ITRS lithography roadmap: status and challenges
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Mark Neisser
Mark Neisser is the Resist and Materials Research Manager at SEMATECH. He earned his Bachelor’s Degree at the Cornell University and his Masters and PhD degrees at the University of Michigan, Ann Arbor, all in Chemistry. He worked at IBM for 16 years doing packaging materials research and semiconductor lithography. He started a career in research, followed by positions in managing research and development of photoresists and of ancillary materials for lithography at Arch and AZ Electronic Materials, respectively. His current research interests involve semiconductor patterning and related materials and the physics of imaging or patterning such materials.
Stefan Wurn is the SEMATECH Director of Lithography and works as a GLOBALFOUNDRIES assignee. He has more than 20 years of industry and R&D experience and has held technical and management positions in research and development at AMD, Siemens Semiconductor Group, Infineon, Qimonda, and SEMATECH. He was first assigned to SEMATECH in the late 1990s and he was responsible for the 300 mm metrology tool equipment demonstrations. Prior to his previous assignment as associate director of Lithography at SEMATECH, he served 4 years as SEMATECH’s extreme ultraviolet (EUV) program manager, where he has been instrumental in shaping and directing the SEMATECH EUV program, which provides worldwide EUV infrastructure capabilities and technology learning to SEMATECH members. Dr. Wurm holds a doctorate in natural sciences from the Technische Universität München, Germany.
©2012 by Walter de Gruyter Berlin Boston
Articles in the same Issue
- Masthead
- Masthead
- Editorial
- The Next Decade of Optical Lithography
- Views
- ITRS lithography roadmap: status and challenges
- Community
- News from The European Optical Society
- Conference Notes
- Conference Calendar
- Topical Issue: The Next Decade of Optical Lithography
- Tutorial
- Calculation and uses of the lithographic aerial image
- Review Articles
- Review of computational lithography modeling: focusing on extending optical lithography and design-technology co-optimization
- Development of core technologies on EUV mask and resist for sub-20-nm half pitch generation
- Advances in EUV light sources
- Aerial imaging technology for photomask qualification: from a microscope to a metrology tool
- Research Articles
- Computational metrology and inspection (CMI) in mask inspection, metrology, review, and repair
- Imaging optics on scanner for SMO generation process
- Tutorial
- Practical aspects of modern interferometry for optical manufacturing quality control, Part 3
Articles in the same Issue
- Masthead
- Masthead
- Editorial
- The Next Decade of Optical Lithography
- Views
- ITRS lithography roadmap: status and challenges
- Community
- News from The European Optical Society
- Conference Notes
- Conference Calendar
- Topical Issue: The Next Decade of Optical Lithography
- Tutorial
- Calculation and uses of the lithographic aerial image
- Review Articles
- Review of computational lithography modeling: focusing on extending optical lithography and design-technology co-optimization
- Development of core technologies on EUV mask and resist for sub-20-nm half pitch generation
- Advances in EUV light sources
- Aerial imaging technology for photomask qualification: from a microscope to a metrology tool
- Research Articles
- Computational metrology and inspection (CMI) in mask inspection, metrology, review, and repair
- Imaging optics on scanner for SMO generation process
- Tutorial
- Practical aspects of modern interferometry for optical manufacturing quality control, Part 3
