Abstract
We present the first experimental results of the growth of Cu6Sn5 and Cu3Sn under an external force field – during the sedimentation process. The results are compared with the proposed model under the combined influence of the Kirkendall effect, backstress and sedimentation. It is shown that Cu3Sn consumes the preformed Cu6Sn5 phase during sedimentation under a strong gravitational field of 779,000 G at 200 °C.
Introduction
The sedimentation process is widely known as the transport phenomena of macroscopic solutes induced by a gravitational or centrifugal field in a liquid solvent [1]. Almost all sedimentation processes have been described by the Lamm equation proposed in 1929 [2]. The fundamental idea of Lamm is that the driving force between the centrifugal field acting on the macro-solute is given by the difference between the centrifugal force and the buoyant force caused by the surrounding liquid solvent [1]. In 1996, Mashimo et al. developed an ultracentrifuge apparatus that can generate an acceleration field up to 106 G for a long time at high temperatures [3]. The second-generation ultracentrifuge was newly developed, in 2001 [4]. Using this apparatus he studied the sedimentation of the substitutional solute atoms of different elements [5, 6, 7], e. g. ultracentrifuge experiments at high temperature on elemental selenium to examine the sedimentation of isotope atoms in liquid matter [8].
The postulate of the quasi-equilibrium vacancies indicates that the high current densities, stresses, etc. do not affect vacancy concentration, which depends only on the temperature, e. g. due to the unlimited power of vacancy sinks-sources. Thus, it is well known how to provide volume conservation namely, lattice drift (Kirkendall effect) caused by the vacancy flux divergence leading to dislocation climb and subsequently to the construction of extra planes in the accumulation region and dismantling atomic planes in the depleting region [9, 10].
We will consider the problem of one-dimensional transport in two-component mixture induced by the gravity (centrifugal) field. The external force per unit mass
where
where:
The main equations for interdiffusion fluxes in the bi-velocity form (include the Darken drift of the material [12]) are [13, 14]:
where
For simplification assuming that the molar volumes are constant and then addition of eqs (3) and (4) gives:
Condition (5) in our one-dimensional problem with zero fluxes and gradients at infinities gives:
Substitution of eq. (6) into eqs (3) and (4) gives:
and, for conservation of mass:
On the other hand, the momentum equation determines the rate of pressure changes according to eq. (2). Combining eqs (2) and (8), one gets:
Equation (9) gives self-consistent coupled equations of diffusion type for atomic fraction. An exact solution can be obtained by using implicit difference methods for differential functional equations. A numeric solution should give the time evolution of the spatial separation of components.
In these studies, we present the first experimental results of the growth of Cu6Sn5 and Cu3Sn during the sedimentation process under a strong gravitational field of 779,000 G at 200 °C.
Sedimentation during binary IMC growth
Experiments
Pure (99.99 %) Cu and Sn specimens were used during the experiment. The first step of the experiment was fabrication of Cu6Sn5 and Cu3Sn layers using diffusion experiments. Thus, the thin foils, each ~2 mm thick, were inserted into the furnace to implement the diffusion couple experiment. Diffusion annealing was carried out for 1 month (720 h) at 200 °C in argon atmosphere. After that, the growth of the two intermetallic layers is schematically presented in Figure 1. The cross-sectional image of the Cu-Sn system before sedimentation process is presented in Figure 2(a). The thickness of the layers was approximately

Schematic view of the sedimentation process in the intermetallic Cu-Sn system.

