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Review of nano-phase effects in high strength and conductivity copper alloys

  • Xiaohui Zhang , Yi Zhang EMAIL logo , Baohong Tian EMAIL logo , Kexing Song EMAIL logo , Ping Liu EMAIL logo , Yanlin Jia EMAIL logo , Xiaohong Chen , Junchao An , Zhuan Zhao , Yong Liu , Alex A. Volinsky , Xu Li and Ting Yin
Published/Copyright: December 4, 2019
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Nanotechnology Reviews
From the journal Nanotechnology Reviews Volume 8 Issue 1

Abstract

Copper alloys and copper matrix composites have been attracting a lot of attention lately. Their composition design, preparation, and processing directly affect the final performance. In this review, several typical copper alloys, such as Cu-Fe-P, Cu-Ni-Si, and Cu-Cr-Zr are analyzed. The deformation mechanisms, microstructure evolution, and dynamic recrystallization behavior are summarized. In addition, dispersion strengthened copper matrix composites and graphene reinforced copper matrix composites are reviewed.

1 Introduction

Owing to its high electrical and thermal conductivity, along with remarkable processing performance, copper is widely used in the aerospace and electronics industries, including high-speed rail contact wires and electrical contact materials [1, 2, 3], as shown in Figure 1. However, the strength of pure copper is low at room and high temperatures. Although the strength increases significantly after cold processing, the elongation is low and the obtained strength is reduced during the annealing process, which seriously restricts the applications of pure copper. Fortunately, copper alloys and copper-based composites prepared through various strengthening mechanisms not only have high electrical and thermal conductivity, but also high strength and plasticity, along with good processing performance [4, 5, 6, 7, 8, 9]. Therefore, high strength and high conductivity copper alloys and copper matrix composites have drawn more attention in the past few years.

Figure 1 The emerging applications of copper alloys.
Figure 1

The emerging applications of copper alloys.

The methods of strengthening copper alloys include solution strengthening, aging precipitation strengthening and dispersion strengthening. For solution strengthening some alloying elements are dissolved in the copper matrix, which results in lattice distortion and enhances the strength of the alloy by hindering dislocations movement. However, due to the scattering effect of electrons on the solute atoms, the electrical conductivity of the alloy can be severely reduced, thus solution strengthening is often used in conjunction with other strengthening methods [10, 11]. Aging strengthening refers to the addition of elements in the copper matrix whose solid solubility changes greatly at high and room temperatures, such as Cr [12, 13, 14], Zr [15, 16], Ni [17, 18], Mg [11, 19], Nb [20, 21] etc. After solution and aging treatment, the secondary phase is formed, thereby improving the strength by preventing dislocations and grain boundaries movement. Krishna et al. [22] revealed that the increase of hardness and conductivity during aging was mainly attributed to the formation of fine Ni2Si and Co2Si nano-precipitates in the Cu-Ni-Si-Co alloy. Zhang et al. [23] investigated the microstructure evolution of the Cu-Ni-Si-P alloy during aging and found that after aging at 450∘C for 48 h, nano δ-Ni2Si phase precipitated. The addition of P could inhibit the coarsening of the precipitated phase. Huang et al. [24] analyzed the microstructure of the Cu-0.31Cr-0.21Zr alloy and concluded that the precipitated phase was Cu51Zr14. Cheng et al. [25] found that good comprehensive performance of the Cu-0.6Cr-0.15Zr-0.05Mg-0.02Si alloy can be obtained after 80% deformation followed by aging at 480∘C for 1 h. Consequently, the hardness and electrical conductivity reached 152 HV and 85.5% IACS, respectively. Tian et al. [26] reported that the electrical conductivity of the Cu-1.0Zr alloy was 80% IACS and the microhardness reached 155 HV after solution treatment at 900∘C for 1 h and aging at 500∘C for 1 h. Furthermore, after aging at 450∘C for 6 h, a large amount of the Cu10Zr7 phase precipitated in the copper matrix. Dong et al. [27] established that the resistance to softening of the Cu-0.7Fe-0.15P alloy was improved after aging due to the precipitation of the Fe2P phase. In addition to doping common alloying elements, many researchers have tried to add rare earth elements, such as Ce and Y, to obtain good properties. Wang et al. [28] investigated the effects of Ce and Y on the hot deformation of the Cu-Mg alloy and reported that rare earth elements can not only refine grains, but also improve the flow stress and thermal activation energy of the alloy. Zhang et al. [29] reported that Y can increase the activation energy during the hot deformation of the Cu-Zr alloy, affecting the dynamic recrystallization behavior. Also, Ce can refine the grain of the Cu-0.2Zr alloy and enhance the hot processing stability.

