Behavior of a graphene/epoxy composite used as thermal interface material for LED heat dissipation

Yin Zhang; Mingshan Zhang

doi:10.3139/120.111108

Artikel

Behavior of a graphene/epoxy composite used as thermal interface material for LED heat dissipation

Yin Zhang und Mingshan Zhang

Veröffentlicht/Copyright: 21. November 2017

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Aus der Zeitschrift Materials Testing Band 59 Heft 11-12

Abstract

Heat dissipation plays an important role in improving luminous efficiency and reliability for light emitting diode (LED) devices. In this paper, graphene/epoxy composite is synthesized and used as thermal interface material for LED heat dissipation enhancement. Experiment is conducted to test the interface resistances of the novel composite materials with different graphene mixing ratios. Moreover, the thermal performances and junction temperatures of LED device with and without such thermal interface materials are analyzed and compared to show the heat dissipation effect of the proposed composite thermal interface material. The results show that thermal conductivity of graphene/epoxy composite increases with growing graphene mixing ratio and the interface resistance can be decreased by more than 70 % with the composite TIM. The case study indicates that junction temperature decreases from 72 °C to 67 °C for a 10 W power LED after using TIM, and such temperature difference becomes larger for higher LED power. Furthermore, with graphene/epoxy composite thermal interface material, temperature is distributed more uniformly in the heat sink, also benefitting LED heat dissipation. This work is important for practical heat sink design and optimization for LED equipment.

Kurzfassung

Die Wärmeabgabe hat eine wichtige Bedeutung, um die Beleuchtungseffizienz und Zuverlässigkeit von Leuchtdioden (Light Emitting Diode (LED)) zu verbessern. In der diesem Beitrag zugrunde liegenden Studie wurde ein Graphen-Epoxid-Komposit synthetisiert und als thermisches Interface-Material (TIM)) zur Verbesserung der Wärmeableitung von LEDs eingesetzt. Es wurden Experimente durchgeführt, um die Interface-Widerstände des neuen Kompositmaterials mit verschiedenen Graphenmischungsverhältnissen zu prüfen. Darüber hinaus wurden die thermischen Eigenschaften und die Verbindungstemperaturen der LED mit und ohne solcher thermischen Interface-Materialien analysiert und verglichen, um den Wärmeableitungseffekt des propagierten thermischen Interface-Materiales zu zeigen. Die Ergebnisse zeigen, dass die thermische Leitfähigkeit des Graphen-Epoxid-Komposites mit wachsenden Graphen-Mischungsverhältnissen zunimmt und dass der-Interface-Widerstand um mehr als 70 % mit dem Komposit-TIM abgesenkt werden kann. Die Studie deutet darauf hin, dass die Verbindungstemperatur von 72 °C auf 67 °C bei einer LED mit einer Leistung von 10 W infolge der Verwendung dieses Materials abnimmt, und dass diese Temperaturdifferenz für höhere LED-Leistungen größer wird. Darüber hinaus wird die Temperatur gleichmäßiger mit dem TIM in der Wärmesenke verteilt, was die LED-Wärmeabgabe ebenfalls verbessert. Diese Arbeit ist für das praktische Design von Wärmesenken und die Optimierung von LED-Anlagen wichtig.

*Correspondence Address, Prof. Dr. Mingshan Zhang, Director, South Southwest Minzu University, Room 119, Building 28, No. 16, South Section 4, Yihuan Road, Chengdu 610041, P. R. China, E-mail: swunzms@126.com

Yin Zhang, born in 1988, is a lecturer at the College of Architecture and Environment, Sichuan University, Chengdu, China. He received his PhD degree in Mechanical Engineering from Tsinghua University, Beijing, China in 2016. His research interests include thermodynamic analysis, heat and mass transfer and applied thermal materials.

Mingshan Zhang, born in 1963, is Professor in the Research Institute of Nationalities, Southwest Minzu University, Chengdu, China. He received his PhD degree in System Engineering and Management from Southwest Jiaotong University, Chengdu, China in 1998. Now, he is the research leader in system analysis and optimization in Sichuan Province in China.

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Published Online: 2017-11-21

Published in Print: 2017-11-15

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https://doi.org/10.3139/120.111108