Abstract
Thirty years have passed since the first report on extreme ultraviolet lithography (EUVL) was presented at the annual meeting of the Japanese Society of Applied Physics in 1986. This technology is now in the manufacturing development stage. The high-volume manufacturing of dynamic-random-access-memory (DRAM) chips with a line width of 15 nm is expected in 2016. However, there are critical development issues that remain: generating a stand-alone EUV source with a higher power and producing a mask inspection tool for obtaining zero-defect masks. The Center for EUVL at the University of Hyogo was established in 2010. At present, it utilizes various types of equipment, such as an EUV mask defect inspection tool, an interference-lithography system, a device for measuring the thickness of carbon contamination film deposited by resist outgassing, and reflectivity measurement systems.
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©2015 THOSS Media & De Gruyter
Articles in the same Issue
- Cover and Frontmatter
- Views
- ITRS lithography roadmap: 2015 challenges
- Community
- EOS NEWS: Report from the World of Photonics Congress 2015
- Conference Notes
- Conference Calendar
- Topical Issue: Optical Lithography
- Editorial
- Introduction to the special issue on optical lithography
- Review Articles
- How to make lithography patterns print: the role of OPC and pattern layout
- Exposure tool control for advanced semiconductor lithography
- Performance of 100-W HVM LPP-EUV source
- Resist material options for extreme ultraviolet lithography
- Development of element technologies for EUVL
- Research Articles
- Focus tolerance influenced by source size in Talbot lithography
- Flat-field anastigmatic mirror objective for high-magnification extreme ultraviolet microscopy
Articles in the same Issue
- Cover and Frontmatter
- Views
- ITRS lithography roadmap: 2015 challenges
- Community
- EOS NEWS: Report from the World of Photonics Congress 2015
- Conference Notes
- Conference Calendar
- Topical Issue: Optical Lithography
- Editorial
- Introduction to the special issue on optical lithography
- Review Articles
- How to make lithography patterns print: the role of OPC and pattern layout
- Exposure tool control for advanced semiconductor lithography
- Performance of 100-W HVM LPP-EUV source
- Resist material options for extreme ultraviolet lithography
- Development of element technologies for EUVL
- Research Articles
- Focus tolerance influenced by source size in Talbot lithography
- Flat-field anastigmatic mirror objective for high-magnification extreme ultraviolet microscopy