With the rapid development of the high-tech industries, the performance of the traditional copper alloys cannot satisfy the modern requirements. In recent years, some researchers started to gradually pay attention to the copper matrix composites, including oxide, carbide, nitride, boride nano-particles dispersion strengthening copper matrix composites [30, 31, 32]. The dispersion strengthening composites can be divided into in-situ reinforced and ex-situ reinforced metal matrix composites. Due to the insitu formation of the reinforcement phase through metallurgical reactions, chemical catalytic transformations, and plastic deformation, the in-situ reinforcement can enhance the chemical stability and interface compatibility between the reinforcement and the matrix, thus improving the interface bonding and mechanical properties [33, 34, 35]. For instance, nano-Al2O3 and nano-Cr2O3 dispersion strengthened copper alloys fabricated by internal oxidation belong to the in-situ reinforced metal matrix composites. Furthermore, the scattering effect of electrons on solute atoms in the copper matrix is greater than that caused by the secondary phase, so dispersion strengthened copper matrix composites can enhance the material strength while ensuring the electrical conductivity. Bera et al. [36] reported that the hardness and wear resistance of the Cu-10Cr-3Ag electrical contact sample increased significantly with the addition of nano-Al2O3 particles. Zhang et al. [37] fabricated the Al2O3-Cu/35W5Cr composite by the vacuum hot-pressing sintering and internal oxidation method. Due to the hindering effect on the dislocations caused by the nano-Al2O3 particles, the composite was still in the dynamic recovery stage under the hot deformation condition of 850∘C and 0.01 s−1 strain rate.

Conventionally, hot processing is often carried out to improve the properties of copper alloys. Therefore, the research of the hot processing of copper alloys plays an important role in the improvement of their properties. In this study, the deformation mechanisms, microstructure evolution and its effects on the alloys’ properties, along with dynamic recrystallization and aging precipitation mechanisms of several typical copper alloys and copper-based composites during the thermal processing are reviewed.

2 Nano-phase aging precipitation and thermal deformation

2.1 Cu-Fe-P alloy

Cu-Fe-P alloy is widely used as the lead frame material due to its excellent properties. Its precipitates mainly include Fe, Fe2P and Fe3P, and the type of precipitation depends on the ratio of Fe and P content. In general, other alloying elements can be added to further improve the comprehensive properties of the alloy. Xiao et al. [38] reported the aging precipitation behavior of the Cu-2.3Fe-0.03P alloy. It was demonstrated that the γ-Fe and Fe3P phases precipitated in the copper matrix. Wang et al. [39] also found that the Fe3P phase precipitated during aging of the Cu-0.88Fe-0.24P alloy. In addition, Dong et al. [40] have demonstrated that cold rolling can transform the precipitates from the γ-Fe phase to α-Fe and re-dissolve the fine precipitates into the Cu matrix. Guo et al. [41] found that the doped Re facilitated the precipitation of the γ-Fe and Fe3P phases. In our previous work, the precipitated phase of the Cu-2.3Fe-0.1Zn-0.1P (C194) alloy was investigated using transmission electron microscopy (TEM). The microstructure is shown in Figure 2. Three different kinds of nanoparticles are in the matrix seen in Figure 2(a). First, coarse particles were formed with ellipsoidal shape. Second, the volume of the spherical particles increased to a quarter of the large particles. Third, many small particles dispersed unevenly in the matrix. Figure 2(b) shows the selected electron diffraction pattern (SADP) of the ellipsoid particle. It was demonstrated that the large particle was γ-Fe. Furthermore, the selected electron diffraction pattern in Figure 2(c) and Figure 2(d) confirmed that the α-Fe and Fe3P nanoparticles precipitated in the matrix. They are corresponding to the “II” and “III” types in Figure 2(a). Furthermore, Cao et al. [42] reported that fine γ-Fe and coarse Fe3P particles were formed in the as-cast Cu-Fe-P alloy. However, the fine Fe particles were dispersed in the interior of the grains due to the process of equal channel angular pressing (ECAP), and the Fe3P particles pinned the grain boundaries.

Figure 2 TEM images of the Cu-2.3Fe-0.1Zn-0.1P alloy: (a, c, d) TEM images; (b) SADP image of (a).
Figure 2

TEM images of the Cu-2.3Fe-0.1Zn-0.1P alloy: (a, c, d) TEM images; (b) SADP image of (a).

2.2 Cu-Ni-Si alloy

Lead frame copper alloy, as the current carrier of the integrated circuits, is a crucial basic material used in the electronics industry. The strength and conductivity of the lead frame material mainly depend on the precipitation strengthening [43]. In general, the strengthening effect depends on the following aspects: the ultimate solubility of alloying elements in copper, the solubility at room temperature, the number and size of precipitates and other factors.

