In-mold lightweight integrating for structural/functional devices
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Zhijun Yuan
,
Yizhe Chen
Abstract
Integration of function in structure is troublesome for structural/functional devices. A novel method of in-mold integrating for structural/functional devices was proposed and studied. In this method, a functional film was prepared by printing and surface mounting to achieve electrical functions, and then the film was formed and back molded into a final product. Owing to the complex electronic film, new problems are raised in the in-mold integrating process. The process was modeled, and was designed with the genetic algorithm. The interaction between the melt and the mounted film was analyzed by two-way fluid-structure coupling. Heat dissipation with anisotropic thermal conductivity was examined. Accordingly, a control panel was manufactured and tested. From the study, the functional film, causing asymmetrical cooling issue, results in concave warpage, which can be effectively controlled by comprehensive processing optimization. Film deformation is significant at button area because of tiny hollow structure. The deformation can be decreased by the epoxy encapsulation. The anisotropic thermal conductivity and injection layer cause heat dissipation problem, and thermal effect should be checked and designed by full thermal analysis. With the designed scheme, manufactured panels can perform all control functions, satisfy appearance requirements, and achieve lightweight performance.
Funding source: National Natural Science Foundation of China doi.org/10.13039/501100001809
Award Identifier / Grant number: 51775398
Award Identifier / Grant number: 51805392
Funding source: Natural Science Foundation of Hubei Province doi.org/10.13039/501100003819
Award Identifier / Grant number: 2018CFB595
Funding source: Higher Education Discipline Innovation Project
Award Identifier / Grant number: B17034
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Author contribution: All the authors have accepted responsibility for the entire content of this submitted manuscript and approved submission.
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Research funding: This work was supported by the National Natural Science Foundation Council of China under grant nos. 51775398, 51805392; the 111 Project under grant no. B17034; the Program for Innovative Research Team in University of Education Ministry under grant no. IRT_17R83; and the Natural Science Foundation of Hubei Province under grant no. 2018CFB595.
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Competing interests: The authors declare no conflicts of interest regarding this article.
References
1. Flannagan, M. J., Devonshire, J. M. Effects of automotive interior lighting on driver vision. Leukos 2013, 9, 9–23. https://doi.org/10.1582/leukos.2012.09.01.001.Suche in Google Scholar
2. Wang, Z., Wang, W., Jiang, Z., Yu, D. A novel and simple method of printing flexible conductive circuits on PET fabrics. Appl. Surf. Sci. 2017, 396, 208–213. https://doi.org/10.1016/j.apsusc.2016.09.155.Suche in Google Scholar
3. Alajoki, T., Koponen, M., Tuomikoski, M., Heikkinen, M., Keranen, A., Keranen, K., Makinen, J. T., Aikio, J., Ronka, K Hybrid In-Mould Integration for Novel Electrical and Optical Features in 3D Plastic Products; IEEE: Amsterdam, Netherlands, 2012.10.1109/ESTC.2012.6542129Suche in Google Scholar
4. Zhao, P., Wang, S., Ying, J., Fu, J. Z. Non-destructive measurement of cavity pressure during injection molding process based on ultrasonic technology and Gaussian process. Polym. Test. 2013, 32, 1436–1444. https://doi.org/10.1016/j.polymertesting.2013.09.006.Suche in Google Scholar
5. Juntunen, E., Ihme, S., Huttunen, A., Makinen, J. T. R2R process for integrating LEDs on flexible substrate. In 2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017. Institute of Electrical and Electronics Engineers Inc.: Goteborg, Sweden, 2017; pp. 12–16. https://doi.org/10.1109/nordpac.2017.7993155.Suche in Google Scholar
6. Simula, T., Niskala, P., Heikkinen, M., Rusanen, O. Component Packages for IMSE (Injection Molded Structural Electronics). In2018 IMAPS Nordic Conference on Microelectronics Packaging, NORDPAC 2018. Institute of Electrical and Electronics Engineers Inc.: Oulu, Finland, 2018; pp. 50–54. https://doi.org/10.23919/nordpac.2018.8423845.Suche in Google Scholar
7. Tenchine, L., Dassonville, O. Randomly shaped 3D electronics using innovative combination of standard Surface Mount Technologies and polymer processing. 2016 12th International Congress Molded Interconnect Devices (Mid). 2016, 106–111. https://doi.org/10.1109/icmid.2016.7738937.Suche in Google Scholar
8. Bakr, M., Su, Y., Bossuyt, F., Vanfleteren, J. Effect of overmolding process on the integrity of electronic circuits. In 22nd European Microelectronics and Packaging Conference and Exhibition, EMPC 2019. Institute of Electrical and Electronics Engineers Inc.: Pisa, Italy, 2019. https://doi.org/10.23919/empc44848.2019.8951797.Suche in Google Scholar
