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Kinetics of intermetallic compound layers during initial period of reaction between mild steel and molten aluminum

  • Huan He , Wenqin Gou , Shengxiang Wang , Yu Hou , Chao Ma and Patricio F. Mendez
Published/Copyright: February 25, 2019
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Abstract

Hot dip aluminizing of mild steel at different temperatures was conducted to reveal the influence of reaction temperature and time on interfacial intermetallic compounds (IMCs). Scanning electron microscopy, energy dispersive X-ray spectrometry and X-ray diffraction were employed to investigate the interfacial microstructures. The IMCs of the dipping interface consisted of a thick layer of η-Fe2Al5 between 4.2–132.2 μm next to the steel and a thin layer of θ-Fe4Al13 between 0–5.5 μm close to the aluminum. With increasing dipping temperature and time, the total thickness of IMCs (Fe2Al5 plus Fe4Al13) increased. Specifically, the growth of the Fe2Al5 layer can be described by parabolic rate laws. An activation energy of 93 kJ mol−1 was obtained, combining both the results from the present work and previous studies in the temperature range of 675–900°C. The change in Fe4Al13 thickness is not significant compared with the Fe2Al5. However, the decrease in IMC thickness of the Fe4Al13 with dipping temperature was observed for the first time and had never been reported before. Moreover, it can be clearly observed that the thickness of the Fe4Al13 decreased with dipping time based on the linear fitting results by excluding the result of the initial 1 s. A possible mechanism is that interfacial dynamics and thermodynamics work for the dissolution and decomposition of the Fe4Al13 layer. Higher temperature accelerates the dissolution of the θ layer.


Correspondence address, Dr. Huan He, Department of Mechanical Engineering, Shandong Jiaotong University, 5001 Haitang Road, Changqing District, Jinan, 250357, P.R. China, Tel: +86-531-80687523, Fax: +86-531-80687523, e-mail:

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Received: 2018-07-11
Accepted: 2018-09-11
Published Online: 2019-02-25
Published in Print: 2019-03-13

© 2019, Carl Hanser Verlag, München

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