Development of Sn–Cu–Sb alloys for making lead- and bismuth-free pewter
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Yew Hoong Wong
Abstract
A systematic study on the development of a set of Sn–Cu–Sb alloys and their characteristics, such as phases evolved, mechanical properties, physical properties, and microstructures, that are commonly sought for making pewter is presented. Alloys with various nominal compositions of Sn–Cu (1–3%)–Sb (3–6%) were prepared and they were die cast for complete characterization. The samples were characterized for hardness, malleability, density, microstructure, and phase identification. The study is expected to help in selecting the right composition of the alloys for making pewter with appropriate combination of properties.
References
[1] S.Kalpakjian: Manufacturing Engineering and Technology, Prentice Hall, New Jersey (2001).Suche in Google Scholar
[2] J.A.Jacobs, T.F.Kildulf: Engineering Materials Technology: Structures, Processing, Properties & Selection, Prentice Hall, New Jersey (1997).Suche in Google Scholar
[3] M.B.Dessuy, M.G.R.Vale, B.Welz, A.R.Borges, M.M.Silva, P.B.Martelli: Talanta85 (2011) 681. PMid:21645758; 10.1016/j.talanta.2011.04.050Suche in Google Scholar
[4] Q.Zeng, J.Guo, X.Gu, X.Zhao, X.Liu: J. Mater. Sci. Technol.26 (2010) 156. 10.1016/S1005-0302(10)60026-6Suche in Google Scholar
[5] J.Han, H.Chen, M.Li, C.Wang: J. Mater. Sci. Technol.29 (2013) 471. 10.1016/j.jmst.2013.01.012Suche in Google Scholar
[6] J.F.Young, R.S.Shane: Materials and Processes Part A: Materials, Marcel Dekker, New York (1985).Suche in Google Scholar
[7] D.M.Laskin: Oral and Maxillofacial Surgery, Mosby (1980).Suche in Google Scholar
[8] W.D.CallisterJr: Materials Science and Engineering – An Introduction, Wiley, New York (2003).Suche in Google Scholar
[9] H.Lee, M.Chen: Mater. Sci. Eng. A333 (2002) 24. 10.1016/S0921-5093(01)01820-2Suche in Google Scholar
[10] D.Lin, G.X.Wang, T.S.Srivatsan, M.Al-Hajri, M.Petraroli: Mater. Lett.53 (2002) 333. 10.1016/S0167-577X(01)00503-1Suche in Google Scholar
[11] W.F.Smith, J.Hashemi: Foundations of Materials Science and Engineering, McGraw-Hill, New York (2006).Suche in Google Scholar
[12] K.J.Puttlitz, K.A.Stalter: Handbook of Lead-free Solder Technology for Microelectronic Assemblies, CRC Press, Florida (2004). 10.1201/9780203021484Suche in Google Scholar
© 2014, Carl Hanser Verlag, München
Artikel in diesem Heft
- Contents
- Contents
- Original Contributions
- Experimental determination of a representative texture and insight into the range of significant neighboring grain interactions via orientation and misorientation statistics
- Methods of segregation analysis applied to simulated multicomponent multiphase microstructures
- Nanoindentation responses of Si–Ge multilayers
- Microstructural and thermodynamic investigations on friction stir welded Mg/Al-joints
- Ingot metallurgy and microstructural characterization of Ti–Ta alloys
- Microstructural evolution of aluminium–copper alloys during the downward directional solidification process
- Indium ion cementation onto aluminum plates in hydrochloric acid solutions: a kinetic perspective
- Development of Sn–Cu–Sb alloys for making lead- and bismuth-free pewter
- The effect of Sn addition and sulfide ion concentration on the corrosion behavior of Cu-35Zn in NaCl solution
- Synthesis and characteristics of precipitation hardened Cu–Cr alloy and multiply hardened Cu–Cr–Al2O3 nanocomposite obtained using powder metallurgy techniques
- Effect of rhenium addition on the strengthening of chromium–alumina composite materials
- Grain growth and sinterability in Er2O3-doped cubic zirconia (c-ZrO2)
- Short Communications
- Properties of aluminium coatings produced using manual and robotized flame spraying processes
- DGM News
- DGM News
Artikel in diesem Heft
- Contents
- Contents
- Original Contributions
- Experimental determination of a representative texture and insight into the range of significant neighboring grain interactions via orientation and misorientation statistics
- Methods of segregation analysis applied to simulated multicomponent multiphase microstructures
- Nanoindentation responses of Si–Ge multilayers
- Microstructural and thermodynamic investigations on friction stir welded Mg/Al-joints
- Ingot metallurgy and microstructural characterization of Ti–Ta alloys
- Microstructural evolution of aluminium–copper alloys during the downward directional solidification process
- Indium ion cementation onto aluminum plates in hydrochloric acid solutions: a kinetic perspective
- Development of Sn–Cu–Sb alloys for making lead- and bismuth-free pewter
- The effect of Sn addition and sulfide ion concentration on the corrosion behavior of Cu-35Zn in NaCl solution
- Synthesis and characteristics of precipitation hardened Cu–Cr alloy and multiply hardened Cu–Cr–Al2O3 nanocomposite obtained using powder metallurgy techniques
- Effect of rhenium addition on the strengthening of chromium–alumina composite materials
- Grain growth and sinterability in Er2O3-doped cubic zirconia (c-ZrO2)
- Short Communications
- Properties of aluminium coatings produced using manual and robotized flame spraying processes
- DGM News
- DGM News