Cu-Ni-Si alloy is widely used as the lead frame material. Ni, Si, and other alloying elements can precipitate into the strengthening phase through aging. Hence, the alloy has high strength and hardness, while the electrical conductivity cannot drop sharply. Wang et al. [44] demonstrated that the Cr3Si and Ni2SiZr intermediate compounds were formed in the Cu-Ni-Si-Cr-Zr alloy after aging and confirmed that the δ-Ni2Si phase strengthened the copper matrix through the Orowan mechanism. Hu et al. [45] investigated the precipitation and microstructure evolution behavior of the Cu-Ni-Si alloy during hot deformation by means of the high-resolution transmission electron microscopy and first principles calculations and confirmed the precipitation of the δ-Ni2Si phase. However, in the two stages before and after aging, the precipitated δ1 and δ2 phases exist, and have different orientations with the copper substrate. Jia et al. [46] also confirmed the δ-Ni2Si phase during the aging process of the Cu-3.0Ni-0.72Si alloy, while a layer of metastable δ′-(Cu, Ni)2Si existed around the core. Xiao et al. [47] showed that the spinodal decomposition of the precipitated phase was inhibited by doping Co into the Cu-Ni-Si alloy, thus improving the microhardness and conductivity of the alloy. Zhao et al. [48] also studied the effects of Co on the microstructure and properties of the Cu-Ni-Si alloy during aging. In addition to the common δ-Ni2Si and β-Ni3Si precipitates, the (Ni, Co)2Si phase was also found, shown in Figure 3. Lei et al. [49] systematically investigated the aging precipitation behavior of the Cu-6.0Ni-1.0Si-0.5Al-0.15Mg-0.1Cr alloy and confirmed that the Ni2Si/γ′-Ni3Al and β-Ni3Si precipitation phases cause strengthening effects.

Figure 3 (a) The dark field TEM image of the (Ni, Co)2Si phase and (b) Selected area electron diffraction pattern and indexing.
Figure 3

(a) The dark field TEM image of the (Ni, Co)2Si phase and (b) Selected area electron diffraction pattern and indexing.

In the present work, the aging precipitation behavior of the Cu-1.5Ni-0.34 Si alloy was investigated at 450∘C, and the precipitation coarsening process was analyzed by TEM, as shown in Figure 4.

Figure 4 TEM images of the Cu-1.5Ni-0.34Si alloy aged at 450∘C for different time: (a, b) 15 min; (c, d) 4 h; (e, f) 16 h; (g, h) 500 h.
Figure 4

TEM images of the Cu-1.5Ni-0.34Si alloy aged at 450∘C for different time: (a, b) 15 min; (c, d) 4 h; (e, f) 16 h; (g, h) 500 h.

Figure 4 is similar to the modulated structure at the early aging stage, and then the nanometer precipitation phase gradually appears. Furthermore, the nanoparticles gradually coarsened with the aging time. The size of the precipitates is about 5 nm underaged, 10 nm of the peak aged, and 30 nm overaged. The selected area electron diffraction pattern is shown in Figure 5. In Figure 5 the spinodal decomposition cannot be observed from the SADPs. In addition, the diffraction spots intensified with the aging process. However, the precipitates remained unaltered. Consequently, Figure 6 shows the comprehensive properties of the Cu-Ni-Si alloy doped with different types of alloying elements.

Figure 5 Selected area electron diffraction patterns of the Cu-1.5Ni-0.34Si alloy aged at 450∘C for different time: (a) 0 min; (b) 15 min; (c) 4 h; (d) 16 h; (e, f) 500 h.
Figure 5

Selected area electron diffraction patterns of the Cu-1.5Ni-0.34Si alloy aged at 450∘C for different time: (a) 0 min; (b) 15 min; (c) 4 h; (d) 16 h; (e, f) 500 h.

Figure 6 The comprehensive properties of the Cu-Ni-Si alloy doped with different types of alloy elements.
Figure 6

The comprehensive properties of the Cu-Ni-Si alloy doped with different types of alloy elements.

The aging strengthening and deformation strengthening are often combined in the strengthening treatment of copper alloys. Plastic deformation is the primary method of preparation, processing, and shaping copper alloys. At high temperature copper alloys have low plastic resistance, strong atomic activity, and fast diffusion, which are beneficial for the microstructure improvement and shape forming when accompanied by complete recrystallization. The scientific and practical formulation of hot deformation parameters for copper alloys is of great significance to their quality and performance. Zhang et al. [55] studied the hot deformation behavior of the Cu-2Ni-0.5Si alloy at 600-800∘C and 0.01-5 s−1 strain rate and constructed the constitutive equation (1) to describe the relationship between the flow stress, deformation temperature and strain rate. Furthermore, it has been calculated that the hot deformation activation energy of the alloy is 245.4 kJ /mol.

