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Modeling creep in a thick composite cylinder subjected to internal and external pressures

  • Tejeet Singh and Vinay K. Gupta
Published/Copyright: May 15, 2013
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International Journal of Materials Research
From the journal International Journal of Materials Research Volume 101 Issue 2

Abstract

A mathematical model to describe secondary creep in a thick composite cylinder made of Al–SiCp and subjected to both internal and external pressures has been developed. The creep behavior of the composite has been described by a threshold stress based creep law with a stress exponent of 5. The model developed has been used to investigate the effect of varying size and content of the SiCp dispersoid on the stresses and strain rates in a composite cylinder. It is observed that the stress distributions in the cylinder do not have significant variation with varying size and content of the SiCp. Unlike stresses, the strain rates in the cylinder are reduced to a significant extent by decreasing the size of SiCp and increasing the content of SiCp.

Keywords: Modeling; Second stage creep; Composite; Cylinder; Pressure
∗ Correspondence address, Dr. Vinay K. Gupta Reader (Mechanical Eng.) University College of Eng., Punjabi University, Patiala-147002 (Punjab), India Tel.: +91 175 2280 166 Fax: +91 175 3046 333 E-mail:

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Received: 2008-9-6
Accepted: 2009-4-16
Published Online: 2013-05-15
Published in Print: 2010-02-01

© 2010, Carl Hanser Verlag, München

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https://doi.org/10.3139/146.110273
Keywords for this article
Modeling; Second stage creep; Composite; Cylinder; Pressure

Articles in the same Issue

  1. Contents
  2. Contents
  3. Editorial
  4. Materials for Information Technology
  5. Feature
  6. Advanced high-k/metal gate stack progress and challenges – a materials and process integration perspective
  7. Spintronics in metallic superconductor/ferromagnet hybrid structures
  8. Graphene metrology and devices
  9. The role of defects in resistively switching chalcogenides
  10. Materials in optical data storage
  11. Scaling effects on microstructure and reliability for Cu interconnects
  12. Effects of e-beam curing on glass structureand mechanical properties of nanoporous organosilicate thin films
  13. Printing materials for electronic devices
  14. Basic
  15. Characterisation of lead – calcium alloys ageing in anisothermal conditions by calorimetric, resistance and hardness in-situ measurements
  16. Thermodynamic predictions of Mg – Al – Ca alloy compositions amenable to semi-solid forming
  17. Capillary equilibrium in a semi-solid Al – Cu slurry
  18. A comparative study of room-temperature creep in lead-free tin-based solder alloys
  19. Modeling creep in a thick composite cylinder subjected to internal and external pressures
  20. Applied
  21. The oxidation behaviour of the 9 % Cr steel P92in CO2- and H2O-rich gases relevant to oxyfuel environments
  22. Effect of thermal and mechanical treatments on the hot working response of Mg-3Sn-1Ca alloy
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