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Mechanical and electrical properties of Ti2SnC dispersion-strengthened copper

  • Jinyi Wu , Yanchun Zhou EMAIL logo and Chengke Yan
Published/Copyright: February 1, 2022
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Abstract

Ti2SnC dispersion-strengthened (DS) copper matrix composites were prepared by the hot-pressing method. The change of microstructure, mechanical properties, and electrical resistivity of the composites as a function of Ti2SnC volume fraction were studied. The results demonstrated that the grain size of Cu decreased pronouncedly by incorporating Ti2SnC, and the strengthening effect was significant. Improvements in yield strength of up to four times that of pure copper were found in Cu-1 vol.% Ti2SnC, however, the conductivity of the composite was still 85.6% of pure copper. The high strength and low electrical resistivity indicated that Ti2SnC is a promising reinforcement for copper.


Dr. Yanchun Zhou Professor and Director of High-performance Ceramic Division Shenyang National Laboratory for Materials Science Institute of Metal Research, Chinese Academy of Sciences 72 Wenhua Road, Shenyang 110016, P. R. China Tel.: +86 24 2397 1765 Fax: +86 24 2389 1320

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Received: 2004-07-15
Accepted: 2004-12-23
Published Online: 2022-02-01

© 2005 Carl Hanser Verlag, München

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