(1)ε˙=e28.47[sinh(0.013σ)]5.52exp−245.4RT

In addition, after doping 0.03 wt.% P into the Cu-2Ni-0.5Si alloy under the same deformation conditions, Zhang et al. [56] studied the influence of P on the hot deformation activation energy of the alloy. The hot compression constitutive equation (2) of the alloy was constructed. It has been calculated that the thermal deformation activation energy of the Cu-2Ni-0.5Si-0.03P alloy was 485.6 kJ/mol.

(2)ε˙=4.62×1023[sinh(0.016σ)]7.06exp−485.6RT

In order to investigate the influence of Ag on the hot deformation behavior of the Cu-Ni-Si alloy, Sun et al. [57] added 0.15 wt.% Ag into the Cu-2Ni-0.5Si alloy to prepare the Cu-2Ni-0.5Si-0.15Ag alloy and compared changes in the hot deformation process parameters of the two alloys. The results showed that the addition of Ag can refine grains and promote dynamic recrystallization. The hot deformation activation energy of the alloy after adding Ag was calculated to be 312.3 kJ/mol. Finally, the constitutive equation was constructed:

(3)ε˙=8.67×1011[sinh(0.018σ)]6.326exp−312.3RT

2.3 Cu-Cr-Zr alloy

Cu-Cr-Zr alloy is widely used in high-speed rail contact lines and resistance electrodes due to its high strength and electrical conductivity [58, 59, 60]. Although Cu-Cr alloy has high conductivity, its strength is not outstanding. Adding a certain amount of Zr element to the Cu-Cr alloy can limit the coarsening of Cr precipitated phase during the aging process and further improve the alloy strength. Pan et al. [61] reported that Cu5Zr nanoparticles precipitated out of the Cu-0.81Cr-0.12Zr alloy after aging and proposed that the best comprehensive properties could be obtained after aging for 15 min at 500∘C: 212 HV microhardness and 78.9% IACS conductivity. While studying the effects of Zr and Mg on the precipitation and aging behavior of Cu-Cr alloy, Tang et al. [62] demonstrated that Zr-rich phase existed on the grain boundaries of the alloy, and the precipitated nano-phase hindered the movement of grain boundaries, thereby improving the fatigue and creep resistance of the alloy. Wang et al. [63] found that Zr-rich precipitated phases formed in the Cu-Cr-Zr alloy during the 450∘C aging process. The habit plane of the two kinds of Zr-rich precipitated phases (Cu4Zr and Cu5Zr) were parallel to {111} Cu. Zhang et al. [64] studied the hot deformation behavior of the Cu-0.4Cr-0.1Zr alloy at 650-850∘C and 0.001-10 s−1 strain rate, and calculated the activation energy for thermal deformation of the alloy at 392.48 kJ/mol. Consequentially, the hot deformation constitutive equation was constructed:

(4)ε˙=4.929×1016[sinh(0.017σ)]7.558exp−392.48RT

In addition, the hot deformation behavior of the Cu-0.8Cr-0.3Zr, Cu-0.8Cr-0.3Zr-0.1Ag and Cu-0.8Cr-0.3Zr-0.05Nd alloys was studied [50]. The hot deformation activation energy and constitutive equations of these alloys are compared in Table 1.

Table 1

The activation energy and constitutive equations of different alloys

AlloyQ/(kJ/mol)Constitutive equations
Cu-0.8Cr-0.3Zr400.8ε˙=e42.2[sinh⁡(0.010σ)]9.11exp⁡(−400.8RT)
Cu-0.8Cr-0.3Zr-0.1Ag343.23ε˙=e35.82[sinh⁡(0.011σ)]7.72exp⁡(−343.23RT)
Cu-0.8Cr-0.3Zr-0.05Nd404.84ε˙=e40.28[sinh⁡(0.014σ)]7.19exp⁡(−404.84RT)

According to the data analysis in Table 1, the addition of Ag effectively reduces the hot deformation activation energy of the Cu-Cr-Zr alloy, while the addition of Nd slightly increases the hot deformation activation energy of the alloy. This is because the grain refinement effect is more obvious after adding Ag.

3 Copper matrix composites

3.1 Hot deformation behavior of the copper matrix composites

Dispersion strengthened copper matrix composites have been widely used in the electronics industry as high voltage switches and resistance welding electrodes due to their excellent high-temperature strength, high electrical and thermal conductivity [65, 66, 67, 68]. In general, nanoparticles, such as Al2O3, BeO, ZrO2, Cr2O3, are usually employed as reinforcement in the dispersion strengthened copper matrix composites.

