zeolitic imidazolate frameworks dispersed in waterborne epoxy resin to improve the anticorrosion performance of the coatings
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  77. Thermal and mechanical properties of poly(lactic acid)/poly(butylene adipate-co-terephthalate)/calcium carbonate composite with single continuous morphology
  78. Review Articles
  79. The use of chitosan as a skin-regeneration agent in burns injuries: A review
  80. State of the art of geopolymers: A review
  81. Mechanical, thermal, and tribological characterization of bio-polymeric composites: A comprehensive review
  82. The influence of ionic liquid pretreatment on the physicomechanical properties of polymer biocomposites: A mini-review
  83. Influence of filler material on properties of fiber-reinforced polymer composites: A review
  84. Rapid Communications
  85. Pressure-induced flow processing behind the superior mechanical properties and heat-resistance performance of poly(butylene succinate)
  86. RAFT polymerization-induced self-assembly of semifluorinated liquid-crystalline block copolymers
  87. RAFT polymerization-induced self-assembly of poly(ionic liquids) in ethanol
  88. Topical Issue: Recent advances in smart polymers and their composites: Fundamentals and applications (Guest Editors: Shaohua Jiang and Chunxin Ma)
  89. Fabrication of PANI-modified PVDF nanofibrous yarn for pH sensor
  90. Shape memory polymer/graphene nanocomposites: State-of-the-art
  91. Recent advances in dynamic covalent bond-based shape memory polymers
  92. Construction of esterase-responsive hyperbranched polyprodrug micelles and their antitumor activity in vitro
  93. Regenerable bacterial killing–releasing ultrathin smart hydrogel surfaces modified with zwitterionic polymer brushes
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