Characterization of intermetallic compounds formed during the interfacial reactions of liquid Sn and Sn– 58Bi solders with Ni substrates
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M. Y. Chiu
Abstract
The intermetallic compound that appears during the soldering reaction between pure Sn and Ni substrate at temperatures ranging from 250 to 400 °C is analyzed to be Ni43Sn57 A similar reaction at the Sn– 58Bi/Ni interface results in the formation of the Ni41.5Sn57.9Bi0.6 phase. At the Sn/Ni and Sn–58Bi/Ni interfaces, each kind of intermetallic compound formation exhibits a similar scallop-type morphology. However, the growth rate of intermetallic compounds at the Sn/Ni interface is greater than that at the Sn– 58Bi/Ni interface. The growth kinetics for both cases is diffusion controlled. The activation energy for the intermetallic growth at the Sn/Ni interface is 43.7 kJ/mol, which is higher than that at the Sn–58Bi/Ni interface (28.3 kJ/mol).
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© 2002 Carl Hanser Verlag, München
Articles in the same Issue
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- Notifications/Mitteilungen
- Personal/Personelles
Articles in the same Issue
- Frontmatter
- Articles/Aufsätze
- Strain rate dependence of the deformation mechanisms in a fully lamellar γ-TiAl-based alloy
- Experimental and thermodynamic assessment of the Fe –Gd–Zr system
- Phase diagram of the Fe –Co –Ti system at 1073 K
- Copper concentration inside Guinier-Preston I zones formed in an Al –Cu alloy
- Identification of precipitates in 6013 aluminum alloy (Al –Mg –Si –Cu)
- Redistribution of phosphorus and carbon in steel weldments
- Microstructure and compressive properties of in situ synthesized TiC/Ti composites
- Effect of Al on the glass forming ability of Zr–Ni –Cu–Al alloys
- Fcc-hcp transformation-related internal friction in Fe –Mn alloys
- High-temperature stress and strain partitioning in duplex stainless steel
- Load sequence effects in the high cycle fatigue of two ferrite-pearlite microalloyed steels
- Characterization of intermetallic compounds formed during the interfacial reactions of liquid Sn and Sn– 58Bi solders with Ni substrates
- Notifications/Mitteilungen
- Personal/Personelles
