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Study of the mechanism of ductile-regime grinding of SiCp/Al composites using finite element simulation

  • Shutao Huang , Li Zhou , Xiaolin Yu and Lifu Xu
Published/Copyright: March 26, 2012
Become an author with De Gruyter Brill

Abstract

Based on indentation experiments under different loads, the mechanism of ductile-regime grinding of SiCp/Al composites has been investigated. The factors that influence the ductile-regime removal of SiC particles, such as tip radius of abrasive grains, intrusion depth, and volume fraction of SiC particles, have been analyzed by three-dimensional finite element simulation. The calculation results indicate that a sharp abrasive grain without tip radius cannot produce a plastic deformation region under the indenter and brittle fracture of the SiC particle takes place rather than ductile model of failure. The critical grinding depth of ductile-regime removal decreases with increasing tip radius of abrasive grains, but increases with decreasing SiC particle volume fraction.


2 Correspondence address: Dr. Li Zhou, School of Mechanical EngineeringShenyang Ligong UniversityShenyang, 110159China, Tel.: +86 2413504929566, Fax: +86 2424686105, E-mail:

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Received: 2011-3-8
Accepted: 2012-2-2
Published Online: 2012-03-26
Published in Print: 2012-10-01

© 2012, Carl Hanser Verlag, Munich

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