Analysis of the Isothermal Compression in Nanoimprint Lithography Assuming a Power-Law Fluid
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I.-C. Hsin
Abstract
One of the choices for defining a nano pattern in micro fabrication is to use the nanoimprint lithography. This method is also known as a hot embossing lithography due to its inherited process technique from the compression process. It is important to determine the appropriate conditions of pressure, temperature, and time in the nanoimprint lithography process. To determine the right conditions for nanoimprint lithography, one has to understand the polymer flow behavior during the imprinting process. In this study, a simplified analytical model was developed based on a power-law fluid to predict the polymer flow during the imprinting process. Under a constant imprint force, the imprint depth on a polymer film can be predicted using this model. Experimental tests were also conducted to verify the results. It was demonstrated that the model can provide reasonable results on the imprint depth.
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© 2008, Carl Hanser Verlag, Munich
Articles in the same Issue
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- Contents
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- The Dynamic Apparent Viscosity of Polymer Melts During Pulsatile Extrusion Flow with Vibration Force Field
- Generation of Microcellular Foams by Supercritical Carbon Dioxidein a PMMA Compound
- Influence of Uniaxial Extension on the Mechanical Properties of PET and PEN Films
- Analysis of the Isothermal Compression in Nanoimprint Lithography Assuming a Power-Law Fluid
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- Flow Analysis of Flat Spiral Dies and Comparison with Cylindrical Spiral Mandrel Dies
- Development of Polymer Blend Morphology along an Extruder with Different Screw Geometries
- A Mechanical Model for Stress Developmentin PA12 Tube Extrusion
- Shrinkage Analysis on Convex Shellby Injection Molding
- Melting Mechanism of Thermoplastic Elastomers and Comparison to Polyolefin Thermoplastic Melting Studies in a Single Screw Extruder
- Thermal Degradation of Meta- and Para-Aramid Fibers in Different Atmospheres
- Experimental Studies on Screw Characteristics in Closely Intermeshing Counter-rotating Twin Screw Extruder
- Experimental Analysis of Heat Transfer in Rotational Molding Process
- Polyetheretherketone Films with Low Thermal Expansion for Flexible Printed Circuit Boards
- Experimental Study and Modeling of Flow Behavior and Orientation Kinetics of Layered Silicate/Polypropylene Nanocomposites in Start-up of Shear Flows
- Polystyrene/Phosphonium Organoclay Nanocomposites by Melt Compounding
- PPS News
- PPS News
- Seikei-Kakou Abstracts
- Seikei-Kakou Abstracts
Articles in the same Issue
- Contents
- Contents
- Regular Contributed Articles
- The Dynamic Apparent Viscosity of Polymer Melts During Pulsatile Extrusion Flow with Vibration Force Field
- Generation of Microcellular Foams by Supercritical Carbon Dioxidein a PMMA Compound
- Influence of Uniaxial Extension on the Mechanical Properties of PET and PEN Films
- Analysis of the Isothermal Compression in Nanoimprint Lithography Assuming a Power-Law Fluid
- Non-Isothermal Simulation of the Film Blowing Process Using Multi-Mode Extended Pom-Pom Model
- Flow Analysis of Flat Spiral Dies and Comparison with Cylindrical Spiral Mandrel Dies
- Development of Polymer Blend Morphology along an Extruder with Different Screw Geometries
- A Mechanical Model for Stress Developmentin PA12 Tube Extrusion
- Shrinkage Analysis on Convex Shellby Injection Molding
- Melting Mechanism of Thermoplastic Elastomers and Comparison to Polyolefin Thermoplastic Melting Studies in a Single Screw Extruder
- Thermal Degradation of Meta- and Para-Aramid Fibers in Different Atmospheres
- Experimental Studies on Screw Characteristics in Closely Intermeshing Counter-rotating Twin Screw Extruder
- Experimental Analysis of Heat Transfer in Rotational Molding Process
- Polyetheretherketone Films with Low Thermal Expansion for Flexible Printed Circuit Boards
- Experimental Study and Modeling of Flow Behavior and Orientation Kinetics of Layered Silicate/Polypropylene Nanocomposites in Start-up of Shear Flows
- Polystyrene/Phosphonium Organoclay Nanocomposites by Melt Compounding
- PPS News
- PPS News
- Seikei-Kakou Abstracts
- Seikei-Kakou Abstracts