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journal: High Temperature Materials and Processes
Impact Factor: 1.5
Journal Open Access

High Temperature Materials and Processes

  • Editor-in-Chief: Hiroyuki Fukuyama
Language: English
First published: January 1, 1984
Publication Frequency: 1 issue per year
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About this journal

High Temperature Materials and Processes (HTMP) offers an international publication forum for new ideas, insights, and results related to high-temperature materials and processes in science and technology. The journal publishes original research papers, short communications, reviews articles, Topical and Special Issues papers of high-temperature materials and processes.

Get easy access to the whole content of High Temperature Materials and Processes with only one click! All most cited and most downloaded articles of HTMP at your fingertips!

Table of contents 2020 & 2021

Aims and Scope:　

The Editorial Office of HTMP puts emphasis on the multi-disciplinary nature of high-temperature materials and processes for various materials in a variety of states. Subject areas suitable for publication include, but are not limited to, the following:

  • High-temperature applications and behavior of metals and alloys, intermetallic compounds, oxide ceramics, and non-oxide ceramics such as nitrides, carbides, borides, and graphite,

  • Polymers, glasses, glassy metals, composite materials,

  • Oxidation and environmental attack,

  • High-temperature corrosion,

  • Design with high-temperature materials,

  • Processes for achieving high temperature,

  • Processing of materials involving lasers, plasma, and arc sources,

  • Materials and processes involved in using solar energy,

  • Materials in nuclear energy applications,

  • Thermochemistry,

  • Kinetics of reactions,

  • Liquid metal processing,

  • Rapid solidification processes.

For the information on Article Processing Charges please go to the Supplementary Materials section below and view "Article Processing Charges" document (in PDF).

Detailed information on Editorial Policy, Publication Ethics, Instructions for Authors, etc. can be found below in the Supplementary Materials section.

Your Benefits

From volume 2019, High Temperature Materials and Processes has become an open access journal. Publication costs are covered by so-called Article Processing Charges (APC), paid by authors' affiliated institutions, funders or sponsors. All manuscripts published since 2019 are subject to APC.

Why submit

As an Author of Journal Name, You benefit from

  • fair and constructive peer review
  • quick online publication of accepted papers (continuous publication model) · language polishing services upon acceptance for authors from non-English speaking regions
  • no limitations on colour figures and word count in published articles
  • all articles are freely available to the academic community worldwide without any restrictions · promotion of published papers to readers and citers
  • distribution to open access directories (such as DOAJ) and thousands of libraries worldwide
  • liberal policies on copyrights (authors retain copyright) and on self-archiving (no embargo periods) · secure archiving by De Gruyter and the independent archiving service Portico

Article Processing Charges

In order to sustain the publishing process, each article accepted for publication in High Temperature Materials and Processes is subject to an Article Processing Charge of €1000. This fee is used to cover the costs of the peer-review process, professional typesetting and copyediting, as well as online hosting, long-term preservation, and extensive promotion to potential readers. There is no submission fee. Information regarding payment of the charge will be provided following acceptance for publication. For more information please go to Article Processing Charges.

Publication Ethics and Editorial Policies

Detailed information on Editorial Policy, Publication Ethics, Instructions for Authors etc. can be found in the Supplementary Materials section.

For more information on De Gruyter Publishing Ethics, please see the De Gruyter Guidelines online https://www.degruyter.com/publishing/for-authors/for-journal-authors/publishing-ethics

Special Issues:

Topical Issues:

Past Special Issues:

Journal Partners: Partnership with Chinese Geosynthetic Conference and International Symposium on Civil Engineering and Geosynthetic (ISCEG) that will be held on Chengdu (China) on 23-27 September 2020.

Past Topical Issues

  • High-temperature Phase Change Materials for Energy Storage
    Guest Editors:
    Assoc. Prof. Takahiro Nomura, Center for Advanced Research of Energy & Materials, Faculty of Engineering, Hokkaido University, Japan
    Assoc. Prof. Kenta Yamanaka, Institute for Materials Research, Tohoku University, Japan
    Submission deadline: 30st of November 2022
  • Science and Technology of Solar Energy
    Guest Editors:
    Dr. Yoshitaro Nose, Kyoto University, Japan
    Dr. Issei Suzuki, Tohoku University, Japan
    Submission deadline: 1st of July 2022
  • Nuclear Energy Application Materials
    Guest Editors:
    Prof. Yoshinao Kobayashi, Tokyo Institute of Technology, Japan
    Dr. Hidemasa Yamano, Japan Atomic Energy Agency, Japan
    Submission deadline: 1st of July 2022

History

Previously published by Freund Publishing House Ltd.

