Startseite Influence of external and internal length scale on the flow stress of copper
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Influence of external and internal length scale on the flow stress of copper

  • Daniel Kiener , Martin Rester , Stefan Scheriau , Bo Yang , Reinhard Pippan und Gerhard Dehm
Veröffentlicht/Copyright: 23. Mai 2013
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Abstract

The flow stress of bulk specimens is known to depend on the microstructure. With a reduction of specimen dimensions into the micrometer and nanometer regime, specimen size-effects also influence the mechanical properties. We characterized the size-dependent flow stress of copper over more than three orders of magnitude, starting from several tens of micrometers down to a few tens of nanometers. For this purpose nanoindentation, micro-compression, and tensile testing experiments were performed. Additionally, different grain sizes were generated by severe plastic deformation. The observed increase in flow stress with reduced critical dimension is discussed with respect to the different stress states and microstructures present in the reported experiments. The mechanism controlling deformation changes from dislocation pile-up for critical dimensions > 1 μm via a transition regime (1 μm > critical dimensions > 100 nm) to dislocation nucleation for critical dimensions < 100 nm.


* Correspondence address, DI Daniel Kiener, Materials Center Leoben, Forschungs GmbH, Roseggerstr. 12, A-8700 Leoben, Austria, Tel.: +43 3842 804 112, Fax: +43 3842 804 116, E-mail:

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Received: 2007-4-5
Accepted: 2007-7-12
Published Online: 2013-05-23
Published in Print: 2007-11-01

© 2007, Carl Hanser Verlag, München

Artikel in diesem Heft

  1. Contents
  2. Contents
  3. Editorial
  4. Professor Dr. phil. Dr. techn. e. h. Hellmut F. Fischmeister
  5. Basic
  6. Compressive deformation of lamellar microstructures – a short review
  7. Influence of external and internal length scale on the flow stress of copper
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  9. Combined ab-initio and N-K, Ti-L2,3, V-L2,3 electron energy-loss near edge structure studies for TiN and VN films
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  12. Relaxation of semiconductor nanostructures using molecular dynamics with analytic bond order potentials*
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  19. Experimental studies and thermodynamic simulation of phase transformations in high Nb containing γ-TiAl based alloys
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