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A comparative study of room-temperature creep in lead-free tin-based solder alloys

  • R. Mahmudi and A. R. Geranmayeh
Published/Copyright: May 15, 2013
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International Journal of Materials Research
From the journal International Journal of Materials Research Volume 101 Issue 2

Abstract

Creep behavior of the tin-based lead-free Sn-0.7Cu, Sn-3.8Ag, Sn-9Zn, Sn-5Sb and Sn-2Bi binary alloys together with pure Sn, as the material for comparison, was studied by impression and indentation creep testing at room temperature. Stress exponent values in the range 3.5 to 14.7, obtained by the two methods, were in good agreement with each other and with those determined by room-temperature creep testing of the same materials reported in the literature. All of the tin-based alloys showed creep resistances higher than pure Sn. Among all tested materials, as indicated by their steady-state creep rates, Sn-2Bi showed the highest creep resistance followed by Sn-5Sb, Sn-9Zn, Sn-3.8Ag, Sn-0.7Cu and pure Sn. Different creep behaviors of the materials were discussed in terms of their microstructural features.

Keywords: Creep; Indentation; Impression; Lead-free solder
∗ Correspondence address, Professor Reza Mahmudi, School of Metallurgical and Materials Engineering University of Tehran Tehran, P. O. Box 11155-4563, Iran Tel.: +98 21 8208 4137 Fax: +98 21 8800 6076 E-mail:

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Received: 2008-5-16
Accepted: 2009-4-15
Published Online: 2013-05-15
Published in Print: 2010-02-01

© 2010, Carl Hanser Verlag, München

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https://doi.org/10.3139/146.110266
Keywords for this article
Creep; Indentation; Impression; Lead-free solder

Articles in the same Issue

  1. Contents
  2. Contents
  3. Editorial
  4. Materials for Information Technology
  5. Feature
  6. Advanced high-k/metal gate stack progress and challenges – a materials and process integration perspective
  7. Spintronics in metallic superconductor/ferromagnet hybrid structures
  8. Graphene metrology and devices
  9. The role of defects in resistively switching chalcogenides
  10. Materials in optical data storage
  11. Scaling effects on microstructure and reliability for Cu interconnects
  12. Effects of e-beam curing on glass structureand mechanical properties of nanoporous organosilicate thin films
  13. Printing materials for electronic devices
  14. Basic
  15. Characterisation of lead – calcium alloys ageing in anisothermal conditions by calorimetric, resistance and hardness in-situ measurements
  16. Thermodynamic predictions of Mg – Al – Ca alloy compositions amenable to semi-solid forming
  17. Capillary equilibrium in a semi-solid Al – Cu slurry
  18. A comparative study of room-temperature creep in lead-free tin-based solder alloys
  19. Modeling creep in a thick composite cylinder subjected to internal and external pressures
  20. Applied
  21. The oxidation behaviour of the 9 % Cr steel P92in CO2- and H2O-rich gases relevant to oxyfuel environments
  22. Effect of thermal and mechanical treatments on the hot working response of Mg-3Sn-1Ca alloy
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  24. Ni2O3-modified TiO2 – xNx as efficientvisible-light photocatalysts
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