  • Publicly Available
    Retraction of: Phenomenological Models to Predict the Flow Stress up to the Peak of as-Extruded 7050 Aluminum Alloy
    April 29, 2017
    Yu-Feng Xia, Jia Zhao, Lai Jiang, Shuai Long, Tian-yu Wang
    Download PDF
  • Publicly Available
    Retraction of: In-Flight Analysis of Particles in Plasma Spraying
    October 10, 2015
    Yong Zhang, Zhi-jiu Ai, Yan Wu
    Download PDF
  • Requires Authentication Unlicensed
    Licensed
    In-Flight Analysis of Particles in Plasma Spraying
    January 1, 2000
    Yong Zhang, Zhi-jiu Ai, Yan Wu
    Download PDF

High Temperature Materials and Processes publishes special and thematic issues focussed on important and emerging topics in the field of study. The journal has established a rigorous process to ensure that any special issue manuscripts follow the same high-quality standards and peer review processes as regular manuscripts. For further information on the journal’s peer review policy please see the "Instructions for Authors".

Call for Papers

Supplementary Materials

Submit Manuscript

Journal Impact Factor 1.5 2024, Journal Citation Reports (Clarivate, 2025)
5-year Journal Impact Factor 1.7 2024, Journal Citation Reports (Clarivate, 2025)
Journal Citation Indicator 0.25 2024, Journal Citation Reports (Clarivate, 2025)
CiteScore 2.4 2024, Scopus (Elsevier B.V., 2025)
SCImago Journal Rank 0.356 2024, SJR (Scimago Lab, 2025; Data Source: Scopus)
Source Normalized Impact per Paper 0.620 2024, CWTS Journal Indicators (CWTS B.V., 2025; Data Source: Scopus)
More information about journal rankings

MANUSCRIPTS　

High Temperature Materials and Processes encourages the submission of both substantial full-length bodies of work and shorter manuscripts that report novel findings. There are no specific length restrictions for the overall manuscript or individual sections; however, we urge the authors to present and discuss their findings in a concise and accessible manner. All submissions must be made via online submission system Editorial Manager. In case of problems, please contact the Managing Editor of this journal (Joanna.Kosinska@degruyter.com).

SUBMISSION OF MANUSCRIPTS
Manuscripts have to be written in LATEX (preferable), AMS-TEX, AMS-LATEX or MS Word - standard DOCUMENT (.DOC). We do not accept papers in Plain TEX format. If additionally a PDF file is supplied, the peer review process will speed up. Authors are encouraged to submit the final version of the paper using the De Gruyter Open LATEX template. For detailed information, please see Instruction for Authors.

EDITORIAL POLICY
The journal uses a closed single-blind peer review system.
Unpublished material: Submission of a manuscript implies that the work described is not copyrighted, published or submitted elsewhere, except in abstract form. The corresponding author should ensure that all authors approve the manuscript before its submission.
Ethical conduct of research: The authors must describe and confirm safeguards to meet ethical standards when applicable. See Editorial Policy for details.
Conflict of interest: When authors submit a manuscript, they are responsible for recognizing and disclosing financial and/or other conflicts of interest that might bias their work and/or could inappropriately influence his/her judgment. If no specified acknowledgment is given, the Editors assume that no conflict of interest exists. Authors are encouraged to fill in the ICMJE Conflicts of Interest Form (available here) and send it in the electronic format to the Managing Editor.

Copyright: All authors retain copyright unless their work is not copyrighted due to their local circumstances. The copyrights are governed by the Creative-Commons Attribution Only license (CC-BY) which is compliant with Plan-S. We may also publish a paper under CC-BY-NC-ND license at the author's request. The corresponding author grants the journal license for use of the article, by signing the License To Publish. A scanned copy of license should be sent to the journal, as soon as possible.

Authorship: Authorship should be limited to those who have made a significant contribution to the conception, design, execution, or interpretation of the reported study. All those who have made significant contributions should be listed as co-authors. Where there are others who have participated in certain substantive aspects of the research project, they should be named in an Acknowledgement section. The corresponding author should ensure that all appropriate co-authors (according to the above definition) and no inappropriate co-authors are included in the author list of the manuscript and that all co-authors have seen and approved the final version of the paper and have agreed to its submission for publication.

Peer Review process: Our standard policy requires each paper reporting primary research or secondary analysis of primary research, together with relevant supplementary materials, to be reviewed by at least two Referees and the peer-review process is single-blind. The Editors reserve the right to decline the submitted manuscript without review, if the studies reported are not sufficiently novel or important to merit publication in the journal. Manuscripts deemed unsuitable (insufficient originality or of limited interest to the target audience) are returned to the author(s) without review. The Editor seeks advice from experts in the appropriate field. Research articles and communications

are refereed by a minimum of two reviewers, review papers by at least three. Authors are requested to suggest persons competent to review their manuscript. However, please note that this will be treated only as a suggestion, and the final selection of reviewers is exclusively the Editor's decision. The final decision of acceptance in made by Managing Editor or, in case of conflict, by the Editor-in-Chief.

