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Thermal expansion, electrical conductivity and hardness of Mn3Zn0.5Sn0.5N/Al composites

  • Jinjin Miao , Jiaqi Liu , Xiao Wu , Han Zou , Dawei Sha , Jie Ren , Yu Dai , Xuehua Yan EMAIL logo and Xiaonong Cheng
Published/Copyright: September 17, 2016
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Science and Engineering of Composite Materials
From the journal Science and Engineering of Composite Materials Volume 25 Issue 1

Abstract

Mn3Zn0.5Sn0.5N/Al composites were successfully prepared by sintering at 623 K and 723 K. It is found that the thermal expansion of Al is effectively decreased with the addition of negative thermal expansion material Mn3Zn0.5Sn0.5N, which plays the role of the thermal expansion compensator in the composite system. The thermal expansion of composites can be tailored by adjusting the volume fraction of Mn3Zn0.5Sn0.5N. In particular, 40 vol.%-Mn3Zn0.5Sn0.5N/Al composite sintered at 723 K has a low thermal expansion coefficient of 2.38×10−6 K−1. The thermal expansion of Mn3Zn0.5Sn0.5N/Al composites matches well with those calculated from the rule of mixture (ROM) estimation. The ROM model can be used to predict the thermal expansion of Mn3Zn0.5Sn0.5N/Al composite and design Mn3Zn0.5Sn0.5N/Al composite with a particular thermal expansion. Mn3Zn0.5Sn0.5N/Al composites exhibit excellent electrical conductivities at the level of 104 S/cm. The hardness of the as-prepared composites increases by adding Mn3Zn0.5Sn0.5N in Al.

Keywords: electrical properties; metal-matrix composites; sintering; thermal properties

1 Introduction

Most materials have a positive thermal expansion (PTE) coefficient, expanding on heating and contracting on cooling. However, some materials have abnormal thermal expansion properties, which contract on heating, expand on cooling, and have negative thermal expansion (NTE) coefficient. A new NTE material, Mn3MN (M=Cu, Zn, Ge and Sn), has been discovered in past decades [1], [2], [3], [4], [5]. The antiperovskite manganese nitrides display an isotropic NTE at least twice than that of the well- known NTE material ZrW2O8 (the coefficient of thermal expansion, α=−8.9×10−6 K−1) [2], [6], [7]. Besides, these NTE materials have good mechanical and physical properties, such as Young’s modulus, hardness, thermal conductivity, electrical conductivity and magnetic properties [8], [9], [10], [11]. The composites with low or zero thermal expansion by blending PTE materials with NTE materials, will improve the mechanical reliability and increase the long-term duration of devices and instruments applied in high precision industries, such as optics, energy transformation and microelectronics.

In recent years, the composites with controllable thermal expansion have been fabricated by mixing ZrW2O8 with some PTE materials, such as Al [12], Cu [13], SnO2 [14], ZrO2 [15], Zr2WP2O12 [16], cement [17] and polyimide [18]. Aluminum has an easy process ability, low density, excellent thermal and electrical conductivity, but the large PTE (22.2×10−6 K−1) restricts its application in the field of microelectronics and precision instruments. Matsumoto et al. [12] successfully fabricated ZrW2O8/Al composite with a thermal expansion near to zero, but the volume fraction of ZrW2O8 was up to 75%, consequently, the mechanical and physical properties of the composite are worsen. Furthermore, it was reported that the decomposition of ZrW2O8 appeared in Al matrix at the temperature of about 683 K, which degraded the performance of thermal expansion compensation [19]. Mn3Zn0.5Sn0.5N, as a member of the antiperovskite manganese nitrides, displays a large isotropic NTE and the magnitude of its net NTE is close to the PTE of metals, which can be used to prepare a low thermal expansion composite with a low volume fraction of manganese nitride in metal matrix. To the best of our knowledge, the composites comprising of the antiperovskite manganese nitrides were rarely reported [9], [20], [21]. Therefore, it is necessary and important to study the thermal expansion and other physical properties of Mn3Zn0.5Sn0.5N/Al composites for the potential practical application in microelectronics and precision instruments.

