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Effect of Copper Line Geometry and Process Parameters on Interconnect Microstructure and Degradation Processes

  • Ehrenfried Zschech EMAIL logo , Werner Blum , Inka Zienert and Paul R. Besser
Published/Copyright: February 11, 2022
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International Journal of Materials Research
From the journal International Journal of Materials Research Volume 92 Issue 7

Abstract

The atomic transport processes which could cause degradation mechanisms in Cu interconnects are described. The influence of interconnect line width, barrier type and anneal process on the microstructure and reliability of the inlaid Cu lines are discussed. Grain size and texture measurements have been performed at blanket films and at arrays of Cu lines using advanced analytical techniques. The median grain size decreases with decreasing line width, and it can be influenced by heat treatments. The crystallographic texture is predominantly {111} out-of-plane with sidewall-oriented grains in narrow Cu lines. The grains have an in-plane preferred orientation with the 〈110〉 direction parallel to the sidewall normal. The Cu texture is influenced by barrier structure and thickness.

Keywords: Interconnect microstructure; Degradation processes; Microprocessors
Dr. E. Zschech AMD Saxony Manufacturing GmbH P. O. Box 11 01 10, D-01330 Dresden, Germany Fax: +49 351 277 9 4100

Dedicated to Professor Dr. Dr. h. c. mult. Günter Petzow on the occasion of his 75th birthday.

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Received: 2001-03-24
Published Online: 2022-02-11

© 2001 Carl Hanser Verlag, München

Articles in the same Issue

  1. Frontmatter
  2. Editorial
  3. “No wise man ever wish to be younger”
  4. Aufsätze/Articles
  5. Entropy, Transformations and Sustainability of Industrial Life Cycles
  6. Positron Annihilation in Stable and Supercooled Metallic Melts
  7. Local Characterization of the Diffusion Process during Discontinuous Precipitation: A Review
  8. The Dependence of Abnormal Grain Growth on Initial Grain Size in 316 L Stainless Steel
  9. Diffusion-Controlled Grain Growth in Liquid-Phase Sintering of W–Cu Nanocomposites
  10. Evaluation of Densification Mechanisms of Liquid-Phase Sintering
  11. Phase Transformation of a Dual Phase Al–Fe Alloy Prepared by Mechanical Alloying
  12. Discrete Element Simulation of Ceramic Powder Processing
  13. Strain Relaxation and Internal Friction in the Range of the Glass Transition
  14. A Thermodynamic Model of an Amorphous Grain Boundary Phase in Liquid-Phase Sintered β-SiAlON Ceramic
  15. Epitaxial Growth of Metals on (100) SrTiO3: The Influence of Lattice Mismatch and Reactivity
  16. Microstructure and Modifications of Cu/Al2O3 Interfaces
  17. Structural Transformations Induced by Swift Heavy Ions in Polysiloxanes and Polycarbosilanes
  18. Metastable Al–Nd–Ni and Stable Al–La–Ni Phase Equilibria
  19. Phase Equilibria of the Al–Nd and Al–Nd–Ni Systems
  20. System Pr –Pd–O: Phase Diagram and Thermodynamic Properties of Ternary Oxides Using Solid-State Cells with Special Features
  21. Calculation of Phase Equilibria in Candidate Solder Alloys
  22. Thermodynamic Assessment of the Zr–O Binary System
  23. Delaminating Layered Oxide Composites with Wavy Interfaces
  24. Contemporary Materials Issues for Advanced EB-PVD Thermal Barrier Coating Systems
  25. Monte Carlo Simulations of Strength Distributions of Brittle Materials – Type of Distribution, Specimen and Sample Size
  26. On the Optimization of the Microstructure in Powder Metallurgical Ag–SnO2–In2O3 Contact Materials
  27. Some New Aspects of Microstructural Design of β-Si3N4 Ceramics
  28. Ni-Based SOFC Anodes: Microstructure and Electrochemistry
  29. Effect of Copper Line Geometry and Process Parameters on Interconnect Microstructure and Degradation Processes
  30. Thermal Stability of Nanoscale Co/Cu Multilayers
  31. Methods for Characterising the Precipitation of Nanometer-Sized Secondary Hardening Carbides and Related Effects in Tool Steels
  32. Prediction of Local Strain and Hardness in Sheet Forming
  33. Novel in situ-Infiltrated Al2O3-Metal Composites
  34. Influence of Microstructure and Impurities on Thermal Conductivity of Aluminium Nitride Ceramics
  35. Notifications/Mitteilungen
  36. Personelles/Personal
  37. Bücher/Books
  38. Tagungen/Conferences
https://doi.org/10.1515/ijmr-2001-0147
Keywords for this article
Interconnect microstructure; Degradation processes; Microprocessors

