Startseite Effects of process conditions on the heat transfer coefficient at the polymer-mold interface and tensile strength of thin-wall injection molding parts
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Effects of process conditions on the heat transfer coefficient at the polymer-mold interface and tensile strength of thin-wall injection molding parts

  • Laiyu Zhu , Liping Min , Xianglin Li , Zhanyu Zhai , Dietmar Drummer und Bingyan Jiang ORCID logo EMAIL logo
Veröffentlicht/Copyright: 11. April 2019
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Abstract

Generally, the strength at the weld line of the injection molded part is very weak. The heat transfer coefficient (HTC) between the polymer melt and the mold cavity surface was analyzed to solve this problem. The surface roughness of the mold cavity and the material of the mold insert were changed to adjust the interface environment between the polymer melt and the mold cavity surface. HTC was obtained by combing the experimental measurement with the theoretical calculation. In the current study, the influence of HTC on the tensile strength of the weld line of the molded specimen was investigated. The results show that the weld line strength of the molded specimen increases with the decrease in HTC between the polymer and the mold cavity surface. Meanwhile, the decrease in the surface roughness of the mold cavity or replacing the mold material with lower thermal conductivity can reduce the value of the HTC between the polymer and the mold effectively and can delay the cooling rate of the hot polymer melt. This provides a new idea to solve thin-wall injection molding weld line defects.

Award Identifier / Grant number: 2012CB025905

Award Identifier / Grant number: 51575540

Award Identifier / Grant number: 51405519

Funding statement: The authors would like to acknowledge the financial support from the National Basic Research Program of China (grant no. 2012CB025905) and the support from the National Natural Science Foundation of China, Funder Id: http://dx.doi.org/10.13039/501100001809 (grant nos. 51575540 and 51405519).

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Received: 2018-11-28
Accepted: 2019-03-17
Published Online: 2019-04-11
Published in Print: 2019-05-01

©2019 Walter de Gruyter GmbH, Berlin/Boston

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