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Kinetics and dynamics of hot deformation of OFHC copper in extended temperature and strain rate ranges

  • Y. V. R. K. Prasad and K. P. Rao EMAIL logo
Published/Copyright: December 9, 2021
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International Journal of Materials Research
From the journal International Journal of Materials Research Volume 96 Issue 1

Abstract

The hot-deformation behavior of oxygen-free high-conductivity (OFHC) copper has been studied in the temperature range 300–950 °C and strain rate range 0.001–100 s –1 using hot-compression tests. The dynamics of the behavior is studied with the help of processing maps, and the-rate controlling processes are evaluated using the standard kinetic rate equation. The processing maps exhibited two domains: (1) in the temperature range 600–900 °C and strain rate range 0.01–10 s–1, (2) in the range 750–950 °C and 30–100 s –1. From kinetic analysis of the flow stress data, apparent activation energy values of 159 kJ/mole and 75 kJ/mole have been estimated in the above two domains, respectively. These values suggest that dislocation core self-diffusion and grain boundary self-diffusion are the rate-controlling mechanisms. In both these domains, the average grain diameter varies linearly with the Zener–Hollomon parameter.

Keywords: OFHC copper; Hot deformation; Processing maps; Kinetic analysis; Dynamic recrystallization
Dr. K. P. Rao Department of Manufacturing Engineering and Engineering Management City University of Hong Kong Tat Chee Avenue, Kowloon, Hong Kong SAR, China Tel.:+852 2788 8409 Fax: +852 2788 8423

  1. The work described in this paper was fully supported by a grant from the Research Grants Council of the Hong Kong Special Administrative Region, China (Project Ref No. CityU/1004/01E.

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Received: 2004-04-27
Accepted: 2004-10-04
Published Online: 2021-12-09

© 2005 Carl Hanser Verlag, München

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  14. Kinetics and dynamics of hot deformation of OFHC copper in extended temperature and strain rate ranges
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  17. Thermodynamic investigations of Bi–Cd, In–Pb, and Ni–Pd liquid alloys
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https://doi.org/10.3139/ijmr-2005-0010
Keywords for this article
OFHC copper; Hot deformation; Processing maps; Kinetic analysis; Dynamic recrystallization

Articles in the same Issue

  1. Frontmatter
  2. Editorial
  3. Editorial
  4. Articles BBasic
  5. Interdiffusion, Kirkendall effect, and Al self-diffusion in iron–aluminium alloys
  6. Permanent magnet alloys based on Sm2Co17; phase evolution in the quinary system Sm–Zr–Fe–Co–Cu
  7. A unified equation for the viscosity of pure liquid metals
  8. Calorimetric Study of Mg2Zn3
  9. Calorimetric investigations of the two ternary systems Al–Sn–Zn and Ag–Sn–Zn
  10. Articles AApplied
  11. Precipitation of the β-phase in Al–Mg alloys
  12. Mechanical properties of saffil fiber reinforced Zinc–Aluminium alloy (ZA 27) produced by pressure die casting
  13. Deformation and fracture mechanisms of Al2O3/Nb/Al2O3 composites under compression
  14. Kinetics and dynamics of hot deformation of OFHC copper in extended temperature and strain rate ranges
  15. Mechanism and kinetics of aging of high-strength Cu-5 wt.% Ni-2.5 wt.% Ti
  16. Microstructural evolution of Al–Ni–Y powders with different sizes
  17. Thermodynamic investigations of Bi–Cd, In–Pb, and Ni–Pd liquid alloys
  18. Instructions for authors
  19. Notifications/Mitteilungen
  20. Richtlinien für autoren
  21. Personal/ Personelles
  22. Press / Presse
  23. Conferences /Konferenzen
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