Startseite Microstructural effects of isothermal aging on a doped SAC solder alloy
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Microstructural effects of isothermal aging on a doped SAC solder alloy

  • Lahouari Benabou , Laurent Vivet , Quang Bang Tao und Ngoc Hai Tran
Veröffentlicht/Copyright: 18. Dezember 2017
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International Journal of Materials Research
Aus der Zeitschrift International Journal of Materials Research Band 109 Heft 1

Abstract

An Sn–Ag–Cu based solder alloy, including Ni, Bi and Sb additives, is investigated in this study under isothermal aging conditions. Shear creep tests are conducted on different aged solder joints with copper substrate, giving the creep resistance evolution with aging time. Microscopy analyses reveal the limited growth of the Cu-rich intermetallic layer due to the Ni content and allow for determination of the time-dependent growth of the Sn-rich intermetallic layer. The aged specimens also exhibit a partial dynamically recrystallized microstructure after creep deformation and a brittle-to-ductile fracture transition is found with occurrence of intergranular cracking in the joint.

Keywords: Lead-free solder; Aging; Creep; Brittle-to-ductile transition; Alloying elements
*Correspondence address, Dr. Lahouari Benabou, Laboratoire d'Ingénierie des Systèmes de Versailles, Université de Versailles Saint-Quentin-en-Yvelines, 45 avenue des Etats-Unis, Versailles 78035, France, Tel.: +33-139254212, E-mail:

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Received: 2017-04-29
Accepted: 2017-08-09
Published Online: 2017-12-18
Published in Print: 2018-01-09

© 2018, Carl Hanser Verlag, München

Artikel in diesem Heft

  1. Contents
  2. Contents
  3. Original Contributions
  4. Diffusion behaviour of Pt in platinum aluminide coatings during thermal cycles
  5. Ternary Al–Mo–Y phase diagram and the new phase Al4Mo2Y
  6. Evaluation of the thixoformability of 318.1 aluminum alloy
  7. High temperature tensile behavior of Mg-2Al and Mg-6Al alloys
  8. Anisotropic thermomechanical behavior of AA6082 aluminum alloy Al–Mg–Si–Mn
  9. Significant enhancement of bond strength in the roll bonding process using Pb particles
  10. Nanoindentation characterization of Al-matrix nanocomposites produced via spark plasma sintering
  11. Study and development of NiAl intermetallic coating on hypo-eutectoid steel using highly activated composite granules of the Ni–Al system
  12. Elaboration of a triphasic calcium phosphate and silica nanocomposite for maxillary grafting and deposition on titanium implants
  13. Short Communications
  14. Microstructural effects of isothermal aging on a doped SAC solder alloy
  15. Two-stage synthesis of ultrafine powder of chromium carbide
  16. DGM News
  17. DGM News
https://doi.org/10.3139/146.111578
Schlagwörter für diesen Artikel
Lead-free solder; Aging; Creep; Brittle-to-ductile transition; Alloying elements

Artikel in diesem Heft

  1. Contents
  2. Contents
  3. Original Contributions
  4. Diffusion behaviour of Pt in platinum aluminide coatings during thermal cycles
  5. Ternary Al–Mo–Y phase diagram and the new phase Al4Mo2Y
  6. Evaluation of the thixoformability of 318.1 aluminum alloy
  7. High temperature tensile behavior of Mg-2Al and Mg-6Al alloys
  8. Anisotropic thermomechanical behavior of AA6082 aluminum alloy Al–Mg–Si–Mn
  9. Significant enhancement of bond strength in the roll bonding process using Pb particles
  10. Nanoindentation characterization of Al-matrix nanocomposites produced via spark plasma sintering
  11. Study and development of NiAl intermetallic coating on hypo-eutectoid steel using highly activated composite granules of the Ni–Al system
  12. Elaboration of a triphasic calcium phosphate and silica nanocomposite for maxillary grafting and deposition on titanium implants
  13. Short Communications
  14. Microstructural effects of isothermal aging on a doped SAC solder alloy
  15. Two-stage synthesis of ultrafine powder of chromium carbide
  16. DGM News
  17. DGM News
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