Figure 7 shows the comprehensive properties of pure copper and nano-Al2O3 reinforced composite fabricated by the vacuum hot-pressing sintering and internal oxidation process. As shown in Figure 7, nano-Al2O3 phase in the copper matrix has a small negative effect on the electrical conductivity of the matrix. Tian et al. [69] prepared Cu-0.5vol.%Al2O3 by the internal oxidation method and reported that its softening temperature reached 800∘C. Furthermore, it was demonstrated that the strengthening mechanism of the composite was not the Orowan bypass mechanism, but nano-alumina particles pinning grain boundaries and sub-grain boundaries to inhibit dynamic recrystallization. Mu et al. [70] used a powder metallurgy method to add Y2O3 into the copper matrix and studied its effect on the electrical contact material. Rodrigo et al. [71] prepared Cu-2vol.%TiC by using the ball milling method and studied its creep behavior to obtain its hot deformation activation energy of 109-156 kJ/mol. Yang et al. [72] fabricated Al2O3-Cu/10%TiC composite by vacuum hot pressing sintering and internal oxidation method and studied its hot deformation behavior. The composite presented typical dynamic recrystallization characteristics in the process of hot deformation. It has been calculated that its hot deformation activation energy is 170.73 kJ/mol. Liu et al. [73] employed the same process to increase the TiC content to 20% and calculated the activation energy of 218.92 kJ/mol for the hot deformation process. By comparing the above research results, it can be demonstrated that the in-situ formation of Al2O3 or the increase of the nano-TiC particles amount can increase the activation energy of thermal deformation, thereby enhancing the deformation resistance of composites in the process of hot deformation. In order to improve the arc erosion resistance and circuit breaking ability of switch equipment, high melting point metals, such as W, Mo, Cr, etc. are often added to copper or dispersed copper matrix [74, 75, 76, 77]. Hiraoka et al. [78] proposed that during compression of the W(80)/Cu composite grains became fibrous with larger deformation amount. Huang et al. [79] demonstrated that the strengthening mechanism of the CuW70 alloy is work hardening caused by the sliding of the copper phase. Zou et al. [80] added a small amount of Cr and Ti to the Cu-W composite. These additions not only enhanced the interface bonding, but also improved the hot deformation performance of the composite. Zhang et al. [81] studied the thermal deformation behavior of the Al2O3-Cu/(W,Cr) composites, and the flow stress of the two kinds of composites increased rapidly to the maximum value and then gradually decreased to a steady value. Both kinds of composites show typical characteristics of dynamic recrystallization. In addition, at the same deformation temperature, the flow stress tends to increase with the strain rate and W content. In order to obtain the appropriate hot working conditions of the composites, hot processing maps were established in Figure 8. Furthermore, both stable and unstable regions were distinguished.

Figure 7 The comprehensive properties of pure copper and nano-Al2O3 reinforced composite. Label y axis.
Figure 7

The comprehensive properties of pure copper and nano-Al2O3 reinforced composite. Label y axis.

Figure 8 Hot processing maps of: (a) Al2O3-Cu/25W5Cr composite and (b) Al2O3-Cu/35W5Cr composite at 650-950∘C.
Figure 8

Hot processing maps of: (a) Al2O3-Cu/25W5Cr composite and (b) Al2O3-Cu/35W5Cr composite at 650-950∘C.

Finally, as shown in Figure 9, when the dislocations are pinned by nano-alumina particles, the dislocation wall changes from thick to thin. Under the deformation condition of 850∘C and 0.01 s−1, the copper matrix was still in the dynamic recovery stage.

Figure 9 TEM images of the Al2O3-Cu/35W5Cr composite deformed at 850∘C and 0.01 s−1.
Figure 9

TEM images of the Al2O3-Cu/35W5Cr composite deformed at 850∘C and 0.01 s−1.

3.2 Graphene reinforced copper matrix composites

In recent years, graphene and its derivatives, such as graphene oxide (GO) and reduced graphene oxide (RGO) have attracted more attention as an ideal reinforcement of the metal matrix composites. Graphene is a 2D layered structure material with a thickness of a single-layer carbon sheet. Monolayer graphene has the Young’s modulus of 1 TPa and the tensile strength of 130 GPa [82, 83, 84, 85, 86]. Therefore, graphene is considered as an ideal reinforcement for the development of high-performance metal matrix composites. At present, many researchers have prepared graphene reinforced copper matrix composites using powder metallurgy. Chu et al. [87] designed the graphene reinforced copper matrix composites by the vacuum filtration and spark plasma sintering methods. Compared with pure copper, the thermal conductivity of the composite increased by 50%. Varol et al. [88] reported that the highest conductivity was 78.5% IACS by adding 0.5 wt.% graphene into copper matrix composites. Figure 10 shows the tensile strength and tensile strength growth rate of the graphene reinforced copper matrix composites.

