Home Analysis of the Isothermal Compression in Nanoimprint Lithography Assuming a Power-Law Fluid
Article
Licensed
Unlicensed Requires Authentication

Analysis of the Isothermal Compression in Nanoimprint Lithography Assuming a Power-Law Fluid

  • I.-C. Hsin and W.-B. Young
Published/Copyright: April 6, 2013
Become an author with De Gruyter Brill

Abstract

One of the choices for defining a nano pattern in micro fabrication is to use the nanoimprint lithography. This method is also known as a hot embossing lithography due to its inherited process technique from the compression process. It is important to determine the appropriate conditions of pressure, temperature, and time in the nanoimprint lithography process. To determine the right conditions for nanoimprint lithography, one has to understand the polymer flow behavior during the imprinting process. In this study, a simplified analytical model was developed based on a power-law fluid to predict the polymer flow during the imprinting process. Under a constant imprint force, the imprint depth on a polymer film can be predicted using this model. Experimental tests were also conducted to verify the results. It was demonstrated that the model can provide reasonable results on the imprint depth.


Mail address: Wen-Bin Young, Department of Aeronautics and Astronautics, National Cheng Kung University, Tainan, Taiwan, R.O.C. E-mail:

References

Chou, S. Y., et al., “Imprint Lithography with 25-Nanometer Resolution”, Science, 272, 8587 (1996)10.1126/science.272.5258.85Search in Google Scholar

C-Mold Database, 2000Search in Google Scholar

Heidari, B., et al., “Large Scale Nanolithography Using Nanoimprint Lithography”, J. Vac. Sci. Technol. B, 17, 29612964 (1999)10.1116/1.590934Search in Google Scholar

Heyderman, L. J., et al., “Flow Behaviour of Thin Polymer Films Used for Hot Embossing Lithography”, Microelectron. Eng., 54, 229245 (2000)10.1016/S0167-9317(00)00414-7Search in Google Scholar

Hirai, Y., et al., “Study of the Resist Deformation in Nanoimprint Lithography”, J. Vac. Sci. Technol. B, 19,(6), 28112815 (2001)10.1116/1.1415510Search in Google Scholar

Hirai, Y., et al., “Defect analysis in Thermal Nanoimprint Lithography”, J. Vac. Sci. Technol. B, 21 (6), 27652770 (2003)10.1116/1.1629289Search in Google Scholar

Juang, Y. J., et al., “Hot Embossing in Microfabrication. Part I: Experimental”, Polym. Eng. Sci., 42, 539550 (2002a)10.1002/pen.10970Search in Google Scholar

Juang, Y. J., et al., “Hot Embossing in Microfabrication. Part II: Rheological Characterization and Process Analysis”, Polym. Eng. Sci., 42, 551566 (2002b)10.1002/pen.10971Search in Google Scholar

Khang, D. Y., Lee, H. H., “Wafer-scale Sub-micron Lithography”, Appl. Phys. Lett., 75, 25992601 (1999)10.1063/1.125090Search in Google Scholar

Rowland, H. D., et al., “Impact of Polymer Film Thickness and Cavity Size on Polymer Flow during Embossing: Toward Process Design Rules for Nanoimprint Lithography”, J. Micromech. Microeng., 15, 24142425 (2005)10.1088/0960-1317/15/12/025Search in Google Scholar

Scheer, H. C., et al., “Problems of the Nanoimprinting Technique for Nanometer Scale Pattern Definition”, J. Vac. Sci. Technol. B, 16, 39173921 (1998)10.1116/1.590436Search in Google Scholar

Scheer, H. C., Schulz, H., “A contribution to the flow behaviour of thin polymer films during hot embossing lithography”, Microelectron. Eng., 56, 311332 (2001)10.1016/S0167-9317(01)00569-XSearch in Google Scholar

Schift, H., et al., “Nanostructuring of Polymers and Fabrication of Interdigitated Electrodes by Hot Embossing Lithography”, Microelectron. Eng., 46, 121124 (1999)10.1016/S0167-9317(99)00030-1Search in Google Scholar

Schulz, H., et al., “Local Mass Transport and Its Effect on Global Pattern Replication during Hot Embossing”, Microelectron. Eng., 67-68, 657663 (2003)10.1016/S0167-9317(03)00128-XSearch in Google Scholar

Young, W. B., “Analysis of the Nanoimprint Lithography with A Viscous Model”, Microelectron. Eng., 77, 405411 (2005)10.1016/j.mee.2005.01.024Search in Google Scholar

Received: 2006-9-4
Accepted: 2007-10-30
Published Online: 2013-04-06
Published in Print: 2008-03-01

© 2008, Carl Hanser Verlag, Munich

Articles in the same Issue

  1. Contents
  2. Contents
  3. Regular Contributed Articles
  4. The Dynamic Apparent Viscosity of Polymer Melts During Pulsatile Extrusion Flow with Vibration Force Field
  5. Generation of Microcellular Foams by Supercritical Carbon Dioxidein a PMMA Compound
  6. Influence of Uniaxial Extension on the Mechanical Properties of PET and PEN Films
  7. Analysis of the Isothermal Compression in Nanoimprint Lithography Assuming a Power-Law Fluid
  8. Non-Isothermal Simulation of the Film Blowing Process Using Multi-Mode Extended Pom-Pom Model
  9. Flow Analysis of Flat Spiral Dies and Comparison with Cylindrical Spiral Mandrel Dies
  10. Development of Polymer Blend Morphology along an Extruder with Different Screw Geometries
  11. A Mechanical Model for Stress Developmentin PA12 Tube Extrusion
  12. Shrinkage Analysis on Convex Shellby Injection Molding
  13. Melting Mechanism of Thermoplastic Elastomers and Comparison to Polyolefin Thermoplastic Melting Studies in a Single Screw Extruder
  14. Thermal Degradation of Meta- and Para-Aramid Fibers in Different Atmospheres
  15. Experimental Studies on Screw Characteristics in Closely Intermeshing Counter-rotating Twin Screw Extruder
  16. Experimental Analysis of Heat Transfer in Rotational Molding Process
  17. Polyetheretherketone Films with Low Thermal Expansion for Flexible Printed Circuit Boards
  18. Experimental Study and Modeling of Flow Behavior and Orientation Kinetics of Layered Silicate/Polypropylene Nanocomposites in Start-up of Shear Flows
  19. Polystyrene/Phosphonium Organoclay Nanocomposites by Melt Compounding
  20. PPS News
  21. PPS News
  22. Seikei-Kakou Abstracts
  23. Seikei-Kakou Abstracts
Downloaded on 27.9.2025 from https://www.degruyterbrill.com/document/doi/10.3139/217.1008/html
Scroll to top button