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Three-dimensional morphological characterization of coarsened microstructures

  • R. Mendoza , J. Alkemper and P. W. Voorhees EMAIL logo
Published/Copyright: January 22, 2022
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International Journal of Materials Research
From the journal International Journal of Materials Research Volume 96 Issue 2

Abstract

The three-dimensional morphological evolution of a directionally solidified Al-15 wt.% Cu alloy during isothermal coarsening was examined. The microstructure was analyzed using the Interfacial Shape Distribution (ISD), which gives the probability of locating an interfacial patch with a given pair of principle curvatures. By scaling the ISD’s by a characteristic length, the inverse of the surface area per unit volume, it was possible to determine if the system reached a scaled time-invariant state. During coarsening, cylindrical interfaces appear in the second coarsened sample and remained for later coarsening times. The appearance of the corresponding peak in the ISD indicated that the microstructure was not evolving in a self-similar manner, despite the linear relationship between the inverse surface area per unit volume and the cube root of coarsening time. Stereographic projections of the interfacial normals indicated that the microstructure of the earliest coarsened sample had a four-fold symmetry that disappeared during coarsening and that the majority of interfacial area for all coarsened samples is parallel to the direction in which the pre-coarsened samples were solidified.

Keywords: Coarsening; Serial sectioning; 3D reconstruction; Al–Cu alloy; Interface shape distribution; Interface normal distribution
Peter W. Voorhees Department of Materials Science and Engineering Northwestern University 2220 Campus Drive, Evanston, Illinois 60208-3108, USA Tel.: +847 491 7815 Fax: +847 491 7820

Dedicated to Professor Dr. Duk Yong Yoon on the occasion of his 65th birthday

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Received: 2004-10-02
Accepted: 2004-11-09
Published Online: 2022-01-22

© 2005 Carl Hanser Verlag, München

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  2. Editorial
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  23. Notifications/Mitteilungen
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https://doi.org/10.3139/ijmr-2005-0027
Keywords for this article
Coarsening; Serial sectioning; 3D reconstruction; Al–Cu alloy; Interface shape distribution; Interface normal distribution

Articles in the same Issue

  1. Frontmatter
  2. Editorial
  3. Editorial
  4. Articles Basic
  5. Solute drag illustrated graphically
  6. Dopant effect on high-temperature plastic flow behavior and grain boundary chemistry in oxide ceramics
  7. Anomalous behaviour in diffusion impedance of intercalation electrodes
  8. A simple model of fully-faceted grain growth and coarsening with non-linear growth laws
  9. Thermal conductivity of functionally graded Fe–Cu–C alloy processed by liquid phase sintering and carburization
  10. Microstructure development during liquid-phase sintering
  11. The mechanical properties of a joint of Sn-3.5Ag-1Zn solder and Cu substrate with aging treatment
  12. Three-dimensional morphological characterization of coarsened microstructures
  13. Faceting and migration of twin grain boundaries in zinc
  14. Effect of external electric field on the microstructural evolution of La2O3-doped BaTiO3 ceramics
  15. Hardness and fracture toughness of ultra-fine WC-10Co-X cemented carbides prepared from nanocrystalline powders
  16. Systematic study of grain boundary atomistic structures and related properties in cubic zirconia bicrystals
  17. Spontaneous generation of charged atoms or clusters during thermal evaporation of silver
  18. The influence of singular surfaces and morphological changes on coarsening
  19. Electrical activity of grain boundaries in polycrystalline silicon – influences of grain boundary structure, chemistry and temperature
  20. Changes in the distribution of interfaces in PMN-35 mol% PT as a function of time
  21. Study of the effect of heat treatment on a Pt–Co thin film by Monte Carlo simulations coupled with a modified embedded atom method
  22. The influence of misorientation deviation on the faceting of Σ3 grain boundaries in aluminium
  23. Notifications/Mitteilungen
  24. Personal/Personelles
  25. Materials Week
  26. Conferences/ Konferenzen
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