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Effect of thermal and mechanical treatments on the hot working response of Mg-3Sn-1Ca alloy

  • Y. V. R. K. Prasad , K. P. Rao , N. Hort and K. U. Kainer
Published/Copyright: May 15, 2013
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International Journal of Materials Research
From the journal International Journal of Materials Research Volume 101 Issue 2

Abstract

The effects of homogenization treatment and high-temperature extrusion on the hot working behavior of Mg-3Sn-1Ca alloy have been studied with a view to find an optimum processing route for the manufacture of wrought products. Processing maps and kinetic parameters have been obtained from the flow stress data recorded in hot compression experiments in the temperature range of 300 – 550 °C and strain rate range of 0.0003 – 10 s– 1. These reveal that the homogenization treatment has only a marginal effect on the hot workability, the result attributable to the high thermal stability of CaMgSn particles in the microstructure. High temperature extrusion, however, lowers the hot working temperature significantly (by about 150 °C) and this has been attributed to grain refinement during primary processing. The mechanisms of hot deformation remained unchanged by the above treatments and the apparent activation energies for hot deformation are higher than those for self-diffusion suggesting that CaMgSn particles in the matrix cause large back-stress.

Keywords: Mg–Sn–Ca alloy; Homogenization; Hot extrusion; Workability optimization; Processing map; Kinetic analysis
∗ Correspondence address, Dr. K.P. Rao Department of Manufacturing Engineering City University of Hong Kong Tat Chee Avenue, Kowloon, Hong Kong Tel.: +852 2788 8409 Fax: +852 2788 8423 E-mail:

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Received: 2008-7-14
Accepted: 2009-3-11
Published Online: 2013-05-15
Published in Print: 2010-02-01

© 2010, Carl Hanser Verlag, München

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https://doi.org/10.3139/146.110269
Keywords for this article
Mg–Sn–Ca alloy; Homogenization; Hot extrusion; Workability optimization; Processing map; Kinetic analysis

Articles in the same Issue

  1. Contents
  2. Contents
  3. Editorial
  4. Materials for Information Technology
  5. Feature
  6. Advanced high-k/metal gate stack progress and challenges – a materials and process integration perspective
  7. Spintronics in metallic superconductor/ferromagnet hybrid structures
  8. Graphene metrology and devices
  9. The role of defects in resistively switching chalcogenides
  10. Materials in optical data storage
  11. Scaling effects on microstructure and reliability for Cu interconnects
  12. Effects of e-beam curing on glass structureand mechanical properties of nanoporous organosilicate thin films
  13. Printing materials for electronic devices
  14. Basic
  15. Characterisation of lead – calcium alloys ageing in anisothermal conditions by calorimetric, resistance and hardness in-situ measurements
  16. Thermodynamic predictions of Mg – Al – Ca alloy compositions amenable to semi-solid forming
  17. Capillary equilibrium in a semi-solid Al – Cu slurry
  18. A comparative study of room-temperature creep in lead-free tin-based solder alloys
  19. Modeling creep in a thick composite cylinder subjected to internal and external pressures
  20. Applied
  21. The oxidation behaviour of the 9 % Cr steel P92in CO2- and H2O-rich gases relevant to oxyfuel environments
  22. Effect of thermal and mechanical treatments on the hot working response of Mg-3Sn-1Ca alloy
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  24. Ni2O3-modified TiO2 – xNx as efficientvisible-light photocatalysts
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