Cross-sectional image of the Cu-Sn system: (a) the initial sample for the sedimentation process – annealing at 200 °C for 720 h, (b) after sedimentation at 200 °C for 24 h.
The ultracentrifuge experiments were performed using the turbine motor-type ultracentrifuge apparatus in Japan – Kumamoto University, at a temperature of 200 °C for 24 h, which was below the melting point of the starting material. The system consisted of a turbine motor with an oil-floating bearing and a specimen rotor. The turbine motor was driven by hot compressed air supplied by a screw compressor and a combustion system. The details of the apparatus are described in Ref. [3]. The rotation rate was 140,000 rpm. For the ultracentrifuged specimen, the thickness of the layers was estimated by using an optical microscope. It is shown that the ultracentrifuge force causes the change in the layer thickness, mainly
Model and results
Let us consider an alloy where two intermediate compounds form, e. g. Cu-Sn system. In such a case, the sedimentation (centrifugal force) influences the thickness of the formed intermetallic layers. The main equations for balance the interdiffusion fluxes for A and B components are [16]:
where
The diffusional fluxes through the intermetallic phases in the case of intermediate compounds can be expressed using Wagner’s diffusion coefficient [15]:
where the term
In the case of the sedimentation process, the overall flux can be derived from eq. (7):
Equations (10) and (14) allow us to calculate the change of the thickness of the layers in time.
The calculations were divided into two parts: (1) the average diffusion coefficient (Wagner’s diffusivity) of the phase was determined by the inverse method from the experiment and (2) the calculations of the sedimentation process.
The inverse method based on the eqs (10) and (11) for both
The diffusion coefficient was estimated from the known kinetics of the process by the inverse method, Figure 3. The sample was annealed for 1 month at 200 °C. The kinetics of the Cu6Sn5 and Cu3Sn growth is presented in Figure 4 the obtain data are presented in Table 1.

Kinetics of the Cu6Sn5 and Cu3Sn growth during diffusion annealing at 200 °C after 720 h

Kinetics of the Cu6Sn5 and Cu3Sn growth after the sedimentation process at 200 °C after 24 h.
The data used in simulations of Cu-Sn multiphase system during diffusion annealing and sedimentation at T = 200 °C, angular speed 140,000 rev/min, r = 33.5 mm.
Component | Partial molar volume, Ωi [cm3 mol−1] | Initial Cu composition [at. %] | Initial thickness of the layers before sedimentation [μm] | Wagner’s diffusion coefficient [cm2s−1] |
---|---|---|---|---|
Cu3Sn | 6.8969 | 75 | 10 | 1.1 10−11 |
Cu6Sn5 | 11.393 | 55 | 9 | 6 10−12 |
The data presented in Table 1 were used later in sedimentation calculations. The initial thickness of the Cu6Sn5 and Cu3Sn layers was approximately 10 µm (from experiments). The result of the sedimentation is presented in Figure 4.
During the sedimentation process, the calculated kinetics are linear, Figure 4. The thickness of Cu3Sn grows, however, the Cu6Sn5 phase is now consumed.
Summary
The phenomenological model of the sedimentation process in multiphase binary Cu-Sn system was formulated. Mass transfer occurs under the combined mechanisms of the Kirkendall effect, backstress and external force (sedimentation). We have shown the self-consistent coupled equations of diffusion type for atomic fraction. Exact solution can be obtained based on implicit difference methods for differential functional equations. The Wagner’s diffusion coefficient was determined from the preliminary results – the annealing process by the inverse method.
For the first time the sedimentation process in a multiphase system was presented experimentally. The results of the thickness of the Cu3Sn and Cu6Sn5 phases were compared with simulations. It was presented that the sedimentation process can be used for quick generation of the Cu3Sn phase – the kinetics are much higher than in the Cu6Sn5 phase.
Funding statement: This work has been supported by the National Science Centre (NCN) in Poland, decision number 2015/19/B/ST8/00999.
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Artikel in diesem Heft
- Frontmatter
- Research Articles
- Effect of the Basicity on the Crystallization Behavior of Titanium Bearing Blast Furnace Slag
- Distribution Behavior of B and P during Al-Si Melt Directional Solidification with Open-Ended Crucible
- Effect of CeO2 on TiC Morphology in Ni-Based Composite Coating
- Studies on the Parametric Effects of Plasma Arc Welding of 2205 Duplex Stainless Steel
- Finite Element Analysis of Surface Residual Stress in Functionally Gradient Cemented Carbide Tool
- Effect of Sulfur and Chlorine on Fireside Corrosion Behavior of Inconel 740 H Superalloy
- High-Temperature Creep Behaviour and Positive Effect on Straightening Deformation of Q345c Continuous Casting Slab
- Effects of Rare Earth Lanthanum on the Solidification Structure and Hot Ductility of Fe-43Ni Expansion Alloy
- Influence of Heat Treatment on γ´ Phase and Property of a Directionally Solidified Superalloy
- An Abnormal Increase of Fatigue Life with Dwell Time during Creep-Fatigue Deformation for Directionally Solidified Ni-Based Superalloy DZ445
- Competition between Chemical and Gravity Forces in Binary Alloys