Band 10, Heft 4-5 - High-rate Laser Processing

Materials processing with ultrafast lasers with pulse durations in the range between about 100 fs and 10 ps enable very promising and emerging high-tech applications. Moreover, the average power of such lasers is steadily increasing; multi kilowatt systems have been demonstrated in laboratories and will be ready for the market in the next few years, allowing a significantly increase in productivity. However, the implementation of ultrafast laser processes in applications is very challenging due to fundamental physical limitations. In this paper, the main limitations will be discussed. These include limitations resulting from the physical material properties such as the ablation depth and the optimal fluence, from processing parameters such as air-breakdown and heat accumulation, from the processing system such as thermal focus shift, and from legal regulations due to the potential emission of soft X-rays.

High average power femtosecond lasers have made spectacular progress in the last decades – moving from laboratory-based systems with maximum average powers of tens of watts to kilowatt-class mature industrial systems in a short time. The availability of such systems opens new possibilities in many fields; one of the most prominent ones that have driven many of these technological advances is precise high-speed material processing, where ultrashort pulses have long been recognized to provide highest precision processing of virtually any material, and high average power extends these capabilities to highest processing rates. Here, we focus our attention on one high-average power technology with large unexplored potential for this specific application: directly modelocked multi-MHz repetition frequency high-power thin-disk oscillators. We review their latest state-of-the-art and discuss future directions and challenges, specifically with this application field in mind.

Bursts of GHz repetition rate pulses can significantly improve the ablation efficiency of femtosecond lasers. Depending on the process conditions, thermal mechanisms can be promoted and controlled. GHz ablation therefore combines thermal and non-thermal ablation mechanisms. With an optimal choice of the burst duration, the non-thermal ablation can be highly enhanced by a heating phase due to the first pulses in the burst. The GHz burst mode can be considered as a key function for the “agility” of new high-power lasers.

State-of-the-art fiber-laser systems can deliver femtosecond pulses at average powers beyond the kilowatt level and multi-mJ pulse energies by employing advanced large-mode-area fiber designs, chirped-pulse amplification, and the coherent combination of parallel fiber amplifiers. By using sophisticated coherent phase control, one or even several output ports can be modulated at virtually arbitrary power levels and switching speeds. In addition, an all-fiber setup for GHz-burst generation is described allowing to access an even wider range of laser parameters. The combination of all these approaches together with the robustness, efficiency, and excellent beam quality inherent to fiber-laser technology has the potential to strongly improve existing materials-processing applications.

Thin-disk multipass amplifiers represent one of the most powerful approaches to scale the average and peak powers of ultrafast laser systems. The present paper presents the amplification of picosecond and femtosecond pulses to average powers exceeding 2 and 1 kW, respectively. Second-harmonic generation in lithium-triborate crystals with powers higher than 1.4 kW and 400 W at a wavelength of 515 nm with picosecond and femtosecond pulse durations, respectively, are also reported. Furthermore, third-harmonic generation was demonstrated with output powers exceeding 250 W at a wavelength of 343 nm. Finally, processing of silicon, metals, and polycrystalline diamond with fs pulses at an average power of 1 kW is presented to demonstrate removal rates that are improved by orders of magnitude as compared to state-of-the-art techniques.

In laser processing, the possible throughput is directly scaling with the available average laser power. To avoid unwanted thermal damage due to high pulse energy or heat accumulation during MHz-repetition rates, energy distribution over the workpiece is required. Polygon mirror scanners enable high deflection speeds and thus, a proper energy distribution within a short processing time. The requirements of laser micro processing with up to 10 kW average laser powers and high scan speeds up to 1000 m/s result in a 30 mm aperture two-dimensional polygon mirror scanner with a patented low-distortion mirror configuration. In combination with a field programmable gate array-based real-time logic, position-true high-accuracy laser switching is enabled for 2D, 2.5D, or 3D laser processing capable to drill holes in multi-pass ablation or engraving. A special developed real-time shifter module within the high-speed logic allows, in combination with external axis, the material processing on the fly and hence, processing of workpieces much larger than the scan field.

In this manuscript we present a true pulse-on-demand laser design concept using two different approaches. First, we present a fiber master oscillator power amplifier (MOPA) based quasi-continuous wave (CW) laser, working at high modulation bandwidths, for generation of nanosecond pulses. Second, we present a hybrid chirped pulse amplification (CPA)-based laser, combining a chirped-pulse fiber amplifier and an additional solid-state amplifier, for generation of femtosecond pulses. The pulse-on-demand operation is achieved without an external optical modulator/shutter at high-average powers and flexible repetition rates up to 40 MHz, using two variants of the approach for near-constant gain in the amplifier chain. The idler and marker seed sources are combined in the amplifier stages and separated at the out using either wavelength-based separation or second harmonic generation (SHG)-generation-based separation. The nanosecond laser source is further applied to high throughput processing of thin film materials. The laser is combined with a resonant scanner, using the intrinsic pulse-on-demand operation to compensate the scanner’s sinusoidal movement. We applied the setup to processing of indium tin oxide (ITO) and metallic films on flexible substrates.

Micro structuring of surfaces is of great interest for various applications, e.g. for the tooling industry, the printing industry and for consumer goods. In suitable mass production applications, such as injection molding or roll-to-roll processing for various markets, the final product could be equipped with new properties, such as hydrophilic behavior, adjustable gloss level, soft-touch behavior, light management properties etc. To generate functionalities at reasonable cost, embossing dies can be augmented with additional micro/nano-scale structure using laser ablation technologies. Despite the availability of ultrashort pulsed (USP) high power lasers (up to several hundred watts), it is still a challenge to structure large areas, as required on embossing rolls, in an acceptable processing time for industrial production. In terms of industrial implementation, direct digital transfer is a limiting factor for ultrahigh resolution. Shorter machining times by further increasing spot or workpiece motion are limited. Enlarging the ablation diameter, and thus the tool diameter, delivers a higher ablation rate with the comparable ablation quality, but entails a reduction in resolution. While maintaining the achieved state-of-the-art performance, upscaling of single modulated lasers provides a less demanding way to increase productivity. In the processing of steel surfaces, an increase in material removal can also be achieved by using pulse burst. In this work, the parallel process of single modulated multi laser sources is compared with a laser source split by diffractive optical elements (DOE) for applications in a cylinder micro patterning system. A newly developed highly compact ps laser with repetition rates up to 8 MHz and an average power of 300 or 500 W was divided into 8 or 16 parallel beamlets by a DOE. The ablation rate of each approach was investigated by typical microstructures on copper surfaces. At surface speeds of 10 m/s and a resolution of 5080 dpi, an ablation rate of up to 27 mm³/min was achieved. Different functional surface geometries were realized on an embossing roll as master, which is used for replication of the structures in roll-to-roll processes. Functional structures, such as friction reduction, improved soft touch or light guiding elements on large surfaces are demonstrated.

The combination of diffractive optical elements or spatial light modulators with fully synchronized galvo scanners offers a possibility to scale up machining processes with ultra-short pulses to several 100 W of average power with minimal thermal impact. This will be demonstrated with the high-rate applications multi-pulse drilling on the fly and material removal with special intensity distributions up to an average power of 162 W and a removal rate of 16.5 mm 3 /min. Based on the experimental results strategies to achieve drilling rates of several 10,000 holes/s or removal rates of multiple 10 mm 3 /min will be discussed.