Contents

Articles in the same Issue

1. Contents
2. Contents
3. Editorial
4. Materials for Information Technology
5. Feature
6. Advanced high-k/metal gate stack progress and challenges – a materials and process integration perspective
7. Spintronics in metallic superconductor/ferromagnet hybrid structures
8. Graphene metrology and devices
9. The role of defects in resistively switching chalcogenides
10. Materials in optical data storage
11. Scaling effects on microstructure and reliability for Cu interconnects
12. Effects of e-beam curing on glass structureand mechanical properties of nanoporous organosilicate thin films
13. Printing materials for electronic devices
14. Basic
15. Characterisation of lead – calcium alloys ageing in anisothermal conditions by calorimetric, resistance and hardness in-situ measurements
16. Thermodynamic predictions of Mg – Al – Ca alloy compositions amenable to semi-solid forming
17. Capillary equilibrium in a semi-solid Al – Cu slurry
18. A comparative study of room-temperature creep in lead-free tin-based solder alloys
19. Modeling creep in a thick composite cylinder subjected to internal and external pressures
20. Applied
21. The oxidation behaviour of the 9 % Cr steel P92in CO₂- and H₂O-rich gases relevant to oxyfuel environments
22. Effect of thermal and mechanical treatments on the hot working response of Mg-3Sn-1Ca alloy
23. Structure and mechanical properties of an AlCr6Fe2Ti1 alloy produced by rapid solidification powder metallurgy method
24. Ni₂O₃-modified TiO_{2 – x}N_x as efficientvisible-light photocatalysts
25. Dependence of optical, structural and electrical properties of Zn_xCd_1–xS thin films prepared by co-evaporation on the composition for x = 0 – 1
26. DGM News
27. DGM News