Reducing component stress during encapsulation of electronics: a simulative examination of thermoplastic foam injection molding
-
Constantin Ott
und
Dietmar Drummer
Abstract
The direct encapsulation of electronic components is an effective way of protecting components against external influences. In addition to achieving a sufficient protective effect, there are two other big challenges for satisfying the increasing demand for encapsulated circuit boards. The encapsulation process should be both suitable for mass production and offer a low component load. Injection molding is a method with good suitability for large series production but also with typically high component stress. In this article, two aims were pursued: first, the development of a calculation model that allows an estimation of the occurring forces based on process variables and material parameters. Second, the evaluation of a new approach for stress reduction by means of thermoplastic foam injection molding. For this purpose, simulation-based process data was generated with the Moldflow simulation tool. Based on this, component stresses were calculated with the calculation model. The suitability of the new approach was clearly demonstrated and a significant reduction in shear forces during overmolding was achieved. It was possible to demonstrate a process development that makes it possible to meet the two main requirements of direct encapsulation in addition to a high protective effect.
Funding source: Bayerische Forschungsstiftung
Award Identifier / Grant number: AZ-1487-20
-
Author contributions: All the authors have accepted responsibility for the entire content of this submitted manuscript and approved submission.
-
Research funding: The authors thank the Bayerische Forschungsstiftung (BFS) for funding this study within the project Foam-Tight (AZ-1487-20).
-
Conflict of interest statement: The authors declare no conflicts of interest regarding this article.
References
1. AMA Association of Sensor and Measurement eV. Sensor and Measurement Technology Grows Despite Supply Problems and Embargo. Quarterreports 2022 of Association for Sensors + Measurement [Online] 2022. https://www.ama-sensorik.de/en/association/sector-information/quarterreports-2022/(accessed Sep 05, 2022).Suche in Google Scholar
2. Goth, C., Franke, J., Reinhardt, A., Widemann, P. Reliability of molded interconnect devices (MID) protected by encapsulation methods overmolding, potting and coating. In 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), Taipei, October 24–26, 2012.10.1109/IMPACT.2012.6420229Suche in Google Scholar
3. Frey, P., Heinle, M., Drummer, D., Merklein, M. Influence of metal inserts with microformed edges on subsequent injection assembly moulding for media tight electronic systems. In 4th International Conference on New Forming Technology (ICNFT 2015), Glasgow, August 6–9, 2015.10.1051/matecconf/20152109013Suche in Google Scholar
4. Heinle, M., Frey, P., Merklein, M., Drummer, D. Einfluss mikrogeformter Kanten an Metalleinlegern auf die Temperaturwechsel-beständigkeit mediendichter Kunststoff-Metall-Hybriden. Z. Kunststofftechnik 2018, 1, 211–232; https://doi.org/10.3139/o999.03032018.Suche in Google Scholar
5. Frey, P., Heinle, M., Leisen, C., Drummer, D., Merklein, M. Embossing of metal inserts for subsequent assembly injection moulding of media tight electronic systems. Key Eng. Mater. 2015, 639, 99–106; https://doi.org/10.4028/www.scientific.net/kem.639.99.Suche in Google Scholar
6. Kleffel, T., Drummer, D. Electrochemical treatment of metal inserts for subsequent assembly injection molding of tight electronic systems. J. Polym. Eng. 2018, 38, 675–684; https://doi.org/10.1515/polyeng-2017-0432.Suche in Google Scholar
7. Ott, C., Wolf, M., Drummer, D. Media-tight polymer-polymer assemblies by means of sintered powder layer in assembly injection moulding. Procedia Manuf. 2020, 47, 362–367; https://doi.org/10.1016/j.promfg.2020.04.286.Suche in Google Scholar
