Startseite First observation of a hexagonal close packed metastable intermetallic phase between Cu and Al bilayer films
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First observation of a hexagonal close packed metastable intermetallic phase between Cu and Al bilayer films

  • L. Cha , C. Scheu , G. Richter , T. Wagner , S. Sturm und M. Rühle
Veröffentlicht/Copyright: 23. Mai 2013
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Abstract

In this paper we describe the structure and formation of a new intermetallic phase in the Cu – Al system, which has not been reported before. The phase was found in Cu/Al bilayer films, which were deposited at room temperature on (0001) sapphire substrates using molecular beam epitaxy. The interfacial intermetallic phase is 8 nm thick, and possesses a hexagonal close-packed structure. The lattice parameters of the phase gradually increase from the near-Cu-side to the near-Al-side. In parallel with the described lattice expansion, the chemical composition of the interlayer also varies from 27 to 58 Al at.% from the near-Cu-side to the near-Al-side. The formation and microstructural characteristics of this new phase are explained by Hume-Rothery laws and Shockley partial dislocations. In addition, in-situ heating experiments were performed in a transmission electron microscope at ∼600 °C to investigate the thermodynamic stability of this new Cu – Al intermetallic phase. During annealing the intermetallic layer disappears and other known equilibrium intermetallic phases develop. This indicates that this new hexagonal close-packed Cu – Al intermetallic phase is metastable.


* Correspondence address, Dr. Limei Cha, Department Metallurgy physics and materials testing, University of Leoben, Franz-Josefstraße 18, A-8700 Leoben, Austria, Tel.: +43 38 424 024 203, Fax: +43 38 424 024 202, E-mail:

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Received: 2007-2-26
Accepted: 2007-4-26
Published Online: 2013-05-23
Published in Print: 2007-08-01

© 2007, Carl Hanser Verlag, München

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