Figure 10 The tensile strength and tensile strength growth rate of the graphene reinforced copper matrix composites.
Figure 10

The tensile strength and tensile strength growth rate of the graphene reinforced copper matrix composites.

However, graphene has poor bonding with copper matrix and is prone to agglomeration in the preparation process. Fortunately, graphene oxide has large amounts of OH, COOH, C=O, and C(O)O groups. These groups are responsible for graphene oxide good wettability, dispersion and surface activity. In addition, they can enhance the bonding between the metal matrix and the reinforcement. Nevertheless, excellent conductivity can decrease sharply due to these groups. Actually, good conductivity can be obtained by reduction. For instance, one of the methods is heating at 900-1000∘C, which greatly improves the conductivity due to the loss of oxygen-containing groups and the reconstruction of the carbon framework [98, 99, 100]. Ramirez et al. [101] reported that the GO can be reduced when GO/Si3N4 composites were sintered by the spark plasma sintering. Xia et al. [102] also proposed that GO could be reduced to RGO during high-temperature sintering.

Figure 11 shows the scanning electron microscopy (SEM) images of the graphene oxide and composite powder doped with graphene oxide. In our previous work, graphene oxide reinforced copper matrix composites were prepared by the freeze-drying and vacuum hot-press sintering methods, as shown in Figure 11(c). Furthermore, the tensile strength of the composite containing 0.3 wt.% GO was increased by 45%, as shown in Figure 12.

Figure 11 (a) The SEM image of the graphene oxide and (b) Composite powder doped with graphene oxide; (c) Schematics of the fabrication process.
Figure 11

(a) The SEM image of the graphene oxide and (b) Composite powder doped with graphene oxide; (c) Schematics of the fabrication process.

Figure 12 Engineering tensile stress-strain curves of different composites.
Figure 12

Engineering tensile stress-strain curves of different composites.

In the above studies, commercial GO or graphene as the ex-situ reinforcement phase of the metal matrix com posites were prepared mostly by powder metallurgy. In situ reinforcement can improve the wettability and bonding at the graphene and metal interface through metallurgical reactions and chemical synthesis. Currently, many researchers use chemical vapor deposition (CVD) method to prepare graphene reinforced copper matrix composites [103, 104, 105, 106]. Chen et al. [91] prepared 3D-GR/Cu composite with polymethyl methacrylate as carbon source, Cu as matrix and catalyst by using the CVD method. The tensile strength of the composite doped with 0.5 wt% was increased by 35.7%. Cao et al. [95] employed a bioinspired strategy by assembling copper flakes cladded with in situ graphene using polymethyl methacrylate as a solid carbon source. The yield strength and elastic modulus increased by 177% and 25%, respectively. Tour et al. [107] used a new solid carbon source to prepare graphene and doped graphene on the Cu surface, and the obtained graphene consisted of controllable layers and had low number of defects. In the previous work, the high growth temperature was required for graphene growth. However, Li et al. [108] used benzene as the hydrocarbon source to grow graphene in the CVD process, and the fabrication was achieved at a growth temperature as low as 300∘C.

4 Conclusions

In this article, the aging precipitation and hot deformation behavior of several typical copper alloys have been reviewed. Nano-phase precipitated during aging can strengthen matrix owing to various strengthening mechanisms. Furthermore, hot deformation activation energy and constitutive equation were calculated and constructed, respectively. In addition, nano-particles dispersion phase can strengthen copper matrix on the premise of ensuring electrical conductivity. Finally, graphene reinforced copper matrix composites were reviewed. CVD method is the most exceptional potential for fabricating graphene reinforced composites.

Xiaohui Zhang and Yi Zhang contributed equally to this work

Acknowledgement

This work was supported by the Open Cooperation Project of Science and Technology of the Henan Province (182106000018), the Henan University Scientific and Technological Innovation Talent Support Program (18HASTIT024) and the National Natural Science Foundation of China (U1704143).

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Received: 2019-08-03
Accepted: 2019-08-22
Published Online: 2019-12-04

© 2019 X. Zhang et al., published by De Gruyter

This work is licensed under the Creative Commons Attribution 4.0 Public License.