Scientific Misconduct: This journal publishes only original manuscripts that are not also published or going to be published elsewhere. Multiple submissions/publications, or redundant publications (re-packaging in different words of data already published by the same authors) will be rejected. If they are detected only after publication, the journal reserves the right to publish a Retraction Note. In each particular case Editors will follow COPE's Code of Conduct and implement its advice.

Editor-in-Chief
Hiroyuki Fukuyama, Tohoku Univeristy, Japan

Editorial Advisory Board
Yoshio Waseda, Tohoku Univeristy, Japan
Hans -J. Fecht, Ulm University, Germany
Ramana G. Reddy, The university of Alabama, USA
Michel Baron, Campus Jarlard-Route de Teillet, France
Wei Gao, The University of Auckland, New Zealand
Andreas Glaeser, University of California, USA
Zbigniew Grzesik, AGH University of Science and Technology, Poland
Jeff Th.M. de Hosson, University of Groningen, The Netherlands
Thomas Jacob Kallarackel, Indian Institute of Science, India
Georges Kipouros, Dalhousie Univeristy, Canada
Indranil Manna, Indian Institute of Technology, India
Toru Okabe, The University of Tokyo, Japan
Koulis Pericleous, University of Greenwich, UK
Paulo F. A. Santos, Department of Civil Engineering University of Coimbra, Portugal
Boris Straumal, Russian Academy of Science, Russia
Shigeru Suzuki, Tohoku University, Japan
Toshihiro Tanaka, Osaka Univeristy, Japan
Peter Terzieff, University of Vienna, Austria
Satoshi Uda, Tohoku University, Japan
Kunihiko Nakashima, Kyushu University, Japan
Tohru Sekino, Osaka Univeristy, Japan

Editors
Weizao Liu, College of Materials Science and Engineering, Chongqing University, China
Uceu Suhuddin, Helmholtz-Zentrum Geesthacht, German
Ke Chen, Shanghai Jiao Tong University,China
Che-Wei, Tsai National Tsing Hua University, Taiwan
Murshid Imam, Indian Institute of Technology Patna, India
Sun-Joong, Kim Chosun university, Korea
Anrin Bhattacharyya, Montanuniversität Leoben, Austria
Björn Glaser, KTH Royal Institute of Technology, Sweden
Wanlin Wang, Central South University, China
Jin-ichiro Nakano, National Energy Technology Laboratory, USA
Kinnor Chattopadhyay, University of Toronto, Canada
Shigeru Ueda, Tohoku University, Japan
Noritaka Saito, Kyushu University, Japan
Tudor Braniste, National Center for Materials Study and Testing, at the Technical University of Moldova, Moldova
João Pedro Oliveira, Universidade NOVA de Lisboa, Portugal
Guo Chen, Yunnan Minzu University, China
Jacek Tomków, Gdańsk University of Technology, Poland
Chander Prakash, Chitkara University, Punjab, India
Issei Suzuki, Institute of Multidisciplinary Research for Advanced Materials, Tohoku University, Japan
Kuldeep Kr. Saxena, Division of Research and Development, Lovely Professional University, Phagwara, Jalandhar, India
Vijayanandh Raja, Kumaraguru College of Technology, Coimbatore 641049, Tamil Nadu, India
Shanmugasundaram Thangaraju, Department of Metallurgical and Materials Engineering. Defence Institute of Advanced Technology (DIAT) Pune-421005. India
Sunil Kumar Tripathy, Natural Resources Research Institute, University of Minnesota Duluth, USA
Mariano Pierantozzi, Università di Chieti Pescara -Department of Engineering and Geology, Italy
Venu Reddy, Sagi Ramakrishnam Raju Engineering College, India
Wenqiang Sun, Northeastern University, China
Jing Shi, University of Cincinnati, USA
Hiroyuki Shibata, Tohoku Univeristy, Japan
Dong Xu, Anhui Polytechnic University, China
Atefeh Ghaderi, Islamic Azad University, Iran


Editorial Contact
Kumaran Rengaswamy
Assistant Managing Editor, Compuscript
AssistantManagingEditor@degruyter.com

Joanna Kosińska
Managing Editor
Joanna.Kosinska@degruyter.com

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Supplementary Materials

Topics

Journal information
Additional information
eISSN:
2191-0324
Language:
English
Publisher:
De Gruyter
Additional information
First published:
January 1, 1984
Publication Frequency:
1 issue per year
eISSN: 2191-0324
Audience(s) for this journal
researchers, technicians, and any practitioners interested in journal’s field of interest
Creative Commons
BY 4.0
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