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Bonding between Cu and α-Al2O3

  • Min Gao EMAIL logo , Christina Scheu , Thomas Wagner , Wolfgang Kurtz and Manfred Rühle
Published/Copyright: January 31, 2022
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International Journal of Materials Research
From the journal International Journal of Materials Research Volume 93 Issue 5

Abstract

This ongoing study aims to investigate systematically the influence of surface preparation methods on the bonding between Cu and α-Al2O3. High-spatial-resolution electron energy-loss spectroscopy and high-resolution transmission electron microscopy were used to study Cu/α-Al2O3 interfaces produced by molecular beam epitaxy and diffusion bonding. Our results show that the preparation of the Al2O3 surface can affect the interfacial bonding considerably. Only very weak adhesion between Cu and Al2O3 could be obtained for an Al2O3 substrate subjected to a chemical cleaning procedure followed by annealing. Ar+ ion pre-sputtering of the Al2O3 led to much stronger adhesion. Intermetallic-like interfacial bonding was observed in the samples on Al2O3 substrates annealed in ultra-high vacuum after pre-sputtering; whilst in the samples on Al2O3 substrates annealed in oxygen after the pre-sputtering, no significant bonding formed. High temperature and pressure applied in diffusion bonding production were not found to be determining factors for the interfacial bonding.

Keywords: Cu/α-Al2O3 interfaces; α-Al2O3 surface preparation; Electron energy-loss spectroscopy; Transmission electron microscopy
Dr. Min Gao Max-Planck-Institut für Metallforschung Heisenbergstr. 3, D-70569 Stuttgart, Germany Tel: +49 711 689 3684 Fax: +49 711 689 3512

  1. We thank M. Sycha and U. Salzberger for their excellent TEM specimen preparation. The authors wish to thank Dr. H. Lamparter and G. Maier for useful discussion on the X-ray diffraction experiments and to thank R. Höschen and Dr. F. Phillipp for the help at the ARM. The MBE samples were grown by M. Pudleiner. We appreciate Dr. A. Tomsia and Dr. Q. Fu for their helpful discussions. Thanks also to Dr. I. MacLaren for improving the English. M. G. wishes to thank the Alexander von Humboldt society for financial support.

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Received: 2002-02-28
Published Online: 2022-01-31

© 2002 Carl Hanser Verlag, München

Articles in the same Issue

  1. Frontmatter
  2. Editorial
  3. Editorial
  4. Max-Planck-Institut für Metallforschung
  5. Articles/Aufsätze
  6. Towards a micromechanical understanding of biological surface devices
  7. Solid state phase transformation kinetics: a modular transformation model
  8. Electronic structure investigations of Ni and Cr films on (100)SrTiO3 substrates using electron energy-loss spectroscopy
  9. Surface magnetization reversal of sputtered CrO2
  10. Magnetic imaging with full-field soft X-ray microscopy
  11. Dislocation dynamics in sub-micron confinement: recent progress in Cu thin film plasticity
  12. Fatigue behavior of polycrystalline thin copper films
  13. Grain growth in magnetron-sputtered nickel films
  14. Thin Pd films on SrTiO3 (001) substrates: ab initio local-density-functional theory
  15. Coupled grain boundary and surface diffusion in a polycrystalline thin film constrained by substrate
  16. Gallium segregation at grain boundaries in aluminium
  17. Current work at the Stuttgart UHV diffusion bonding facility
  18. Bonding between Cu and α-Al2O3
  19. Compressive deformation of niobium sandwich-bonded to alumina
  20. SiO2-coated carbon nanotubes: theory and experiment
  21. Simulation of solidification structures of binary alloys
  22. Gaseous nitriding of iron-chromium alloys
  23. Deposition of ceramic materials from aqueous solution induced by organic templates
  24. Notifications/Mitteilungen
  25. Personen
  26. Books
  27. Information
  28. DGM Further Training
https://doi.org/10.3139/ijmr-2002-0074
Keywords for this article
Cu/α-Al2O3 interfaces; α-Al2O3 surface preparation; Electron energy-loss spectroscopy; Transmission electron microscopy

Articles in the same Issue

  1. Frontmatter
  2. Editorial
  3. Editorial
  4. Max-Planck-Institut für Metallforschung
  5. Articles/Aufsätze
  6. Towards a micromechanical understanding of biological surface devices
  7. Solid state phase transformation kinetics: a modular transformation model
  8. Electronic structure investigations of Ni and Cr films on (100)SrTiO3 substrates using electron energy-loss spectroscopy
  9. Surface magnetization reversal of sputtered CrO2
  10. Magnetic imaging with full-field soft X-ray microscopy
  11. Dislocation dynamics in sub-micron confinement: recent progress in Cu thin film plasticity
  12. Fatigue behavior of polycrystalline thin copper films
  13. Grain growth in magnetron-sputtered nickel films
  14. Thin Pd films on SrTiO3 (001) substrates: ab initio local-density-functional theory
  15. Coupled grain boundary and surface diffusion in a polycrystalline thin film constrained by substrate
  16. Gallium segregation at grain boundaries in aluminium
  17. Current work at the Stuttgart UHV diffusion bonding facility
  18. Bonding between Cu and α-Al2O3
  19. Compressive deformation of niobium sandwich-bonded to alumina
  20. SiO2-coated carbon nanotubes: theory and experiment
  21. Simulation of solidification structures of binary alloys
  22. Gaseous nitriding of iron-chromium alloys
  23. Deposition of ceramic materials from aqueous solution induced by organic templates
  24. Notifications/Mitteilungen
  25. Personen
  26. Books
  27. Information
  28. DGM Further Training
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