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Undercooling of Sn–Ag–Cu alloys: solder balls and solder joints solidification

  • Fiqiri Hodaj , Luc Petit , Loïc Baggetto , Olivier Boisier and Lionel Verneyre
Published/Copyright: October 16, 2013
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International Journal of Materials Research
From the journal International Journal of Materials Research Volume 104 Issue 9

Abstract

The degree of undercooling of three Pb-free solders Sn-4.5%Ag-0.5%Cu, Sn-4.0%Ag-0.5%Cu and Sn-2.5%Ag-0.5%Cu (wt.%) are determined using differential scanning calorimetry in two configurations (i) solder balls and (ii) solder joint samples prepared by reflowing solder balls on copper substrates (Ball Grid Arrays package). A large degree of undercooling was observed with solder balls, while the corresponding undercooling was significantly reduced in the case of solder joints. Samples were characterized using optical microscopy and scanning electron microscopy. The microstructure of the solder alloy is greatly affected by the reaction at the solder/copper interface. The role of the interfacial reaction between liquid solder alloy and copper substrate on the undercooling degree of the liquid alloy as well as on the microstructure of the solder joint is discussed.

Keywords:: Sn–Ag–Cu; Pb-free solders; Undercooling; Differential scanning calorimetry; Solidification
* Correspondence address, Professor Fiqiri Hodaj, Laboratoire SIMAP, Domaine Universitaire, BP 75, 38402 Saint Martin d'Hères Cedex, France, Tel.: +33476826515, Fax: +33476826767, E-mail:

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Received: 2012-11-1
Accepted: 2013-2-26
Published Online: 2013-10-16
Published in Print: 2013-09-12

© 2013, Carl Hanser Verlag, München

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https://doi.org/10.3139/146.110932
Keywords for this article
Sn–Ag–Cu; Pb-free solders; Undercooling; Differential scanning calorimetry; Solidification

Articles in the same Issue

  1. Contents
  2. Contents
  3. Original Contributions
  4. The interrelated effect of activation energy and grain boundary energy on grain growth in nanocrystalline materials
  5. Microstructural evolution of as-rolled modified 9Cr-1Mo steel during friction stir welding
  6. Effect of milling duration on the evolution of shape memory properties in a powder processed Cu–Al–Ni–Ti alloy
  7. Experimental investigation of phase equilibria in the Co–Cr–W ternary system
  8. Phase equilibria of the Zn–Al–Ti system at 370°C in the Zn-rich region
  9. Enthalpies of mixing in liquid alloys of iron with the lanthanides
  10. Ab-initio studies of some rare-earth borides: CeB2, PrB2, NdB2, and PmB2
  11. Influence of different contents of Si and Cu on the solidification pathways of cast hypoeutectic Al-(5–9)Si-(1–4)Cu (wt.%) alloys
  12. Undercooling of Sn–Ag–Cu alloys: solder balls and solder joints solidification
  13. Nitrogen deficiency and metal dopant induced sub-stoichiometry in titanium nitride thin films: a comparative study
  14. The influence of AlCrN coating on the high-temperature corrosion resistance of Ti-46Al-7Nb alloy in an atmosphere containing 9%O2 + 0.2%HCl + 0.08%SO2 + N2
  15. PEMFC membrane electrode assembly degradation study based on its mechanical properties
  16. Effect of epoxy resin properties on the mechanical properties of carbon fiber/epoxy resin composites
  17. Microstructural aspects of ceramic hollow microspheres reinforced metal matrix composites
  18. Copper/bamboo fabric composite prepared via a silver catalytic electroless deposition process for electromagnetic shielding
  19. People
  20. Dr. Herbert Karl Schmid
  21. Ludwig Gauckler
  22. DGM News
  23. DGM News
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