Home Polyetheretherketone Films with Low Thermal Expansion for Flexible Printed Circuit Boards
Article
Licensed
Unlicensed Requires Authentication

Polyetheretherketone Films with Low Thermal Expansion for Flexible Printed Circuit Boards

  • C. Seidel and H. Muenstedt
Published/Copyright: April 6, 2013
Become an author with De Gruyter Brill

Abstract

Rigid and flexible circuit boards consist of layers of different materials. Particularly, the different thermal expansion coefficients of thermoplastic polymers and metals can lead to problems during application. The investigations presented are focused on the high-temperature thermoplastic polyetheretherketone (PEEK), as it has a remarkable potential for novel flexible circuit boards. The work shows the significant thermal expansion reductions that can be reached in a thermoplastic polyetheretherketone (PEEK) film by the incorporation of different contents of calcium carbonate or talc fillers and compares their effectiveness. Particularly the influence of filler geometry on the thermal expansion is studied in detail. The effect of the filling on mechanical properties and the dimensional stability of the PEEK films under thermal load is investigated quantitatively.


Mail address: Helmut Muenstedt, Institute of Polymer Materials, Department of Materials Science, Friedrich-Alexander-University Erlangen – Nuremberg, D-91058 Erlangen, Germany. E-mail:

References

Balch, D. K.et al., “Thermal Expansion of Metals Reinforced with Ceramic Particles and Microcellular Foams”, Metallurgical and Materials Transactions A, A 27, 37003717 (1996)10.1007/BF02595462Search in Google Scholar

Gilleo, K.: Handbook of Flexible Circuits, Van Nostrand Reinhold, New York (1992)Search in Google Scholar

Gurley, S.: Flexible circuits, Dekker, New York (1984)Search in Google Scholar

IPC-FC-241 Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Wiring. The Institute for Interconnecting and Packaging Electronic Circuits, Northbrook (1995)Search in Google Scholar

Kaji, M., et al., “Synthesis of a Novel Epoxy Resin containing Pyrene Moiety and Thermal Propeties of its cured Polymer with Phenol NovolacJ. Appl. Polym. Sci., 75, 528535 (2000)10.1002/(SICI)1097-4628(20000124)75:4<528::AID-APP8>3.0.CO;2-ASearch in Google Scholar

Katz, H. S., Milewski, J. V.: Handbook of Fillers and Reinforcements for Plastics, Van Nostrand Reinhold, New York (1978)Search in Google Scholar

Schlumpf, H.-P., Füllstoffe“, Kunststoffe, 77, 10921094 (1987)Search in Google Scholar

Seidel, C., et al., “Flexible Printed Circuits – High-temperature Thermoplastic FilmsKunststoffe plast europe, 10, 201205 (2005)Search in Google Scholar

Seidel, C., et al., “Surface Modification of Films of Various High Temperature Resistant ThermoplasticsJournal of Adhesion Science and Technology, 21, 423439 (2007)10.1163/156856107780474966Search in Google Scholar

Thompson, D., et al., “W-Band Characterization of Finite Ground Coplanar Transmission Lines on Liquid Crystal Polymer (LCP) Substrates”, Georgia Institute of Technology, Atlanta (2003)Search in Google Scholar

Weiß, C., Münstedt, H., “Surface Modification of Polyetheretherketone (PEEK) Films for Flexible Printed Circuit BoardsThe Journal of Adhesion, 78, 507519 (2002)10.1080/00218460213733Search in Google Scholar

Wong, C. P., Raja, S. B., “Thermal Conductivity, Elastic Modulus, and Coefficient of Thermal Expansion of Polymer Composites Filled with Ceramic Particles for Electronic Packaging”, J. Appl. Polym. Sci., 74, 33963403 (1999)10.1002/(SICI)1097-4628(19991227)74:14<3396::AID-APP13>3.0.CO;2-3Search in Google Scholar

Yu, S., Hing, P., Hu, X., “Thermal Expansion Behavior of Polystyrene-Aluminium Nitride CompositesJ. Phys. D: Appl. Phys., 33, 16061610 (2000)10.1088/0022-3727/33/13/308Search in Google Scholar

Zweifel, H.: Plastics Additives Handbook, 5th Edition, Hanser, Munich (2001)Search in Google Scholar

Received: 2007-5-20
Accepted: 2007-11-8
Published Online: 2013-04-06
Published in Print: 2008-03-01

© 2008, Carl Hanser Verlag, Munich

Articles in the same Issue

  1. Contents
  2. Contents
  3. Regular Contributed Articles
  4. The Dynamic Apparent Viscosity of Polymer Melts During Pulsatile Extrusion Flow with Vibration Force Field
  5. Generation of Microcellular Foams by Supercritical Carbon Dioxidein a PMMA Compound
  6. Influence of Uniaxial Extension on the Mechanical Properties of PET and PEN Films
  7. Analysis of the Isothermal Compression in Nanoimprint Lithography Assuming a Power-Law Fluid
  8. Non-Isothermal Simulation of the Film Blowing Process Using Multi-Mode Extended Pom-Pom Model
  9. Flow Analysis of Flat Spiral Dies and Comparison with Cylindrical Spiral Mandrel Dies
  10. Development of Polymer Blend Morphology along an Extruder with Different Screw Geometries
  11. A Mechanical Model for Stress Developmentin PA12 Tube Extrusion
  12. Shrinkage Analysis on Convex Shellby Injection Molding
  13. Melting Mechanism of Thermoplastic Elastomers and Comparison to Polyolefin Thermoplastic Melting Studies in a Single Screw Extruder
  14. Thermal Degradation of Meta- and Para-Aramid Fibers in Different Atmospheres
  15. Experimental Studies on Screw Characteristics in Closely Intermeshing Counter-rotating Twin Screw Extruder
  16. Experimental Analysis of Heat Transfer in Rotational Molding Process
  17. Polyetheretherketone Films with Low Thermal Expansion for Flexible Printed Circuit Boards
  18. Experimental Study and Modeling of Flow Behavior and Orientation Kinetics of Layered Silicate/Polypropylene Nanocomposites in Start-up of Shear Flows
  19. Polystyrene/Phosphonium Organoclay Nanocomposites by Melt Compounding
  20. PPS News
  21. PPS News
  22. Seikei-Kakou Abstracts
  23. Seikei-Kakou Abstracts
Downloaded on 26.9.2025 from https://www.degruyterbrill.com/document/doi/10.3139/217.2080/html
Scroll to top button