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Dislocation dynamics in sub-micron confinement: recent progress in Cu thin film plasticity

  • Gerhard Dehm EMAIL logo , T. John Balk , Burghard von Blanckenhagen , Peter Gumbsch and Eduard Arzt
Published/Copyright: January 31, 2022
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International Journal of Materials Research
From the journal International Journal of Materials Research Volume 93 Issue 5

Abstract

Small is strong – the yield stresses of thin metall23ic films with sub-micron thickness greatly exceed bulk values. While it is clear that this effect must be due to confinement effects on dislocation processes, the details of such mechanical finite size phenomena are complicated. Our recent In situ transmission electron microscopy studies combined with discrete dislocation dynamics simulations have shed some light on this problem. One conclusion is that the behavior of dislocations near interfaces affects the plasticity in small volumes in new ways which have not been foreseen by theoretical considerations so far. Another important aspect is the discovery of unexpected slip systems, which can be seen as indirect evidence for a constrained diffusional creep mechanism in polycrystalline films. Discrete dislocation simulations have allowed the operation of dislocation sources to be simulated under various boundary conditions. Based on these studies, we propose a new view of dislocation plasticity in thin films which, while being far from complete, seems to be more consistent with experimental observations and measurements.

Keywords: Thin film plasticity; Discrete dislocation dynamics; Constrained diffusional creep; In situ TEM; Thermal stress
Dr. Gerhard Dehm Max-Planck-Institut für Metallforschung Heisenbergstr. 3, D-70569 Stuttgart, Germany Tel.:+49 711 689 4318 Fax: +49 711 689 4312

  1. The authors would like to thank Prof. H. Gao for fruitful discussions. Dr. T. Wagner and his team from the “ZWE Dünnschichtlabor” are acknowledged for assistance with thin film deposition. G. D. and T. J. B. express thanks to B. Heiland, N. Tomic, and D. Cantarutti for preparation of certain TEM specimens, to Dr. F. Phillipp and his team from the “ZWE Hochspannungsmikroskopie”, and to Prof. M. Rühle for use of the TEM facilities. E. A. gratefully acknowledges financial support from the Deutsche Forschungsgemeinschaft (Leibniz Award). B. v. B. and P. G. gratefully acknowledge financial support by the Deutsche Forschungsgemeinschaft (Gu 367/18).

References

1 Arzt, E.: Acta Mater. 46 (1998) 5611.10.1016/S1359-6454(98)00231-6Search in Google Scholar

2 Kraft, O.; Wellner, P.; Schwaiger, R.; Hommel, M.; Arzt, E.: Z. Metallkd. 93 (2002) 352.10.3139/146.020352Search in Google Scholar

3 Nix, W.D.: Metall. Trans. A 20 (1989) 2217.10.1007/BF02666659Search in Google Scholar

4 Arzt, E.; Dehm, G.; Gumbsch, P.; Kraft, O.; Weiss, D.: Prog. Mater. Sci. 46 (2001) 283.10.1016/S0079-6425(00)00015-3Search in Google Scholar

5 Maex, K.; Joo, Y.-C.; Oehrlein, G.S.; Ogawa, S.; Wetzel, J.T. (eds.): Materials, Technology, and Reliability for Advanced Interconnects and Low-k Dielectrics, Mater. Res. Soc. Symp. Proc., Vol. 612, Warrendale, PA (2000).Search in Google Scholar

6 Chaudari, P.: Phil. Mag. A 39 (1979) 507.10.1080/01418617908239287Search in Google Scholar

7 Kuan, T.S.; Murakami, M.: Metall. Trans. A 13 (1982) 383.10.1007/BF02643347Search in Google Scholar

8 Thompson, C.V.: J. Mater. Res. 8 (1993) 237.10.1557/JMR.1993.0237Search in Google Scholar

9 Freund, L.B.: J. Appl. Mech. 43 (1987) 553.10.1115/1.3173068Search in Google Scholar

10 Venkatraman, R.; Bravman, J.C.: J. Mater. Res. 7 (1992) 2040.10.1557/JMR.1992.2040Search in Google Scholar

11 Dehm, G.; Inkson, B.J.; Wagner, T.; Balk, T.J.; Arzt, E.: J. Mater. Sci. Technol. 18 (2002), in press.Search in Google Scholar

12 Vinci, R.P.; Zielinski, E.M.; Bravman, J.C.: Thin Solid Films 262 (1995) 142.10.1016/0040-6090(95)05834-6Search in Google Scholar

