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Consumption of Cu pad during multiple reflows of Ni-doped SnAgCu solder

  • C. C. Chang , S. C. Yang , Y. J. Chen and C. R. Kao
Published/Copyright: June 11, 2013
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International Journal of Materials Research
From the journal International Journal of Materials Research Volume 102 Issue 5

Abstract

The effects of solder volume and the number of reflows on the Cu consumption rate were studied. Nickel-doped Sn3Ag0.5Cu0.02Ni solder balls of different diameters (300, 400, 600 and 760 μm in diameter) were reflowed over Cu soldering pads with an opening of 600 μm in diameter. The reflow profile had a peak temperature of 235 ± 2°C and a 90 s duration during which the solder was molten. The nominal ramp rate and cooling rate were both 1.5 K s−1. The first reflow consumed the largest amount of Cu, and the subsequent reflows only consumed marginally more Cu. It was argued that the solder joints became saturated with Cu during the first reflow so that during the subsequent reflows the Cu substrates were consumed at markedly reduced rates. The Cu consumption increased with the diameter of the solder balls. This was because a larger amount of Cu was needed in order to saturate a solder joint with a larger solder volume. The doping of Ni did not change the Cu consumption rate despite the fact that the amount of Cu6Sn5 at the interface increased substantially with Ni doping.

Keywords: Dissolution; Intermetallics; Soldering
* Correspondence address, Professor C. R. Kao, 1, Roosevelt Rd, sec. 4 Department of Materials Science and Engineering National Taiwan University, Taipei City, Taiwan Tel./Fax: +886 2 3366 3745 E-mail:

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Received: 2010-6-3
Accepted: 2011-2-24
Published Online: 2013-06-11
Published in Print: 2011-05-01

© 2011, Carl Hanser Verlag, München

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https://doi.org/10.3139/146.110502
Keywords for this article
Dissolution; Intermetallics; Soldering

Articles in the same Issue

  1. Original Contributions
  2. Alloying effect on microstructure and mechanical properties of thermomechanically processed Ni3(Si,Ti) alloys
  3. Contents
  4. Contents
  5. Original Contributions
  6. Neuro-finite element application in material characterization using small punch test
  7. Multi-phase biocomposite material in-situ fabricated by using hydroxyapatite and amorphous nanosilica
  8. Particularities of the formations of bainite and martensite/austenite phase in low carbon low alloy steels during continuous cooling
  9. Texture analysis of polymer modified bitumen images
  10. Influence of nitridation time on microstructure, morphology and optical properties of GaN nanowires by nitridizing Ga2O3/Cr thin films
  11. Deformation behaviour of freestanding single-crystalline Ni3Al-based nanoparticles
  12. Precipitation strengthening in high manganese austenitic TWIP steels
  13. Effects of pre-deformation and subsequent low-temperature annealing on transformation, mechanical properties and shape memory behavior of a Ti-rich TiNi alloy
  14. Enhancement in optical transmission of ZnO: Al film by c-orientation arrayed growth
  15. Physical and mechanical behavior of high strength self-compacting concrete containing ZrO2 nanoparticles
  16. Experimental and numerical studies of metallic powders subjected to cold isostatic pressing
  17. Consumption of Cu pad during multiple reflows of Ni-doped SnAgCu solder
  18. Nanocrystalline CdS thin films prepared by sol-gel spin coating
  19. An energy absorption system based on carbon nanotubes and non-aqueous liquid
  20. People
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