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  14. Mechanical characterizations of braided composite stents made of helical polyethylene terephthalate strips and NiTi wires
  15. Mechanical properties of boron nitride sheet with randomly distributed vacancy defects
  16. Fabrication, mechanical properties and failure mechanism of random and aligned nanofiber membrane with different parameters
  17. Micro- structure and rheological properties of graphene oxide rubber asphalt
  18. First-principles calculations of mechanical and thermodynamic properties of tungsten-based alloy
  19. Adsorption performance of hydrophobic/hydrophilic silica aerogel for low concentration organic pollutant in aqueous solution
  20. Preparation of spherical aminopropyl-functionalized MCM-41 and its application in removal of Pb(II) ion from aqueous solution
  21. Electrical conductivity anisotropy of copper matrix composites reinforced with SiC whiskers
  22. Miniature on-fiber extrinsic Fabry-Perot interferometric vibration sensors based on micro-cantilever beam
  23. Electric-field assisted growth and mechanical bactericidal performance of ZnO nanoarrays with gradient morphologies
  24. Flexural behavior and mechanical model of aluminum alloy mortise-and-tenon T-joints for electric vehicle
  25. Synthesis of nano zirconium oxide and its application in dentistry
  26. Surface modification of nano-sized carbon black for reinforcement of rubber
  27. Temperature-dependent negative Poisson’s ratio of monolayer graphene: Prediction from molecular dynamics simulations
  28. Finite element nonlinear transient modelling of carbon nanotubes reinforced fiber/polymer composite spherical shells with a cutout
  29. Preparation of low-permittivity K2O–B2O3–SiO2–Al2O3 composites without the addition of glass
  30. Large amplitude vibration of doubly curved FG-GRC laminated panels in thermal environments
  31. Enhanced flexural properties of aramid fiber/epoxy composites by graphene oxide
  32. Correlation between electrochemical performance degradation and catalyst structural parameters on polymer electrolyte membrane fuel cell
  33. Materials characterization of advanced fillers for composites engineering applications
  34. Humic acid assisted stabilization of dispersed single-walled carbon nanotubes in cementitious composites
  35. Test on axial compression performance of nano-silica concrete-filled angle steel reinforced GFRP tubular column
  36. Multi-scale modeling of the lamellar unit of arterial media
  37. The multiscale enhancement of mechanical properties of 3D MWK composites via poly(oxypropylene) diamines and GO nanoparticles
  38. Mechanical properties of circular nano-silica concrete filled stainless steel tube stub columns after being exposed to freezing and thawing
  39. Arc erosion behavior of TiB2/Cu composites with single-scale and dual-scale TiB2 particles
  40. Yb3+-containing chitosan hydrogels induce B-16 melanoma cell anoikis via a Fak-dependent pathway
  41. Template-free synthesis of Se-nanorods-rGO nanocomposite for application in supercapacitors
  42. Effect of graphene oxide on chloride penetration resistance of recycled concrete
  43. Bending resistance of PVA fiber reinforced cementitious composites containing nano-SiO2
  44. Review Articles
  45. Recent development of Supercapacitor Electrode Based on Carbon Materials
  46. Mechanical contribution of vascular smooth muscle cells in the tunica media of artery
  47. Applications of polymer-based nanoparticles in vaccine field
  48. Toxicity of metallic nanoparticles in the central nervous system
  49. Parameter control and concentration analysis of graphene colloids prepared by electric spark discharge method
  50. A critique on multi-jet electrospinning: State of the art and future outlook
  51. Electrospun cellulose acetate nanofibers and Au@AgNPs for antimicrobial activity - A mini review
  52. Recent progress in supercapacitors based on the advanced carbon electrodes
  53. Recent progress in shape memory polymer composites: methods, properties, applications and prospects
  54. In situ capabilities of Small Angle X-ray Scattering
  55. Review of nano-phase effects in high strength and conductivity copper alloys
  56. Progress and challenges in p-type oxide-based thin film transistors
  57. Advanced materials for flexible solar cell applications
  58. Phenylboronic acid-decorated polymeric nanomaterials for advanced bio-application
  59. The effect of nano-SiO2 on concrete properties: a review
  60. A brief review for fluorinated carbon: synthesis, properties and applications
  61. A review on the mechanical properties for thin film and block structure characterised by using nanoscratch test
  62. Cotton fibres functionalized with plasmonic nanoparticles to promote the destruction of harmful molecules: an overview
https://doi.org/10.1515/ntrev-2019-0034
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Articles in the same Issue

