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Influence of mold cavity thickness on electrical, morphological and thermal properties of polypropylene/carbon micromoldings

  • Shengtai Zhou , Renze Jiang , Xue Lei , Huawei Zou and Andrew N. Hrymak EMAIL logo
Published/Copyright: January 30, 2023
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Abstract

In this work, a comparative study on the electrical conductivity (σ) and thermal properties of polypropylene (PP)/carbon microparts with different part thickness (namely, 0.85 and 0.50 mm) is reported. Two different types of carbon filler (i.e., CNT and CB) were adopted to study the efficacy of different carbon fillers in improving the σ of PP/carbon microparts. In general, the σ of 0.85 mm thickness microparts were higher than the 0.50 mm thickness microparts, regardless of the carbon filler type and testing directions. This suggested that higher shearing conditions that prevailed in the microinjection molding (μIM) process were unfavorable for the formation of intact conductive pathways in corresponding moldings, albeit the distribution of carbon fillers turned better with increasing shear rates, as confirmed by morphology observations. Differential scanning calorimetry results showed that prior thermomechanical histories (including melt blending and μIM) experienced by the polymer melts had an influence on the thermal behavior of subsequent moldings. Also, there existed a strong shear flow-induced crystallization of polymer chains during μIM because the crystallinity of microparts was higher than that of feed materials.


Corresponding author: Andrew N. Hrymak, Department of Chemical and Biochemical Engineering, The University of Western Ontario, London, Canada, E-mail:

Funding source: Natural Sciences and Engineering Research Council of Canada Discovery Grants

Funding source: National Natural Science Foundation of China

Award Identifier / Grant number: 52103040

Funding source: China Postdoctoral Science Foundation

Award Identifier / Grant number: 2020M673217

Funding source: Ontario Graduate Scholarship

Funding source: Queen Elizabeth II Graduate Scholarship

  1. Author contributions: All the authors have accepted responsibility for the entire content of this submitted manuscript and approved submission.

  2. Research funding: The authors acknowledge the support of Natural Sciences and Engineering Research Council of Canada Discovery Grants program (ANH). SZ is thankful for the support from National Natural Science Foundation of China (52103040) and China Postdoctoral Science Foundation (2020M673217). RJ acknowledges support from Ontario Graduate Scholarship and Queen Elizabeth II Graduate Scholarship in Science and Technology.

  3. Conflict of interest statement: The authors declare no conflicts of interest regarding this article.

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Received: 2022-09-23
Accepted: 2023-01-12
Published Online: 2023-01-30
Published in Print: 2023-05-25

© 2023 Walter de Gruyter GmbH, Berlin/Boston

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