Research on Optimizing Parameters of Thermal Bonding Technique for PMMA Microfluidic Chip
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Abstract
The thermal bonding method is an advanced processing technology, which can bond a variety of polymer sheets on request. This work aims to analyze the effect of applied loading, heating temperature and duration on the depth loss of the PMMA microfluidic chip after bonding. Several experiments were designed by us and the results were analyzed by orthogonal experimental method. Finally optimal applied loading, heating temperature and duration were obtained and in the optimal case, the bonded microfluidic chip has small depth loss and enough strength.
References
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© 2017, Carl Hanser Verlag, Munich
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Articles in the same Issue
- Contents
- Contents
- Review Articles
- Influence of Carbon Fillers on Thermal Properties and Flammability of Polymeric Nanocomposites
- Regular Contributed Articles
- Polymer Flow Behavior Analysis Based on Physical Visualization Technology for Ultrasonic Vibration-Assisted Injection Molding
- Flexural Fatigue Performance of Glass Fiber/Epoxy Step-Wise Functionally and Non-Functionally Graded Composites of Different Structures
- Establishment and Effect of Constraint on Different Mechanical Properties of Bamboo Filler Reinforced Epoxy Composite
- Experimental Investigation on Mechanical and Thermo-Mechanical Properties of Alumina Filled Polypropylene Composites Using Injection Molding Process
- Development and Characterization of Polyurethane and Acrylonitrile Butadiene Styrene and their Compatibilized Blends
- Mechanical Properties of Polydimethylsiloxane as a Function of the Amount and Type of Crosslinking Agent
- Numerical Investigation of Effect of Rotor Phase Angle in Partially-Filled Rubber Mixing
- Method of Calculating the Fluid Permeability of Machined Skin-Covered Porous Sheets from Experimental Flow Data
- Analysis of Models Predicting Morphology Transitions in Reactive Twin-Screw Extrusion of Bio-Based Polyester/Polyamide Blends
- A Combined Experimental and Modelling Approach towards an Optimized Heating Strategy in Thermoforming of Thermoplastics Sheets
- Analyzing the Influence of Surface Renewal on Diffusive Mass Transport in Vented Single-Screw Extruders
- Research on Optimizing Parameters of Thermal Bonding Technique for PMMA Microfluidic Chip
- PPS News
- PPS News
- Seikei Kakou Abstracts
- Seikei-Kakou Abstracts
