In-mold lightweight integrating for structural/functional devices

Zhijun Yuan; Qingsong Zhang; Hui Wang; Yizhe Chen; Qiuyang Bai

doi:10.1515/polyeng-2021-0006

Enjoy 40% off

academic books on De Gruyter Brill *

Article

In-mold lightweight integrating for structural/functional devices

Zhijun Yuan , Qingsong Zhang , Hui Wang , Yizhe Chen and Qiuyang Bai

Published/Copyright: July 22, 2021

Published by

Become an author with De Gruyter Brill

Submit Manuscript Author Information

From the journal Journal of Polymer Engineering Volume 41 Issue 8

Abstract

Integration of function in structure is troublesome for structural/functional devices. A novel method of in-mold integrating for structural/functional devices was proposed and studied. In this method, a functional film was prepared by printing and surface mounting to achieve electrical functions, and then the film was formed and back molded into a final product. Owing to the complex electronic film, new problems are raised in the in-mold integrating process. The process was modeled, and was designed with the genetic algorithm. The interaction between the melt and the mounted film was analyzed by two-way fluid-structure coupling. Heat dissipation with anisotropic thermal conductivity was examined. Accordingly, a control panel was manufactured and tested. From the study, the functional film, causing asymmetrical cooling issue, results in concave warpage, which can be effectively controlled by comprehensive processing optimization. Film deformation is significant at button area because of tiny hollow structure. The deformation can be decreased by the epoxy encapsulation. The anisotropic thermal conductivity and injection layer cause heat dissipation problem, and thermal effect should be checked and designed by full thermal analysis. With the designed scheme, manufactured panels can perform all control functions, satisfy appearance requirements, and achieve lightweight performance.

Keywords: design; injection; in-mold integrating; modeling; structural/functional devices

Corresponding author: Hui Wang, Hubei Key Laboratory of Advanced Technology for Automotive Components, Wuhan University of Technology, Wuhan 430070, China; and Hubei Collaborative Innovation Center for Automotive Components Technology, Wuhan 430070, China, E-mail: huiwang@whut.edu.cn

Funding source: National Natural Science Foundation of China doi.org/10.13039/501100001809

Award Identifier / Grant number: 51775398

Award Identifier / Grant number: 51805392

Funding source: Natural Science Foundation of Hubei Province doi.org/10.13039/501100003819

Award Identifier / Grant number: 2018CFB595

Funding source: Higher Education Discipline Innovation Project

Award Identifier / Grant number: B17034

Author contribution: All the authors have accepted responsibility for the entire content of this submitted manuscript and approved submission.
Research funding: This work was supported by the National Natural Science Foundation Council of China under grant nos. 51775398, 51805392; the 111 Project under grant no. B17034; the Program for Innovative Research Team in University of Education Ministry under grant no. IRT_17R83; and the Natural Science Foundation of Hubei Province under grant no. 2018CFB595.
Competing interests: The authors declare no conflicts of interest regarding this article.

References

1. Flannagan, M. J., Devonshire, J. M. Effects of automotive interior lighting on driver vision. Leukos 2013, 9, 9–23. https://doi.org/10.1582/leukos.2012.09.01.001.Search in Google Scholar

2. Wang, Z., Wang, W., Jiang, Z., Yu, D. A novel and simple method of printing flexible conductive circuits on PET fabrics. Appl. Surf. Sci. 2017, 396, 208–213. https://doi.org/10.1016/j.apsusc.2016.09.155.Search in Google Scholar

3. Alajoki, T., Koponen, M., Tuomikoski, M., Heikkinen, M., Keranen, A., Keranen, K., Makinen, J. T., Aikio, J., Ronka, K Hybrid In-Mould Integration for Novel Electrical and Optical Features in 3D Plastic Products; IEEE: Amsterdam, Netherlands, 2012.10.1109/ESTC.2012.6542129Search in Google Scholar

4. Zhao, P., Wang, S., Ying, J., Fu, J. Z. Non-destructive measurement of cavity pressure during injection molding process based on ultrasonic technology and Gaussian process. Polym. Test. 2013, 32, 1436–1444. https://doi.org/10.1016/j.polymertesting.2013.09.006.Search in Google Scholar

5. Juntunen, E., Ihme, S., Huttunen, A., Makinen, J. T. R2R process for integrating LEDs on flexible substrate. In 2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017. Institute of Electrical and Electronics Engineers Inc.: Goteborg, Sweden, 2017; pp. 12–16. https://doi.org/10.1109/nordpac.2017.7993155.Search in Google Scholar

6. Simula, T., Niskala, P., Heikkinen, M., Rusanen, O. Component Packages for IMSE (Injection Molded Structural Electronics). In2018 IMAPS Nordic Conference on Microelectronics Packaging, NORDPAC 2018. Institute of Electrical and Electronics Engineers Inc.: Oulu, Finland, 2018; pp. 50–54. https://doi.org/10.23919/nordpac.2018.8423845.Search in Google Scholar