9. Phillips, C. O., Bould, D. C., Claypole, T. C., Gethin, D. T. Finite element modelling of low temperature forming of polymer films with application in in-mould decoration. Mater. Des. 2009, 30, 537–550. https://doi.org/10.1016/j.matdes.2008.05.056.Suche in Google Scholar
10. Phillips, C. O., Jewell, E. H., Claypole, T. C., Gethin, D. T. Development of measurement techniques to characterize the optical properties of transparent films with application in in-mould decoration. Meas. Sci. Technol. 2008, 19, 025703; https://doi.org/10.1088/0957-0233/19/2/025703.Suche in Google Scholar
11. Wong, C. Y., Liang, K. Z. Thermal effects on the behaviour of PET films used in the in-mould-decoration process involved in plastics injection moulding. J. Mech. Work. Technol. 1997, 63, 510–513. https://doi.org/10.1016/s0924-0136(96)02674-x.Suche in Google Scholar
12. Lim, C. H., Abdullah, M. Z., Azid, I. A., Khor, C. Y. Heat transfer enhancement by flexible printed circuit board’s deformation. Int. Commun. Heat Mass Tran. 2017, 84, 86–93. https://doi.org/10.1016/j.icheatmasstransfer.2017.04.004.Suche in Google Scholar
13. Kpobie, W., Martiny, M., Mercier, S., Lechleiter, F., Bodin, L., Brizoux, M. Thermo-mechanical simulation of PCB with embedded components. Microelectron. Reliab. 2016, 65, 108–130. https://doi.org/10.1016/j.microrel.2016.08.016.Suche in Google Scholar
14. Middleton, B., Goodship, V. Injection molding electroluminescent components. Polym. Eng. Sci. 2013, 53, 1554–1562. https://doi.org/10.1002/pen.23399.Suche in Google Scholar
15. Wimmer, A., Reichel, H., Schmidt, K. New standards for 3D-user interfaces-manufactured by a film insert molding process. In 2018 13th International Congress Molded Interconnect Devices (MID), 2018, pp. 1–5. https://doi.org/10.1109/icmid.2018.8526978.Suche in Google Scholar
16. Annicchiarico, D., Alcock, J. R. Review of factors that affect shrinkage of molded part in injection molding. Mater. Manuf. Process. 2014, 29, 662–682. https://doi.org/10.1080/10426914.2014.880467.Suche in Google Scholar
17. Mercado-Colmenero, J. M., Rubio-Paramio, M. A., Marquez-Sevillano, J. d. J., Martin-Doñate, C. A new method for the automated design of cooling systems in injection molds. Comput. Aided Des. 2018, 104, 60–86. https://doi.org/10.1016/j.cad.2018.06.001.Suche in Google Scholar
18. Sarvar, F., Teh, N. J., Whalley, D. C., Huntt, D. A., Palmer, P. J. Thermo-mechanical modelling of polymer encapsulated electronics. In The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, IEEE Cat. No. 04CH37543, 2004, pp. 465–472.10.1109/ITHERM.2004.1318320Suche in Google Scholar
19. Wang, H., Bai, Q., Hao, X., Hua, L., Meng, Z. Genetic algorithm-based optimization design method of the Formula SAE racing car’s rear wing. Proc. IME C J. Mech. Eng. Sci. 2017, 232, 1255–1269. https://doi.org/10.1177/0954406217700181.Suche in Google Scholar
20. Giassi, M., Göteman, M. Layout design of wave energy parks by a genetic algorithm. Ocean. Eng. 2018, 154, 252–261. https://doi.org/10.1016/j.oceaneng.2018.01.096.Suche in Google Scholar
21. Hu, Y., Chang, X., Wang, Y., Wang, Z., Shi, C., Wu, L. Cloud manufacturing resources fuzzy classification based on genetic simulated annealing algorithm. Mater. Manuf. Process. 2017, 32, 1109–1115. https://doi.org/10.1080/10426914.2016.1269921.Suche in Google Scholar
Supplementary Material
The online version of this article offers supplementary material (https://doi.org/10.1515/polyeng-2021-0006).
© 2021 Walter de Gruyter GmbH, Berlin/Boston
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Artikel in diesem Heft
- Frontmatter
- Material properties
- Investigation of the silica pore size effect on the performance of polysulfone (PSf) mixed matrix membranes (MMMs) for gas separation
- Understanding thermal and rheological behaviors of bimodal polymethyl methacrylate (BPMMA) fabricated via solution blending
- Kinetic study of the pyrolysis of polypropylene over natural clay
- Investigation of morphology and transport properties of Na+ ion conducting PMMA:PEO hybrid polymer electrolyte
- Preparation and assembly
- Designing of new hydrophilic polyurethane using the graft-polymerized poly(acrylic acid) and poly(2-(dimethylamino)ethyl acrylate)
- Water-soluble polymeric particle embedded cryogels: Synthesis, characterisation and adsorption of haemoglobin
- Durable anti-oil-fouling superhydrophilic membranes for oil-in-water emulsion separation
- A facile route to dual-crosslinking polymeric hydrogels with enhanced mechanical property
- Antifouling enhancement of polyacrylonitrile-based membrane grafted with poly(sulfobetaine methacrylate) layers
- Engineering and processing
- Non-isothermal blade coating analysis of viscous fluid with temperature-dependent viscosity using lubrication approximation theory
- In-mold lightweight integrating for structural/functional devices
