Abstract
The adaptation of titanium/titanium nitride barriers which are commonly used for tungsten-filled contacts to aluminum-filled contacts has encountered some limitations. A main issue is the decomposition of titanium nitride manufactured by physical vapour deposition through reaction with aluminum. In this investigation two different concepts for barrier improvement have been pursued: 1. stuffing of a conventional barrier by a rapid thermal process in an oxygen-rich atmosphere and, 2. use of a barrier manufactured by chemical vapour deposition. The aim of the transmission electron microscopic analysis was to explain different electrical breakdown characteristics during thermal stressing of chips with these barriers. Energy-filtered transmission electron microscopy was used to monitor elemental distributions down to nanometer scale. Both concepts are found to improve barriers for aluminumfilled contacts.
Dedicated to Professor Dr. Knut Urban on the occasion of his 65th birthday
Funding statement: The help of Veronika Klüppel during the TEM investigations is gratefully acknowledged
References
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© 2006 Carl Hanser Verlag, München
Articles in the same Issue
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- Notifications
- Personal
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Articles in the same Issue
- Frontmatter
- Editorial
- Professor Dr. Knut Urban 65 Years
- Basic
- Ordering processes and atomic defects in FeCo
- Atomic resolution electron tomography: a dream?
- Electron tomography of microelectronic device interconnects
- Aberration correction in electron microscopy
- Off-axis electron holography: Materials analysis at atomic resolution
- Determination of phases of complex scattering amplitudes and two-particle structure factors by investigating diffractograms of thin amorphous foils
- Prospects of the multislice method for CBED pattern calculation
- Electron energy-loss spectrometry for metals:some thoughts beyond microanalysis
- Quantitative assessment of nanoparticle size distributions from HRTEM images
- Quantitative microstructural and spectroscopic investigation of inversion domain boundaries in sintered zinc oxide ceramics doped with iron oxide
- Structural domains in antiferromagnetic LaFeO3 thin films
- Short-range order of liquid Ti72.3Fe27.7 investigated by a combination of neutron scattering and X-ray diffraction
- Extended interfacial structure between two asymmetrical facets of a Σ = 9 grain boundary in copper
- Dislocation imaging in fcc colloidal single crystals
- Applied
- Omega phase transformation – morphologies and mechanisms
- Mixed (Sr1 − xCax)33Bi24Al48O141 fullerenoids: the defect structure analysed by (S)TEM techniques
- Wetting of aluminium-based complex metallic alloys
- Annealing-induced phase transitions in a Zr–Ti–Nb–Cu–Ni–Al bulk metallic glass matrix composite containing quasicrystalline precipitates
- Special planar defects in the structural complex metallic alloys of Al–Pd–Mn and Al–Ni–Rh
- On the formation of Si nanowires by molecular beam epitaxy
- Self-induced oscillations in Si and other semiconductors
- Growth, interface structure, and magnetic properties of Fe/GaAs and Fe3Si/GaAs hybrid systems
- An investigation of improved titanium/titanium nitride barriers for submicron aluminum-filled contacts by energy-filtered transmission electron microscopy
- Radiation damage during HRTEM studies in pure Al and Al alloys
- Cross-sectional high-resolution transmission electron microscopy at Mo/Si multilayer stacks
- Structural properties of the fiber –matrix interface in carbon-fiber/carbon-matrix composites and interfaces between carbon layers and planar substrates
- Microstructure and properties of surface-treated Timetal 834
- Notifications
- Personal
- Conferences