  1. Research Articles
  2. Investigation of rare earth upconversion fluorescent nanoparticles in biomedical field
  3. Carbon Nanotubes Coated Paper as Current Collectors for Secondary Li-ion Batteries
  4. Insight into the working wavelength of hotspot effects generated by popular nanostructures
  5. Novel Lead-free biocompatible piezoelectric Hydroxyapatite (HA) – BCZT (Ba0.85Ca0.15Zr0.1Ti0.9O3) nanocrystal composites for bone regeneration
  6. Effect of defects on the motion of carbon nanotube thermal actuator
  7. Dynamic mechanical behavior of nano-ZnO reinforced dental composite
  8. Fabrication of Ag Np-coated wetlace nonwoven fabric based on amino-terminated hyperbranched polymer
  9. Fractal analysis of pore structures in graphene oxide-carbon nanotube based cementitious pastes under different ultrasonication
  10. Effect of PVA fiber on durability of cementitious composite containing nano-SiO2
  11. Cr effects on the electrical contact properties of the Al2O3-Cu/15W composites
  12. Experimental evaluation of self-expandable metallic tracheobronchial stents
  13. Experimental study on the existence of nano-scale pores and the evolution of organic matter in organic-rich shale
  14. Mechanical characterizations of braided composite stents made of helical polyethylene terephthalate strips and NiTi wires
  15. Mechanical properties of boron nitride sheet with randomly distributed vacancy defects
  16. Fabrication, mechanical properties and failure mechanism of random and aligned nanofiber membrane with different parameters
  17. Micro- structure and rheological properties of graphene oxide rubber asphalt
  18. First-principles calculations of mechanical and thermodynamic properties of tungsten-based alloy
  19. Adsorption performance of hydrophobic/hydrophilic silica aerogel for low concentration organic pollutant in aqueous solution
  20. Preparation of spherical aminopropyl-functionalized MCM-41 and its application in removal of Pb(II) ion from aqueous solution
  21. Electrical conductivity anisotropy of copper matrix composites reinforced with SiC whiskers
  22. Miniature on-fiber extrinsic Fabry-Perot interferometric vibration sensors based on micro-cantilever beam
  23. Electric-field assisted growth and mechanical bactericidal performance of ZnO nanoarrays with gradient morphologies
  24. Flexural behavior and mechanical model of aluminum alloy mortise-and-tenon T-joints for electric vehicle
  25. Synthesis of nano zirconium oxide and its application in dentistry
  26. Surface modification of nano-sized carbon black for reinforcement of rubber
  27. Temperature-dependent negative Poisson’s ratio of monolayer graphene: Prediction from molecular dynamics simulations
  28. Finite element nonlinear transient modelling of carbon nanotubes reinforced fiber/polymer composite spherical shells with a cutout
  29. Preparation of low-permittivity K2O–B2O3–SiO2–Al2O3 composites without the addition of glass
  30. Large amplitude vibration of doubly curved FG-GRC laminated panels in thermal environments
  31. Enhanced flexural properties of aramid fiber/epoxy composites by graphene oxide
  32. Correlation between electrochemical performance degradation and catalyst structural parameters on polymer electrolyte membrane fuel cell
  33. Materials characterization of advanced fillers for composites engineering applications
  34. Humic acid assisted stabilization of dispersed single-walled carbon nanotubes in cementitious composites
  35. Test on axial compression performance of nano-silica concrete-filled angle steel reinforced GFRP tubular column
  36. Multi-scale modeling of the lamellar unit of arterial media
  37. The multiscale enhancement of mechanical properties of 3D MWK composites via poly(oxypropylene) diamines and GO nanoparticles
  38. Mechanical properties of circular nano-silica concrete filled stainless steel tube stub columns after being exposed to freezing and thawing
  39. Arc erosion behavior of TiB2/Cu composites with single-scale and dual-scale TiB2 particles
  40. Yb3+-containing chitosan hydrogels induce B-16 melanoma cell anoikis via a Fak-dependent pathway
  41. Template-free synthesis of Se-nanorods-rGO nanocomposite for application in supercapacitors
  42. Effect of graphene oxide on chloride penetration resistance of recycled concrete
  43. Bending resistance of PVA fiber reinforced cementitious composites containing nano-SiO2
  44. Review Articles
  45. Recent development of Supercapacitor Electrode Based on Carbon Materials
  46. Mechanical contribution of vascular smooth muscle cells in the tunica media of artery
  47. Applications of polymer-based nanoparticles in vaccine field
  48. Toxicity of metallic nanoparticles in the central nervous system
  49. Parameter control and concentration analysis of graphene colloids prepared by electric spark discharge method
  50. A critique on multi-jet electrospinning: State of the art and future outlook
  51. Electrospun cellulose acetate nanofibers and Au@AgNPs for antimicrobial activity - A mini review
  52. Recent progress in supercapacitors based on the advanced carbon electrodes
  53. Recent progress in shape memory polymer composites: methods, properties, applications and prospects
  54. In situ capabilities of Small Angle X-ray Scattering
  55. Review of nano-phase effects in high strength and conductivity copper alloys
  56. Progress and challenges in p-type oxide-based thin film transistors
  57. Advanced materials for flexible solar cell applications
  58. Phenylboronic acid-decorated polymeric nanomaterials for advanced bio-application
  59. The effect of nano-SiO2 on concrete properties: a review
  60. A brief review for fluorinated carbon: synthesis, properties and applications
  61. A review on the mechanical properties for thin film and block structure characterised by using nanoscratch test
  62. Cotton fibres functionalized with plasmonic nanoparticles to promote the destruction of harmful molecules: an overview
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