Startseite Three-dimensional viscoelastic simulation of the effect of wall slip on encapsulation in the coextrusion process
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Three-dimensional viscoelastic simulation of the effect of wall slip on encapsulation in the coextrusion process

  • Hesheng Liu EMAIL logo , Xiaozhen Deng , Yibin Huang , Xingyuan Huang und Mengshan Li
Veröffentlicht/Copyright: 17. August 2013
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Abstract

A three-dimensional viscoelastic numerical simulation was developed for a two-layer coextrusion through a rectangular channel by using the finite element method. The Phan-Thien and Tanner model was considered as viscoelastic constitutive equations. The generalized Navier’s law was adopted to found the slip boundary condition. The numerical results of the effects of the wall slip coefficient and the flow rate on the interface profile and the degree of encapsulation were compared with the experimental results of previous researchers. It was found that the interfacial offset and the degree of encapsulation increased with the increase of the wall slip coefficient and the flow rate, and the growing rate was large when the wall slip coefficient was between 106 and 108. We were able to control the interface shape and the degree of encapsulation at the die exit by varying the wall slip coefficient and the magnitude of the melt flow rate.


Corresponding author: Hesheng Liu, Polymer Processing Laboratory, College of Mechanical and Electric Engineering, Nanchang University, Nanchang 330031, China, e-mail:

This work was supported by the National Natural Science Foundation of China (grant no. 51163011) and Specialized Research Fund for the Doctoral Program of Higher Education (no. 20093601110001).

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Received: 2013-5-4
Accepted: 2013-7-24
Published Online: 2013-08-17
Published in Print: 2013-10-01

©2013 by Walter de Gruyter Berlin Boston

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