7. Tenchine, L., Dassonville, O. Randomly shaped 3D electronics using innovative combination of standard Surface Mount Technologies and polymer processing. 2016 12th International Congress Molded Interconnect Devices (Mid). 2016, 106–111. https://doi.org/10.1109/icmid.2016.7738937.Search in Google Scholar

8. Bakr, M., Su, Y., Bossuyt, F., Vanfleteren, J. Effect of overmolding process on the integrity of electronic circuits. In 22nd European Microelectronics and Packaging Conference and Exhibition, EMPC 2019. Institute of Electrical and Electronics Engineers Inc.: Pisa, Italy, 2019. https://doi.org/10.23919/empc44848.2019.8951797.Search in Google Scholar

9. Phillips, C. O., Bould, D. C., Claypole, T. C., Gethin, D. T. Finite element modelling of low temperature forming of polymer films with application in in-mould decoration. Mater. Des. 2009, 30, 537–550. https://doi.org/10.1016/j.matdes.2008.05.056.Search in Google Scholar

10. Phillips, C. O., Jewell, E. H., Claypole, T. C., Gethin, D. T. Development of measurement techniques to characterize the optical properties of transparent films with application in in-mould decoration. Meas. Sci. Technol. 2008, 19, 025703; https://doi.org/10.1088/0957-0233/19/2/025703.Search in Google Scholar

11. Wong, C. Y., Liang, K. Z. Thermal effects on the behaviour of PET films used in the in-mould-decoration process involved in plastics injection moulding. J. Mech. Work. Technol. 1997, 63, 510–513. https://doi.org/10.1016/s0924-0136(96)02674-x.Search in Google Scholar

12. Lim, C. H., Abdullah, M. Z., Azid, I. A., Khor, C. Y. Heat transfer enhancement by flexible printed circuit board’s deformation. Int. Commun. Heat Mass Tran. 2017, 84, 86–93. https://doi.org/10.1016/j.icheatmasstransfer.2017.04.004.Search in Google Scholar

13. Kpobie, W., Martiny, M., Mercier, S., Lechleiter, F., Bodin, L., Brizoux, M. Thermo-mechanical simulation of PCB with embedded components. Microelectron. Reliab. 2016, 65, 108–130. https://doi.org/10.1016/j.microrel.2016.08.016.Search in Google Scholar

14. Middleton, B., Goodship, V. Injection molding electroluminescent components. Polym. Eng. Sci. 2013, 53, 1554–1562. https://doi.org/10.1002/pen.23399.Search in Google Scholar

15. Wimmer, A., Reichel, H., Schmidt, K. New standards for 3D-user interfaces-manufactured by a film insert molding process. In 2018 13th International Congress Molded Interconnect Devices (MID), 2018, pp. 1–5. https://doi.org/10.1109/icmid.2018.8526978.Search in Google Scholar

16. Annicchiarico, D., Alcock, J. R. Review of factors that affect shrinkage of molded part in injection molding. Mater. Manuf. Process. 2014, 29, 662–682. https://doi.org/10.1080/10426914.2014.880467.Search in Google Scholar

17. Mercado-Colmenero, J. M., Rubio-Paramio, M. A., Marquez-Sevillano, J. d. J., Martin-Doñate, C. A new method for the automated design of cooling systems in injection molds. Comput. Aided Des. 2018, 104, 60–86. https://doi.org/10.1016/j.cad.2018.06.001.Search in Google Scholar

18. Sarvar, F., Teh, N. J., Whalley, D. C., Huntt, D. A., Palmer, P. J. Thermo-mechanical modelling of polymer encapsulated electronics. In The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, IEEE Cat. No. 04CH37543, 2004, pp. 465–472.10.1109/ITHERM.2004.1318320Search in Google Scholar

19. Wang, H., Bai, Q., Hao, X., Hua, L., Meng, Z. Genetic algorithm-based optimization design method of the Formula SAE racing car’s rear wing. Proc. IME C J. Mech. Eng. Sci. 2017, 232, 1255–1269. https://doi.org/10.1177/0954406217700181.Search in Google Scholar

20. Giassi, M., Göteman, M. Layout design of wave energy parks by a genetic algorithm. Ocean. Eng. 2018, 154, 252–261. https://doi.org/10.1016/j.oceaneng.2018.01.096.Search in Google Scholar

21. Hu, Y., Chang, X., Wang, Y., Wang, Z., Shi, C., Wu, L. Cloud manufacturing resources fuzzy classification based on genetic simulated annealing algorithm. Mater. Manuf. Process. 2017, 32, 1109–1115. https://doi.org/10.1080/10426914.2016.1269921.Search in Google Scholar

Supplementary Material

The online version of this article offers supplementary material (https://doi.org/10.1515/polyeng-2021-0006).

Received: 2021-01-19

Accepted: 2021-06-08

Published Online: 2021-07-22

Published in Print: 2021-09-27

You are currently not able to access this content.

Supplementary Material

Articles in the same Issue

https://doi.org/10.1515/polyeng-2021-0006

Keywords for this article

design; injection; in-mold integrating; modeling; structural/functional devices