13 Keller, R.-M.; Baker, S.P.; Arzt, E.: J. Mater. Res. 13 (1998) 1307.10.1557/JMR.1998.0186Search in Google Scholar

14 Weiss, D.: Ph.D. Thesis, Univ. Stuttgart (2000).Search in Google Scholar

15 Hommel, M.; Kraft, O.: Acta Mater. 49 (2001) 3935.10.1016/S1359-6454(01)00293-2Search in Google Scholar

16 Nix, W.D.: Scripta Mater. 39 (1998) 545.10.1016/S1359-6462(98)00195-XSearch in Google Scholar

17 Schwarz, K.W.; Tersoff, J.: Appl. Phys. Lett. 69 (1996) 1220.10.1063/1.117417Search in Google Scholar

18 Gomez-Garcia, D.; Devincre, B.; Kubin, L.: J. Comput. Aided Mater. Design 6 (1999) 157.10.1023/A:1008730711221Search in Google Scholar

19 Pant, P.; Schwarz, K.W.; Baker, S.P.: Mater. Res. Soc. Symp. Proc. 673 (2001) P2.2.1.10.1557/PROC-673-P2.2Search in Google Scholar

20 von Blanckenhagen, B.: Ph.D. Thesis, Univ. Stuttgart (2002).Search in Google Scholar

21 Gao, H.; Zhang, L.; Nix, W.D.; Thompson, C.V.; Arzt, E.: Acta Mater. 47 (1999) 2865.10.1016/S1359-6454(99)00178-0Search in Google Scholar

22 Flinn, P.A.; Gardner, D.S.; Nix, W.D.: IEEE Trans. Electron. Devices 34 (1987) 689.10.1109/T-ED.1987.22981Search in Google Scholar

23 Kobrinsky, M.J.; Thompson, C.V.: Acta Mater. 48 (2000) 625.10.1016/S1359-6454(99)00403-6Search in Google Scholar

24 Kobrinsky, M.J.; Dehm, G.; Thompson, C.V.; Arzt, E.: Acta Mater. 49 (2001) 3597.10.1016/S1359-6454(01)00225-7Search in Google Scholar

25 Weiss, D.; Gao, H.; Arzt, E.: Acta Mater. 49 (2001) 2395.10.1016/S1359-6454(01)00168-9Search in Google Scholar

26 Dehm, G.; Arzt, E.: Appl. Phys. Lett. 77 (2000) 1126.10.1063/1.1289488Search in Google Scholar

27 Dehm, G.; Inkson, B.J.; Balk, T.J.; Wagner, T.; Arzt, E.: Mater. Res. Soc. Symp. Proc. 673 (2001) P2.6.1.10.1557/PROC-673-P2.6Search in Google Scholar

28 Balk, T.J.; Dehm, G.; Arzt, E.: Mater. Res. Soc. Symp. Proc. 673 (2001) P2.7.1.10.1557/PROC-673-P2.7Search in Google Scholar

29 Balk, T.J.; Dehm, G.; Arzt, E.: Mater. Res. Soc. Symp. Proc. 695 (2002) L2.7.1.10.1557/PROC-695-L2.7.1Search in Google Scholar

30 von Blanckenhagen, B.; Gumbsch, P.; Arzt, E.: Modelling Simul. Mater. Sci. Eng. 9 (2001) 157.10.1088/0965-0393/9/3/303Search in Google Scholar

31 Stoney, G.G.: Proc. Roy. Soc. A 82 (1909) 172.Search in Google Scholar

32 Dehm, G.; Ernst, F.; Mayer, J.; Möbus, G.; Müllejans, H.; Phillipp, F.; Scheu, C.; Rühle, M.: Z. Metallkd. 87 (1996) 898.Search in Google Scholar

33 Dehm, G.; Weiss, D.; Arzt, E.: Mater. Sci. Eng. A 309–310 (2001) 468.10.1016/S0921-5093(00)01703-2Search in Google Scholar

34 Stach, E.A.; Dahmen, U.; Nix, W.D.: Mater. Res. Soc. Symp. Proc. 619 (2000) 27.10.1557/PROC-619-27Search in Google Scholar

35 Ernst, F.; Raj, R.; Rühle, M.: Z. Metallkd. 12 (1999) 961.Search in Google Scholar

36 Mader, W.: Z. Metallkd. 80 (1989) 139.Search in Google Scholar

37 Gutkin, M.Y.; Militzer, M.; Romanov, A.E.; Vladimirov, V.I.: Phys. Stat. Sol. (a) 113 (1989) 337.10.1002/pssa.2211130211Search in Google Scholar

38 Vellinga, P.; De Hosson, J.T.M.; Vitek, V.: Acta Mater. 45 (1997) 1525.10.1016/S1359-6454(96)00279-0Search in Google Scholar

39 Romanov, A.E.; Wagner, T.; Rühle, M.: Scripta Mater. 38 (1998) 869.10.1016/S1359-6462(97)00570-8Search in Google Scholar

40 Keller, R.R.; Phelps, J.M.; Read, D.T.: Mater. Sci. Eng. A 214 (1996) 42.10.1016/0921-5093(96)10253-7Search in Google Scholar

