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Polyetheretherketone Films with Low Thermal Expansion for Flexible Printed Circuit Boards

  • C. Seidel und H. Muenstedt
Veröffentlicht/Copyright: 6. April 2013
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International Polymer Processing
Aus der Zeitschrift International Polymer Processing Band 23 Heft 1

Abstract

Rigid and flexible circuit boards consist of layers of different materials. Particularly, the different thermal expansion coefficients of thermoplastic polymers and metals can lead to problems during application. The investigations presented are focused on the high-temperature thermoplastic polyetheretherketone (PEEK), as it has a remarkable potential for novel flexible circuit boards. The work shows the significant thermal expansion reductions that can be reached in a thermoplastic polyetheretherketone (PEEK) film by the incorporation of different contents of calcium carbonate or talc fillers and compares their effectiveness. Particularly the influence of filler geometry on the thermal expansion is studied in detail. The effect of the filling on mechanical properties and the dimensional stability of the PEEK films under thermal load is investigated quantitatively.

∗ Mail address: Helmut Muenstedt, Institute of Polymer Materials, Department of Materials Science, Friedrich-Alexander-University Erlangen – Nuremberg, D-91058 Erlangen, Germany. E-mail:

References

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Received: 2007-5-20
Accepted: 2007-11-8
Published Online: 2013-04-06
Published in Print: 2008-03-01

© 2008, Carl Hanser Verlag, Munich

Artikel in diesem Heft

  1. Contents
  2. Contents
  3. Regular Contributed Articles
  4. The Dynamic Apparent Viscosity of Polymer Melts During Pulsatile Extrusion Flow with Vibration Force Field
  5. Generation of Microcellular Foams by Supercritical Carbon Dioxidein a PMMA Compound
  6. Influence of Uniaxial Extension on the Mechanical Properties of PET and PEN Films
  7. Analysis of the Isothermal Compression in Nanoimprint Lithography Assuming a Power-Law Fluid
  8. Non-Isothermal Simulation of the Film Blowing Process Using Multi-Mode Extended Pom-Pom Model
  9. Flow Analysis of Flat Spiral Dies and Comparison with Cylindrical Spiral Mandrel Dies
  10. Development of Polymer Blend Morphology along an Extruder with Different Screw Geometries
  11. A Mechanical Model for Stress Developmentin PA12 Tube Extrusion
  12. Shrinkage Analysis on Convex Shellby Injection Molding
  13. Melting Mechanism of Thermoplastic Elastomers and Comparison to Polyolefin Thermoplastic Melting Studies in a Single Screw Extruder
  14. Thermal Degradation of Meta- and Para-Aramid Fibers in Different Atmospheres
  15. Experimental Studies on Screw Characteristics in Closely Intermeshing Counter-rotating Twin Screw Extruder
  16. Experimental Analysis of Heat Transfer in Rotational Molding Process
  17. Polyetheretherketone Films with Low Thermal Expansion for Flexible Printed Circuit Boards
  18. Experimental Study and Modeling of Flow Behavior and Orientation Kinetics of Layered Silicate/Polypropylene Nanocomposites in Start-up of Shear Flows
  19. Polystyrene/Phosphonium Organoclay Nanocomposites by Melt Compounding
  20. PPS News
  21. PPS News
  22. Seikei-Kakou Abstracts
  23. Seikei-Kakou Abstracts
https://doi.org/10.3139/217.2080

Artikel in diesem Heft

  1. Contents
  2. Contents
  3. Regular Contributed Articles
  4. The Dynamic Apparent Viscosity of Polymer Melts During Pulsatile Extrusion Flow with Vibration Force Field
  5. Generation of Microcellular Foams by Supercritical Carbon Dioxidein a PMMA Compound
  6. Influence of Uniaxial Extension on the Mechanical Properties of PET and PEN Films
  7. Analysis of the Isothermal Compression in Nanoimprint Lithography Assuming a Power-Law Fluid
  8. Non-Isothermal Simulation of the Film Blowing Process Using Multi-Mode Extended Pom-Pom Model
  9. Flow Analysis of Flat Spiral Dies and Comparison with Cylindrical Spiral Mandrel Dies
  10. Development of Polymer Blend Morphology along an Extruder with Different Screw Geometries
  11. A Mechanical Model for Stress Developmentin PA12 Tube Extrusion
  12. Shrinkage Analysis on Convex Shellby Injection Molding
  13. Melting Mechanism of Thermoplastic Elastomers and Comparison to Polyolefin Thermoplastic Melting Studies in a Single Screw Extruder
  14. Thermal Degradation of Meta- and Para-Aramid Fibers in Different Atmospheres
  15. Experimental Studies on Screw Characteristics in Closely Intermeshing Counter-rotating Twin Screw Extruder
  16. Experimental Analysis of Heat Transfer in Rotational Molding Process
  17. Polyetheretherketone Films with Low Thermal Expansion for Flexible Printed Circuit Boards
  18. Experimental Study and Modeling of Flow Behavior and Orientation Kinetics of Layered Silicate/Polypropylene Nanocomposites in Start-up of Shear Flows
  19. Polystyrene/Phosphonium Organoclay Nanocomposites by Melt Compounding
  20. PPS News
  21. PPS News
  22. Seikei-Kakou Abstracts
  23. Seikei-Kakou Abstracts
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