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An investigation of improved titanium/titanium nitride barriers for submicron aluminum-filled contacts by energy-filtered transmission electron microscopy

  • Andreas Rucki EMAIL logo and Werner Robl
Published/Copyright: February 12, 2022
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Abstract

The adaptation of titanium/titanium nitride barriers which are commonly used for tungsten-filled contacts to aluminum-filled contacts has encountered some limitations. A main issue is the decomposition of titanium nitride manufactured by physical vapour deposition through reaction with aluminum. In this investigation two different concepts for barrier improvement have been pursued: 1. stuffing of a conventional barrier by a rapid thermal process in an oxygen-rich atmosphere and, 2. use of a barrier manufactured by chemical vapour deposition. The aim of the transmission electron microscopic analysis was to explain different electrical breakdown characteristics during thermal stressing of chips with these barriers. Energy-filtered transmission electron microscopy was used to monitor elemental distributions down to nanometer scale. Both concepts are found to improve barriers for aluminumfilled contacts.


Dedicated to Professor Dr. Knut Urban on the occasion of his 65th birthday



Dr. rer. nat. Andreas Rucki Siemens AG, Corporate Technology, Otto-Hahn-Ring 6, D-81730 München, Germany Tel.: +89 636 51053 Fax: +89 636 42256

Funding statement: The help of Veronika Klüppel during the TEM investigations is gratefully acknowledged

References

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Received: 2006-01-09
Accepted: 2006-04-03
Published Online: 2022-02-12

© 2006 Carl Hanser Verlag, München

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  2. Editorial
  3. Professor Dr. Knut Urban 65 Years
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