Polyetheretherketone Films with Low Thermal Expansion for Flexible Printed Circuit Boards
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C. Seidel
Abstract
Rigid and flexible circuit boards consist of layers of different materials. Particularly, the different thermal expansion coefficients of thermoplastic polymers and metals can lead to problems during application. The investigations presented are focused on the high-temperature thermoplastic polyetheretherketone (PEEK), as it has a remarkable potential for novel flexible circuit boards. The work shows the significant thermal expansion reductions that can be reached in a thermoplastic polyetheretherketone (PEEK) film by the incorporation of different contents of calcium carbonate or talc fillers and compares their effectiveness. Particularly the influence of filler geometry on the thermal expansion is studied in detail. The effect of the filling on mechanical properties and the dimensional stability of the PEEK films under thermal load is investigated quantitatively.
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Articles in the same Issue
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- The Dynamic Apparent Viscosity of Polymer Melts During Pulsatile Extrusion Flow with Vibration Force Field
- Generation of Microcellular Foams by Supercritical Carbon Dioxidein a PMMA Compound
- Influence of Uniaxial Extension on the Mechanical Properties of PET and PEN Films
- Analysis of the Isothermal Compression in Nanoimprint Lithography Assuming a Power-Law Fluid
- Non-Isothermal Simulation of the Film Blowing Process Using Multi-Mode Extended Pom-Pom Model
- Flow Analysis of Flat Spiral Dies and Comparison with Cylindrical Spiral Mandrel Dies
- Development of Polymer Blend Morphology along an Extruder with Different Screw Geometries
- A Mechanical Model for Stress Developmentin PA12 Tube Extrusion
- Shrinkage Analysis on Convex Shellby Injection Molding
- Melting Mechanism of Thermoplastic Elastomers and Comparison to Polyolefin Thermoplastic Melting Studies in a Single Screw Extruder
- Thermal Degradation of Meta- and Para-Aramid Fibers in Different Atmospheres
- Experimental Studies on Screw Characteristics in Closely Intermeshing Counter-rotating Twin Screw Extruder
- Experimental Analysis of Heat Transfer in Rotational Molding Process
- Polyetheretherketone Films with Low Thermal Expansion for Flexible Printed Circuit Boards
- Experimental Study and Modeling of Flow Behavior and Orientation Kinetics of Layered Silicate/Polypropylene Nanocomposites in Start-up of Shear Flows
- Polystyrene/Phosphonium Organoclay Nanocomposites by Melt Compounding
- PPS News
- PPS News
- Seikei-Kakou Abstracts
- Seikei-Kakou Abstracts
Articles in the same Issue
- Contents
- Contents
- Regular Contributed Articles
- The Dynamic Apparent Viscosity of Polymer Melts During Pulsatile Extrusion Flow with Vibration Force Field
- Generation of Microcellular Foams by Supercritical Carbon Dioxidein a PMMA Compound
- Influence of Uniaxial Extension on the Mechanical Properties of PET and PEN Films
- Analysis of the Isothermal Compression in Nanoimprint Lithography Assuming a Power-Law Fluid
- Non-Isothermal Simulation of the Film Blowing Process Using Multi-Mode Extended Pom-Pom Model
- Flow Analysis of Flat Spiral Dies and Comparison with Cylindrical Spiral Mandrel Dies
- Development of Polymer Blend Morphology along an Extruder with Different Screw Geometries
- A Mechanical Model for Stress Developmentin PA12 Tube Extrusion
- Shrinkage Analysis on Convex Shellby Injection Molding
- Melting Mechanism of Thermoplastic Elastomers and Comparison to Polyolefin Thermoplastic Melting Studies in a Single Screw Extruder
- Thermal Degradation of Meta- and Para-Aramid Fibers in Different Atmospheres
- Experimental Studies on Screw Characteristics in Closely Intermeshing Counter-rotating Twin Screw Extruder
- Experimental Analysis of Heat Transfer in Rotational Molding Process
- Polyetheretherketone Films with Low Thermal Expansion for Flexible Printed Circuit Boards
- Experimental Study and Modeling of Flow Behavior and Orientation Kinetics of Layered Silicate/Polypropylene Nanocomposites in Start-up of Shear Flows
- Polystyrene/Phosphonium Organoclay Nanocomposites by Melt Compounding
- PPS News
- PPS News
- Seikei-Kakou Abstracts
- Seikei-Kakou Abstracts