Volume 7, Issue 3 - Ultrafast Laser Matter Interaction / Guest Editors: Thomas Graf, Beat Neunschwander

Ultra-short laser radiation is used in manifold industrial applications today. Although state-of-the-art laser sources are providing an average power of 10–100 W with repetition rates of up to several megahertz, most applications do not benefit from it. On the one hand, the processing speed is limited to some hundred millimeters per second by the dynamics of mechanical axes or galvanometric scanners. On the other hand, high repetition rates require consideration of new physical effects such as heat accumulation and shielding that might reduce the process efficiency. For ablation processes, process efficiency can be expressed by the specific removal rate, ablated volume per time, and average power. The analysis of the specific removal rate for different laser parameters, like average power, repetition rate or pulse duration, and process parameters, like scanning speed or material, can be used to find the best operation point for microprocessing applications. Analytical models and molecular dynamics simulations based on the so-called two-temperature model reveal the causes for the appearance of limiting physical effects. The findings of models and simulations can be used to take advantage and optimize processing strategies.

Materials processing using ultrashort pulsed laser radiation with pulse durations <10 ps is known to enable very precise processing with negligible thermal load. However, even for the application of picosecond and femtosecond laser radiation, not the full amount of the absorbed energy is converted into ablation products and a distinct fraction of the absorbed energy remains as residual heat in the processed workpiece. For low average power and power densities, this heat is usually not relevant for the processing results and dissipates into the workpiece. In contrast, when higher average powers and repetition rates are applied to increase the throughput and upscale ultrashort pulse processing, this heat input becomes relevant and significantly affects the achieved processing results. In this paper, we outline the relevance of heat input for ultrashort pulse processing, starting with the heat input of a single ultrashort laser pulse. Heat accumulation during ultrashort pulse processing with high repetition rate is discussed as well as heat accumulation for materials processing using pulse bursts. In addition, the relevance of heat accumulation with multiple scanning passes and processing with multiple laser spots is shown.

One of the major reasons for the formation of a heat-affected zone during laser processing of carbon fiber-reinforced plastics (CFRP) with repetitive picosecond (ps) laser pulses is heat accumulation. A fraction of every laser pulse is left as what we termed residual heat in the material also after the completed ablation process and leads to a gradual temperature increase in the processed workpiece. If the time between two consecutive pulses is too short to allow for a sufficient cooling of the material in the interaction zone, the resulting temperature can finally exceed a critical temperature and lead to the formation of a heat-affected zone. This accumulation effect depends on the amount of energy per laser pulse that is left in the material as residual heat. Which fraction of the incident pulse energy is left as residual heat in the workpiece depends on the laser and process parameters, the material properties, and the geometry of the interaction zone, but the influence of the individual quantities at the present state of knowledge is not known precisely due to the lack of comprehensive theoretical models. With the present study, we, therefore, experimentally determined the amount of residual heat by means of calorimetry. We investigated the dependence of the residual heat on the fluence, the pulse overlap, and the depth of laser-generated grooves in CRFP. As expected, the residual heat was found to increase with increasing groove depth. This increase occurs due to an indirect heating of the kerf walls by the ablation plasma and the change in the absorbed laser fluence caused by the altered geometry of the generated structures.

Ultrafast Bessel beams demonstrate a significant capacity of structuring transparent materials with a high degree of accuracy and exceptional aspect ratio. The ability to localize energy on the nanometer scale (bypassing the 100-nm milestone) makes them ideal tools for advanced laser nanoscale processing on surfaces and in the bulk. This allows to generate and combine micron and nano-sized features into hybrid structures that show novel functionalities. Their high aspect ratio and the accurate location can equally drive an efficient material modification and processing strategy on large dimensions. We review, here, the main concepts of generating and using Bessel non-diffractive beams and their remarkable features, discuss general characteristics of their interaction with matter in ablation and material modification regimes, and advocate their use for obtaining hybrid micro and nanoscale structures in two and three dimensions (2D and 3D) performing complex functions. High-throughput applications are indicated. The example list ranges from surface nanostructuring and laser cutting to ultrafast laser welding and the fabrication of 3D photonic systems embedded in the volume.

The usage of pulse bursts allows increasing the throughput, which still represents a key factor for machining with ultra-short pulsed lasers. The influence of the number of pulses within a burst on the specific removal rate is investigated for copper and stainless steel. Furthermore, calorimetric measurements were performed to estimate the residual energy coefficient as well as the absorptance of machined surfaces for copper to explain the reduced specific removal rate for a 2-pulse burst and the similar or even higher rate for a 3-pulse burst compared to single pulse ablation. Based on the measurements, a description of the process using single pulses and pulse bursts with up to three pulses is presented.

A model for predicting the borehole geometry for laser drilling is presented based on the calculation of a surface of constant absorbed fluence. It is applicable to helical drilling of through-holes with ultrashort laser pulses. The threshold fluence describing the borehole surface is fitted for best agreement with experimental data in the form of cross-sections of through-holes of different shapes and sizes in stainless steel samples. The fitted value is similar to ablation threshold fluence values reported for laser ablation models.

Based on hybrid molecular dynamics/two-temperature simulations, we study the validity of the application of Lambert-Beer’s law, which is conveniently used in various modeling approaches of ultra-short pulse laser ablation of metals. The method is compared to a more rigorous treatment, which involves solving the Helmholtz wave equation for different pulse durations ranging from 100 fs to 5 ps and a wavelength of 800 nm. Our simulations show a growing agreement with increasing pulse durations, and we provide appropriate optical parameters for all investigated pulse durations.