Articles in the same Issue

  1. Frontmatter
  2. Editorial
  3. “No wise man ever wish to be younger”
  4. Aufsätze/Articles
  5. Entropy, Transformations and Sustainability of Industrial Life Cycles
  6. Positron Annihilation in Stable and Supercooled Metallic Melts
  7. Local Characterization of the Diffusion Process during Discontinuous Precipitation: A Review
  8. The Dependence of Abnormal Grain Growth on Initial Grain Size in 316 L Stainless Steel
  9. Diffusion-Controlled Grain Growth in Liquid-Phase Sintering of W–Cu Nanocomposites
  10. Evaluation of Densification Mechanisms of Liquid-Phase Sintering
  11. Phase Transformation of a Dual Phase Al–Fe Alloy Prepared by Mechanical Alloying
  12. Discrete Element Simulation of Ceramic Powder Processing
  13. Strain Relaxation and Internal Friction in the Range of the Glass Transition
  14. A Thermodynamic Model of an Amorphous Grain Boundary Phase in Liquid-Phase Sintered β-SiAlON Ceramic
  15. Epitaxial Growth of Metals on (100) SrTiO3: The Influence of Lattice Mismatch and Reactivity
  16. Microstructure and Modifications of Cu/Al2O3 Interfaces
  17. Structural Transformations Induced by Swift Heavy Ions in Polysiloxanes and Polycarbosilanes
  18. Metastable Al–Nd–Ni and Stable Al–La–Ni Phase Equilibria
  19. Phase Equilibria of the Al–Nd and Al–Nd–Ni Systems
  20. System Pr –Pd–O: Phase Diagram and Thermodynamic Properties of Ternary Oxides Using Solid-State Cells with Special Features
  21. Calculation of Phase Equilibria in Candidate Solder Alloys
  22. Thermodynamic Assessment of the Zr–O Binary System
  23. Delaminating Layered Oxide Composites with Wavy Interfaces
  24. Contemporary Materials Issues for Advanced EB-PVD Thermal Barrier Coating Systems
  25. Monte Carlo Simulations of Strength Distributions of Brittle Materials – Type of Distribution, Specimen and Sample Size
  26. On the Optimization of the Microstructure in Powder Metallurgical Ag–SnO2–In2O3 Contact Materials
  27. Some New Aspects of Microstructural Design of β-Si3N4 Ceramics
  28. Ni-Based SOFC Anodes: Microstructure and Electrochemistry
  29. Effect of Copper Line Geometry and Process Parameters on Interconnect Microstructure and Degradation Processes
  30. Thermal Stability of Nanoscale Co/Cu Multilayers
  31. Methods for Characterising the Precipitation of Nanometer-Sized Secondary Hardening Carbides and Related Effects in Tool Steels
  32. Prediction of Local Strain and Hardness in Sheet Forming
  33. Novel in situ-Infiltrated Al2O3-Metal Composites
  34. Influence of Microstructure and Impurities on Thermal Conductivity of Aluminium Nitride Ceramics
  35. Notifications/Mitteilungen
  36. Personelles/Personal
  37. Bücher/Books
  38. Tagungen/Conferences
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