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Diffusion in molybdenum disilicide

  • Marcel Salamon and Helmut Mehrer EMAIL logo
Published/Copyright: February 1, 2022
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Abstract

The diffusion behaviour of the high-temperature material molybdenum disilicide (MoSi2) was completely unknown until recently. In this paper we present studies of Mo self-diffusion and compare our present results with our already published studies of Si and Ge diffusion in MoSi2.

Self-diffusion of molybdenum in monocrystalline MoSi2 was studied by the radiotracer technique using the radioisotope 99Mo. Deposition of the radiotracer and serial sectioning after the diffusion anneals to determine the concentration-depth profiles was performed using a sputtering device.

Diffusion of Mo is a very slow process. In the entire temperature region investigated (1437 to 2173 K), the 99Mo diffusivities in both principal directions of the tetragonal MoSi2 crystals obey Arrhenius laws, where the diffusion perpendicular to the tetragonal axis is faster by two to three orders of magnitude than parallel to it. The activation enthalpies for diffusion perpendicular and parallel to the tetragonal axis are Q = 468 kJ mol–1 (4.85 eV) and Q = 586 kJ mol–1 (6.07 eV), respectively. Diffusion of Si and its homologous element Ge is fast and is mediated by thermal vacancies of the Si sublattice of MoSi2. The diffusion of Mo is by several orders of magnitude slower than the diffusion of Si and Ge. This large difference suggests that Si and Mo diffusion are decoupled and that the diffusion of Mo likely takes place via vacancies on the Mo sublattice.


Prof. Dr. Helmut Mehrer Institut für Materialphysik Westfälische Wilhelms-Universität Wilhelm-Klemm-Straße 10, D-48149 Münster, Germany Tel.: +49 251 83 39008 Fax: +49 251 83 38346

  1. We are grateful to Dr. K. Ito and Professor M. Yamaguchi from Kyoto University, Japan, for providing us MoSi2 single crystals and to Dr. N. A. Stolwijk and Dr. S. Divinski (both from our laboratory) for helpful comments on the manuscript. The isotope 99Mo was produced by neutron activation in the research center GKSS Geesthacht.

    Financial support by the Deutsche Forschungsgemeinschaft (research project Me 480/41-1) is gratefully acknowledged.

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Appendix

The concentration-depth profiles in the present investigation have been determined using a sputtering process for the serial sectioning of the diffusion sample. A detailed analysis of the sputtering process reveals that this sectioning technique can have an effect on the concentration profile in the sense that the measured profile deviates from the true profile in the sample. In the following some of these sputtering effects are briefly discussed and a technique is presented how the true profile can be determined even in the presence of sputtering effects. For a more detailed discussion on sputtering effects and their treatment the reader is referred to [11].

An ideal serial sectioning process would remove thin consecutive layers parallel to the surface. This would result in a perfect reproduction of the profile of the sample with the only difference that the measured profile is a ‘discretized’ representation of the original continuous profile. However, several different effects pertaining to the sputtering process can cause deviations of this ideal behaviour. These effects belong into one of the two following categories:

  1. On a microscopic scale, the sputtering process does not strictly remove consecutive layers of atoms. Instead, the depth coordinate becomes a bit ‘uncertain’ because some mixing of atoms from different layers occurs. These effects cause a broadening of the profile because each layer may include tracer atoms from former and later layers. Examples of such ‘broadening’ effects are the roughening of the surface due to the statistical nature of the sputtering and the mixing of the atoms in the sample caused by knock-on effects.

    The measured profile f(x) after sputtering is given by a convolution (see, for example, Werner [31])

    (4) f(x)=(gc)(x)

    of the profile c(x) in the sample with a device function

    (5) g(x)=12σ2exp(x22σ2)

    The width σ of the Gaussian device function g(x) determines the influence of the sputter broadening. This broadening influences the profile in a similar way as diffusion does (note the similarity between Eq. (5) and Eq. (2)). Thus, if c(x) obeys the thin-film solution according to Eq. (2), f(x) will also be a Gaussian solution but with an enhanced apparent diffusivity D′ which is given by

    (6) 4Dt=4Dt+2σ2

    However, sputter broadening effects are usually of short range. For low ion energies (only about 1 keV in our case) the broadening σ in Eq. (5) is of the order of a few nm only.

