A Study of Integration of LIGA and M-EDM Technology on the Micro Injection Molding of Super Thin Plates with Micro Through Holes

S.-C. Tseng; Y.-C. Chen; C.-H. Lin; B.-Y. Shew; C.-L. Kuo

doi:10.3139/217.0054

Article

A Study of Integration of LIGA and M-EDM Technology on the Micro Injection Molding of Super Thin Plates with Micro Through Holes

S.-C. Tseng , Y.-C. Chen , C.-H. Lin , B.-Y. Shew and C.-L. Kuo

Published/Copyright: March 26, 2013

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From the journal International Polymer Processing Volume 21 Issue 4

Abstract

There are still some difficulties in injection molding a super thin plate with micro through holes. Nozzle or filter plates are some examples of typical products. Conventional processes to manufacture nozzle plates of ink jet printer heads are electroplating or laser machining. In order to reduce the production cost and improve the performance of nozzle plates, a new approach, micro injection molding, is introduced to manufacture nozzle plates in this study. The micro mold was made by integration of the LIGA and M-EDM technology to improve the positioning and alignment accuracy. After assembling the micro mold, micro injection molding technique was applied to produce four nozzle plates in one shot. There are sixty micro through-holes on each plate and their diameters have been inspected and met the specification, 101 ± 1 microns, under a proposed vario-thermal molding process. The flow hesitation problem for molding a thin film of 50 microns was then solved. Experimental and simulation results indicated that the most significant factor for molding these nozzle plates is the initial mold temperature. This work recommends that the best initial mold temperature for molding such a thin film with the nozzle array is about 150°C for PP. The manufacturing procedures proposed here are believed to be more accurate and economical, and can be applied to mold similar micro parts.

^∗ Mail address: S.-C. Tseng, Department of Mechanical Engineering, National Yunlin University of Science and Technology, 123 Sec. 3, University Avenue, Touliu, Yunlin 640, Taiwan, R. O. C. E-mail: tsengsc@yuntech.edu.tw

References

1Becker, E. W., Ehrfeld, W., Hagmann, P., Maner, A., Munchmeyer, D.: Microelectron. Eng. 4, p. 35 (1986)10.1016/0167-9317(86)90004-3Search in Google Scholar

2Selden, R.: J. of Injection Molding4, p. 159 (2000)Search in Google Scholar

3Kim, D. H., Kang, M. H., Chun, Y. H.: J. of Injection Molding5, p. 229 (2201)Search in Google Scholar

4Yao, D., Kim, B.: J. of Injection Molding6, p. 11 (2002)Search in Google Scholar

5Tsai, S. C.: Master Thesis, National Yunlin University of Science and Technology, Taiwan (2002)Search in Google Scholar

6Chen, Y. C., Shew, B. Y., Tseng, S. C., Kuo, C. L.: Paper presented at the Taiwan 7th Nano & Mems Conf. (2003)Search in Google Scholar

Received: 2005-4-12

Accepted: 2006-3-11

Published Online: 2013-03-26

Published in Print: 2006-09-01

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https://doi.org/10.3139/217.0054