Abstract
Pure annealed Cu was subjected to shocks produced by a high power laser, producing shock pressures of about 5 GPa. The shock waves traveled through the 1 mm thick specimens. The shocks were found to modify the microstructure of the metal primary through the introduction of a large concentration of dislocations. The mechanical properties of the shock processed Cu were measured by tensile testing and compared to the unshocked material. The shock processing causes an increase in the yield stress, a decrease in the initial work hardening rate, and a decrease in the strain to failure. The deformation microstructures were characterized and found to be consistent with the observed mechanical behavior.
Funding statement: We thank M. M. LeBlanc for overseeing the mechanical tests, R. A. Bliss for TEM specimen preparation and scanning electron microscopy, and L. Nguyen for EBSD specimen preparation and thermomechanical processing of Cu. We thank L. Hackel for LSP of Cu. This work supported by the Laboratory Directed Research and Development Program at LLNL. This work performed under the auspices of the United States Department of Energy and the Lawrence Livermore National Laboratory under contract number W-7405-Eng-48.
References
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© 2003 Carl Hanser Verlag, München
Articles in the same Issue
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- Notifications/Mitteilungen
- Personal/Personelles
- Gesellschaftsnachricht
- International Conferences
Articles in the same Issue
- Frontmatter
- Editorial
- Editorial
- Articles/Aufsätze
- The role of oxidation-induced cavities on the failure of the thermally grown oxide on binary β-NiAl alloys
- Phase stability of Y + Gd co-doped zirconia
- Mechanisms governing the distortion of alumina-forming alloys upon cyclic oxidation
- High-temperature oxidation of FeCrAl alloys: the effect of Mg incorporation into the alumina scale
- Nonlinear dielectric properties at oxide grain boundaries
- TEM observations of singular grain boundaries and their roughening transition in TiO2-excess BaTiO3
- Processing of dense MgO substrates for high-temperature superconductors
- Microwave-induced crystallization of polysilazane-derived silicon carbonitride
- Schottky barrier formation in liquid-phase-sintered silicon carbide
- SrTiO3: a model electroceramic
- Optical properties and electronic structure of oxidized and reduced single-crystal strontium titanate
- Spreading of liquid Ag and Ag–Mo alloys on molybdenum substrates
- Nanoalloying in mixed AgmAun nanowires
- Never ending saga of a simple boundary
- Comparison of interfacial chemistry at Cu/α-alumina and Cu/γ-alumina interfaces
- Microstructure of Cu2O/Si interfaces, made by epitaxial electrodeposition
- Metal/oxide interfaces and their reaction with hydrogen
- Amorphous films at metal/ceramic interfaces
- Some thoughts on source monochromation and the implications for electron energy loss spectroscopy
- Determination of the contrast transfer function by analysing diffractograms of thin amorphous foils
- Progress in the preparation of cross-sectional TEM specimens by ion-beam thinning
- Quantification of interfacial segregation by analytical electron microscopy
- Quantification of elemental segregation to lath and grain boundaries in low-alloy steel by STEM X-ray mapping combined with the ζ-factor method
- Microstructure of Al/Ti metallization layers
- Connectivity of CSL grain boundaries and the role of deviations from exact coincidence
- Effect of laser shock processing on the microstructure and mechanical properties of pure Cu
- Growth and microstructure of iron nitride layers and pore formation in ε-Fe3N
- Phase diagram of the Al–Cu–Fe quasicrystal-forming alloy system
- Notifications/Mitteilungen
- Personal/Personelles
- Gesellschaftsnachricht
- International Conferences