  2. Due to the experimental setup described in Wenwer et al. [12], a tracer ‘reservoir’ can be present or formed during the sputtering process. Tracers removed from this ‘reservoir’ during the sputtering process will be added to the tracers removed from the diffusion zone resulting in a long-range ‘tail’ on the original diffusion profile. As the amount of tracers available in such a ‘reservoir’ is typically much lower than the amount of tracers within the diffusion zone, the ‘tail’ will have a low concentration and will thus not be detectable in the surface-near part of the profile. However, as the concentration due to volume diffusion decreases rapidly with increasing depth, the ‘tail’ will eventually determine the shape of the measured profile at larger depths. The resulting measured profile appears similar to what is known, for example, from type-B diffusion through the volume and along the grain boundaries in polycrystals. Our sputtering device uses a screen which shields parts of the sample from the sputter beam. Only a circular area in the middle with a diameter of about 8 mm is left open and defines the sputtered area on the sample. As the sputter beam is aligned at some angle against the surface normal (60° for our device) a sputter crater is formed during the sputtering process. The sputtered-off tracers do not only originate from the the crater bottom but, in addition, also from the edge regions. As a consequence, the tracer concentration, f(x), measured by sputtering deviates from the original tracer concentration, c(x), by the concentration of tracers, e(x), contributed from the edges:

    (7) f(x)=c(x)+e(x)

    A detailed inspection (Salamon [11]) shows that e(x) decreases approximately proportional to x–2

    (8) e(x)1x20xc(x)xdx

    If the diffusion profile c(x) follows the thin-film solution the amount of tracers originating from the edges will at some depth dominate the total measured tracer concentration f (x) as this part decreases approximately with x–2 and not exponentially. To minimize this effect we deposited the tracers only in a small region with a diameter of 7 mm which later is aligned within the center of the 8 mm sputter crater. However, evaporation and re-deposition of tracers during the annealing or the serial sectioning as well as surface diffusion can still cause some leaking of tracers into the outer areas.

    Eqs. (7) and (8) can also be written in the form of Eq. (4) with an approximative device function

    (9) g(x)=Ax95

    where A is a fitting constant. The empirically derived exponent 95 in Eq. (9) was found to give a satisfactory approximation for practical purposes.

Eq. (6) permits an easy correction of measured profiles if only broadening effects are present and their broadening parameter σ is known. If tailing effects are present and/or σ is not known, it is still possible to determine the true diffusion profile c(x) from the measured profile f (x), but the technique is more complex as will be shown in what follows.

Let us consider diffusion for all x ∈ ℝ which allows us to avoid dealing with boundary conditions at the sample surface x = 0 for the sake of simplicity. Let us further denote the initial tracer concentration at time t = 0 with c0(x) = c(x, t = 0). After diffusion for some time t the tracer concentration ct(x) can be calculated by a convolution of the initial concentration c0(x) with a kernel. The kernel Kt(x) is the thin-film solution according to Eq.(2) with N = ½ due to the boundary conditions chosen above. Kt(x) of the diffusion equation (see, for example, Glicksman [32]):

(10) ct(x)=(Ktc0)(x)=+Kt(xx)c0(x)dx

Both the evolution of a concentration profile by diffusion as well as the modification of such a profile by sputtering effects can be described by a convolution according to Eq. (10) and (4), respectively. As the convolution is both commutative and associative, one can mathematically switch the order of the two operations:

(11) ft(x)=(gct)(x)=(Ktf0)(x)

Eq. (11) shows that the kernel Kt produces ft from f0 in the same way as it produces ct from c0. Once the kernel is determined, the diffusion coefficient D is known (see Eq. (2)). Therefore, it is possible to simply use the profiles ft and f0 which are accessible by the sputtering process and not the true diffusion profiles ct and c0 to determine the Kernel Kt (and by doing this also to determine D).

The remaining task would be a deconvolution of ft to f0 in order to find the kernel Kt. However, such a deconvolution is prone to produce serious artifacts as the measured concentrations often scatter heavily around the profile (see, for example, Jansson [33]). An easier alternative is to start with an assumption for D as a zero-order approximation, use this value for a kernel Kt, convolute the kernel with the measured initial concentration profile f0, and determine whether the result of this procedure is a good representation of the measured diffusion profile ft. If it is not, a better value can be used as the next-order approximation for D, and the whole calculation is repeated until one ends with an acceptable representation of the measured profile. Such a straightforward calculation has been used in this investigation to evaluate the diffusion profiles of 99Mo in MoSi2. By doing this, both sputter broadening and ‘tailing’ effects have been taken fully into account. The advantage of this strategy is that one only has to measure a sputtered non-diffused sample under similar experimental conditions as for the diffusion samples to obtain f0. Using the scheme described above allows to determine a ‘true’ diffusion coefficient which is not influenced by sputtering and which takes into account the real initial tracer concentration, i. e. does not depend on the assumption of, e. g., a thin-film source. In addition, it allows to both qualitatively and quantitatively explain the ‘tails’ observed in the diffusion profiles.

Received: 2004-12-22
Accepted: 2005-03-11
Published Online: 2022-02-01

© 2005 Carl Hanser Verlag, München

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