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First observation of a hexagonal close packed metastable intermetallic phase between Cu and Al bilayer films

  • L. Cha , C. Scheu , G. Richter , T. Wagner , S. Sturm and M. Rühle
Published/Copyright: May 23, 2013
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International Journal of Materials Research
From the journal International Journal of Materials Research Volume 98 Issue 8

Abstract

In this paper we describe the structure and formation of a new intermetallic phase in the Cu – Al system, which has not been reported before. The phase was found in Cu/Al bilayer films, which were deposited at room temperature on (0001) sapphire substrates using molecular beam epitaxy. The interfacial intermetallic phase is 8 nm thick, and possesses a hexagonal close-packed structure. The lattice parameters of the phase gradually increase from the near-Cu-side to the near-Al-side. In parallel with the described lattice expansion, the chemical composition of the interlayer also varies from 27 to 58 Al at.% from the near-Cu-side to the near-Al-side. The formation and microstructural characteristics of this new phase are explained by Hume-Rothery laws and Shockley partial dislocations. In addition, in-situ heating experiments were performed in a transmission electron microscope at ∼600 °C to investigate the thermodynamic stability of this new Cu – Al intermetallic phase. During annealing the intermetallic layer disappears and other known equilibrium intermetallic phases develop. This indicates that this new hexagonal close-packed Cu – Al intermetallic phase is metastable.

Keywords: Cu; Al; Interlayer; TEM; Intermetallic phase
* Correspondence address, Dr. Limei Cha, Department Metallurgy physics and materials testing, University of Leoben, Franz-Josefstraße 18, A-8700 Leoben, Austria, Tel.: +43 38 424 024 203, Fax: +43 38 424 024 202, E-mail:

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Received: 2007-2-26
Accepted: 2007-4-26
Published Online: 2013-05-23
Published in Print: 2007-08-01

© 2007, Carl Hanser Verlag, München

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https://doi.org/10.3139/146.101523
Keywords for this article
Cu; Al; Interlayer; TEM; Intermetallic phase

Articles in the same Issue

  1. Contents
  2. Contents
  3. Editorial
  4. Editorial
  5. Basic
  6. In-situ measurement of local strain partitioning in a commercial dual-phase steel
  7. Threshold strength and residual stress analysis of zirconia–alumina laminates
  8. Threshold strength prediction for laminar ceramics from bifurcated crack path simulation
  9. First observation of a hexagonal close packed metastable intermetallic phase between Cu and Al bilayer films
  10. Electric-field induced phase transition in a near-surface layer of a PbMg0.33Nb0.67O3-28% PbTiO3 (001) single-crystalline plate
  11. Modelling the onset of oxide formation on metal surfaces from first principles
  12. Applied
  13. Delamination of stiff islands patterned on stretchable substrates
  14. Crack formation in surface layers with strain gradients
  15. Theta-like specimens for measuring mechanical properties at the small-scale: effects of non-ideal loading
  16. Indentation response of single-crystalline GaAs in the nano-, micro-, and macroregime
  17. Self-assembly of high-performance multi-tube carbon nanotube field-effect transistors by ac dielectrophoresis
  18. Biphasic, but monolithic scaffolds for the therapy of osteochondral defects
  19. Review
  20. Recent advances in piezospectroscopy
  21. Notifications
  22. DGM News
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