41 Liu, X.H.; Ross, F.M.; Schwarz, K.W.: Mater. Res. Soc. Symp. Proc. 673 (2001) P4.2.1.10.1557/PROC-673-P4.2Search in Google Scholar

42 Courtney, T.H.: Mechanical Behavior of Materials, McGraw-Hill, Singapore (1990) 171.Search in Google Scholar

43 von Blanckenhagen, B.; Gumbsch, P.; Arzt, E.: Mater. Res. Soc. Symp. Proc. 673 (2001) P2.3.1.10.1557/PROC-673-P2.3Search in Google Scholar

44 Krämer, S.; Mayer, J.; Witt, C.; Weickenmeier, A.; Rühle, M.: Ultramicroscopy 81 (2000) 245.10.1016/S0304-3991(99)00191-6Search in Google Scholar

45 Spolenak, R.; Barr, D.L.; Gross, M.E.; Evans-Lutterodt, K.; Brown, W.L.; Tamura, N.; Macdowell, A.A.; Celestre, R.S.; Padmore, H.A.; Valek, B.C. Bravman, J.C.; Flinn, P.; Marieb, T.; Keller, R. R.; Batterman, B.W.; Patel, J. R.: Mater. Res. Soc. Symp. Proc. 612 (2000) D10.3.1.10.1557/PROC-612-D10.3.1Search in Google Scholar

46 Gao, H.; Zhang, L.; Baker, S.P.: Mater. Res. Soc. Symp. Proc. 673 (2001) P6.6.1.10.1557/PROC-673-P6.6Search in Google Scholar
Received: 2002-02-25
Published Online: 2022-01-31

© 2002 Carl Hanser Verlag, München

Articles in the same Issue

  1. Frontmatter
  2. Editorial
  3. Editorial
  4. Max-Planck-Institut für Metallforschung
  5. Articles/Aufsätze
  6. Towards a micromechanical understanding of biological surface devices
  7. Solid state phase transformation kinetics: a modular transformation model
  8. Electronic structure investigations of Ni and Cr films on (100)SrTiO3 substrates using electron energy-loss spectroscopy
  9. Surface magnetization reversal of sputtered CrO2
  10. Magnetic imaging with full-field soft X-ray microscopy
  11. Dislocation dynamics in sub-micron confinement: recent progress in Cu thin film plasticity
  12. Fatigue behavior of polycrystalline thin copper films
  13. Grain growth in magnetron-sputtered nickel films
  14. Thin Pd films on SrTiO3 (001) substrates: ab initio local-density-functional theory
  15. Coupled grain boundary and surface diffusion in a polycrystalline thin film constrained by substrate
  16. Gallium segregation at grain boundaries in aluminium
  17. Current work at the Stuttgart UHV diffusion bonding facility
  18. Bonding between Cu and α-Al2O3
  19. Compressive deformation of niobium sandwich-bonded to alumina
  20. SiO2-coated carbon nanotubes: theory and experiment
  21. Simulation of solidification structures of binary alloys
  22. Gaseous nitriding of iron-chromium alloys
  23. Deposition of ceramic materials from aqueous solution induced by organic templates
  24. Notifications/Mitteilungen
  25. Personen
  26. Books
  27. Information
  28. DGM Further Training
https://doi.org/10.3139/ijmr-2002-0067
Keywords for this article
Thin film plasticity; Discrete dislocation dynamics; Constrained diffusional creep; In situ TEM; Thermal stress

Articles in the same Issue

  1. Frontmatter
  2. Editorial
  3. Editorial
  4. Max-Planck-Institut für Metallforschung
  5. Articles/Aufsätze
  6. Towards a micromechanical understanding of biological surface devices
  7. Solid state phase transformation kinetics: a modular transformation model
  8. Electronic structure investigations of Ni and Cr films on (100)SrTiO3 substrates using electron energy-loss spectroscopy
  9. Surface magnetization reversal of sputtered CrO2
  10. Magnetic imaging with full-field soft X-ray microscopy
  11. Dislocation dynamics in sub-micron confinement: recent progress in Cu thin film plasticity
  12. Fatigue behavior of polycrystalline thin copper films
  13. Grain growth in magnetron-sputtered nickel films
  14. Thin Pd films on SrTiO3 (001) substrates: ab initio local-density-functional theory
  15. Coupled grain boundary and surface diffusion in a polycrystalline thin film constrained by substrate
  16. Gallium segregation at grain boundaries in aluminium
  17. Current work at the Stuttgart UHV diffusion bonding facility
  18. Bonding between Cu and α-Al2O3
  19. Compressive deformation of niobium sandwich-bonded to alumina
  20. SiO2-coated carbon nanotubes: theory and experiment
  21. Simulation of solidification structures of binary alloys
  22. Gaseous nitriding of iron-chromium alloys
  23. Deposition of ceramic materials from aqueous solution induced by organic templates
  24. Notifications/Mitteilungen
  25. Personen
  26. Books
  27. Information
  28. DGM Further Training
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