8. Bonpain, B. Entwicklung und prozesstechnische Analyse eines festen und mediendichten Kunststoff – Metall – Verbundes. Ph.D. Thesis, Technische Universität Dortmund, Dortmund, 2016.Suche in Google Scholar
9. Schulz, T. Methods and materials to achieve tight metal-polymer-composites. In 8th International Congress–Molded Interconnect Devices, Nuremberg-Fuerth, Germany, 2008.Suche in Google Scholar
10. Heinle, C., Vetter, M., Brocka-Krzeminska, Z., Ehrenstein, G. W., Drummer, D. Mediendichte Materialverbunde in mechatronischen Systemen durch Montagespritzguss. Z. Kunststofftechnik 2009, 5, 427–450.Suche in Google Scholar
11. Ott, C., Drummer, D. Low-stress over-molding of media-tight electronics using thermoplastic foam injection molding. Polym. Eng. Sci. 2021, 61, 1518–1528; https://doi.org/10.1002/pen.25672.Suche in Google Scholar
12. Heinle, M. Montagespritzgießen von mechatronischen Komponenten. Ph.D. Thesis, Institute of Polymer Technology, Erlangen, 2014.Suche in Google Scholar
13. Heinle, M., Drummer, D. Measuring mechanical stresses on inserts during injection molding. Adv. Mech. Eng. 2015, 7, 1–6; https://doi.org/10.1177/1687814015584479.Suche in Google Scholar
14. Schreier-Alt, T. Polymerverkapselung mechatronischer Systeme: Charakterisierung durch eingebettete Faser Bragg Gitter Sensoren. Ph.D. Thesis, Technische Universität Berlin, Berlin, 2007.Suche in Google Scholar
15. Henning, C., Bauer, R., Schuhmann, R. Schertest an gelöteten SMD (Chip-Form): Einflüsse auf das testergebnis [Online] 2018. https://www.avt.et.tu-dresden.de/fileadmin/saet/Archiv_2011_2020/Treffen71/Vortrag_4-Henning.pdf(accessed July 25, 2022).Suche in Google Scholar
© 2022 Walter de Gruyter GmbH, Berlin/Boston
Artikel in diesem Heft
- Frontmatter
- Material Properties
- The effect of filler loading and APTES treatment on the performance of PSf/SBA-15 mixed matrix membranes
- Artificial intelligence based prediction models for rubber compounds
- Synthesis and memory properties of a series of novel asymmetric soluble polyimides
- Preparation and Assembly
- Fabrication of high strength and functional GO/PVA/PAN ternary composite fibers by gel spinning
- Polycaprolactone/epoxide-functionalized silica composite microparticles for long-term controlled release of trans-chalcone
- Rapid incorporation of gold nanoparticles onto graphene oxide-polymer nanofiber membranes for photothermally-accelerated water purification
- Sustained oxygen release of hydrogen peroxide-acrylic resin inclusion complex for aquaculture
- Engineering and Processing
- Reducing component stress during encapsulation of electronics: a simulative examination of thermoplastic foam injection molding
- Influence of production process-induced surface topologies at varying roughness depths on the tribological properties of polyamide steel contact
Artikel in diesem Heft
- Frontmatter
- Material Properties
- The effect of filler loading and APTES treatment on the performance of PSf/SBA-15 mixed matrix membranes
- Artificial intelligence based prediction models for rubber compounds
- Synthesis and memory properties of a series of novel asymmetric soluble polyimides
- Preparation and Assembly
- Fabrication of high strength and functional GO/PVA/PAN ternary composite fibers by gel spinning
- Polycaprolactone/epoxide-functionalized silica composite microparticles for long-term controlled release of trans-chalcone
- Rapid incorporation of gold nanoparticles onto graphene oxide-polymer nanofiber membranes for photothermally-accelerated water purification
- Sustained oxygen release of hydrogen peroxide-acrylic resin inclusion complex for aquaculture
- Engineering and Processing
- Reducing component stress during encapsulation of electronics: a simulative examination of thermoplastic foam injection molding
- Influence of production process-induced surface topologies at varying roughness depths on the tribological properties of polyamide steel contact
