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Probability of detection of minute defects by ultrasonic automated testing equipment in view of Bayesian inference

Published/Copyright: December 24, 2015
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Abstract

The method of Bayesian analysis of confidence in the testing evidence collected during ultrasonic automated testing of high quality aluminum ingots for minute defects of sub-millimeter size is discussed. These test results are assessed in the view of true or false evidence. The analysis demonstrates the significant influence of false evidence on the confidence in the test outcome where the evidence is skewed in the direction of false positive. At the same time the influence of the false negative evidence is shown to be more muted. To minimize the risk of false rejection of ingots with “ghost” indications not representing the physical defects, the off-line ingot retesting by an A-scan with defect waveform verification is implemented. Retesting of fabricated blanks made of the ingots previously passed the ingot testing is used to minimize the risk of passing products with defects earlier undetected.

Kurzfassung

Die Bayessche Analyse der Prüfzuverlässigkeit der automatischen Ultraschallprüfung von qualitativ hochwertigen Aluminiumbarren auf Fehler mit einer Größe kleiner als 1 mm wird hier diskutiert. Die Testergebnisse werden bezüglich Richtig- und Falschaussagen bewertet. Die vorgestellte Analyse zeigt einen signifikanten Einfluss von Falschaussagen auf die Prüfzuverlässigkeit, die in Richtung Falsch-Positiv-Aussagen verschoben wird. Gleichzeitig wird der Einfluss von Falsch-Negativ-Aussagen gedämpft. Zur Verringerung der Anzahl fälschlich ausgesonderter Barren aufgrund von Scheinanzeigen, wird eine Wiederholungsprüfung mit Ultraschall eingeführt. So soll das Risiko minimiert werden, dass Produkte mit vorher unentdeckten Fehlern ausgeliefert werden.


§Correspondence Address, Alex Leybovich, Manager Material Evaluation Lab & NDT, TOSOH SMD, INC., 3600 Gantz Road, Grove City, Ohio, 43123, USA. E-mail:

Alex Leybovich is a manager of Material Evaluation Lab & NDT at TOSOH SMD, Inc, Grove City, Ohio, USA, where he is involved in developing advanced techniques for destructive and nondestructive testing for sputtering target materials, as well as sputter evaluation of sputtering targets by means of sputtering tools commonly used by the semiconductor industry. He has cross-disciplinary experience in the fields of thin film technology and vacuum science as well as NDT. He received his MSc in Electro-physics from the Polytechnic Institute of Technical University St. Petersburg, Russia. He holds 16 patents (USA, Russia, Japan, South Korea) in the fields of thin film technology, sensors and NDT. He has been a member of the American Society for Non-Destructive Testing (ASNT) for 17 years.


References

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Published Online: 2015-12-24
Published in Print: 2016-01-05

© 2016, Carl Hanser Verlag, München

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