In this work, the composites containing Mn3Zn0.5Sn0.5N and Al were prepared using a solid-state sintering method. The sintering temperature (Ts) of composites was determined. The thermal expansion of Al was effectively decreased by the thermal expansion compensator (TEC) Mn3Zn0.5Sn0.5N and the thermal expansion of composites was tailored by adjusting the volume fraction of Mn3Zn0.5Sn0.5N. The electrical conductivity and hardness of TEC and composites were also investigated at room temperature. The physical properties of the metal matrix and the TEC are listed in Table 1.

Table 1:

Physical properties of metal matrix and thermal expansion compensator.

MaterialCoefficient of thermal expansion α (×10−6 K−1)Young’s modulus E (GPa)Electrical conductivity σ (S/cm)Vickers hardness HV (kgf/mm2)
Al23.2703.77×10529
Mn3Zn0.5Sn0.5N−19.16200 [8]0.157×103538

2 Experimental procedures

The polycrystalline Mn3Zn0.5Sn0.5N was synthesized by a solid state reaction using the powders of the synthesized Mn2N [9], Zn (99.99 at.%) and Sn (99.99 at.%) as raw materials. The powders were mixed with the desired proportions and milled by a planetary ball mill machine (P5, Fritsch, Germany) at a rotating speed of 250 rpm for 2 h. Then the milled powders were pressed into cylindrical pellets. The pellets were fired at 1073 K under the flowing argon for 20 h to prepare Mn3Zn0.5Sn0.5N. The obtained Mn3Zn0.5Sn0.5N was pestled in agate mortar for 1 h and further ground by mechanical ball milling at a rotating speed of 300 rpm for 20 h. The milled nitrides powders were mixed with the commercial Al powders in appropriate volume ratios by mechanical ball milling at a rotating speed of 250 rpm for 20 h. The mixed powders were pressed into a cylindrical shape by cold isostatic pressing process. The cylindrical pellets were sintered at 623 K, 723 K and 823 K under the flowing argon shield for 3 h, respectively, and then cooled down to room temperature.

The crystal structures of the samples were investigated by the X-ray powder diffraction (Rigaku D-max2500/pc, Japan) using Cu Kα radiation, at a scanning rate of 5°/min from 20° to 80°. The linear thermal expansion of samples was measured by thermal mechanical analyzer (Netzsch TMA 402F3, Germany) in the temperature range of 290–400 K. The electrical conductivity was measured by a standard four-probe technique (RTS-9, China) at room temperature. The Vickers hardness was obtained by Vickers hardness tester (HV-1000, China).

3 Results and discussion

3.1 Analysis of the Mn3Zn0.5Sn0.5N

The X-ray diffraction (XRD) pattern of the as-prepared Mn3Zn0.5Sn0.5N is shown in Figure 1, which indicates a typical antiperovskite cubic structure (space group Pm3m, JCPDS card No.23-0220). The existence of MnO is likely due to the oxygen contamination introduced by the ball milling, which has little influence on the thermal expansion of the antiperovskite manganese nitrides [9]. Figure 2 displays linear thermal expansion ΔL/L (298 K) of the TEC Mn3Zn0.5Sn0.5N. It reveals that Mn3Zn0.5Sn0.5N displays a NTE at 301.3~363.2 K (ΔT=62 K) and the coefficient of linear thermal expansion α obtained by linear fitting is −19.16×10−6 K−1, which is more than twice as that of ZrW2O8 [7]. The electrical conductivity and Vickers hardness is 157 S/cm and 538 HV (Table 1), respectively.

Figure 1: X-ray diffraction pattern of the thermal expansion compensator Mn3Zn0.5Sn0.5N.
Figure 1:

X-ray diffraction pattern of the thermal expansion compensator Mn3Zn0.5Sn0.5N.

Figure 2: Linear thermal expansion of the thermal expansion compensator Mn3Zn0.5Sn0.5N.
Figure 2:

Linear thermal expansion of the thermal expansion compensator Mn3Zn0.5Sn0.5N.

3.2 Analysis of Mn3Zn0.5Sn0.5N/Al composite

The sintering temperature Ts is a key factor in fabricating Mn3Zn0.5Sn0.5N/Al composites. It was reported that the sintering temperature of Al with high-density is above 573 K but lower than its melting point Tm (933 K) [20]. The carbon nanotubes/manganese nitrides composites have been successfully fabricated at 1223 K in our previous study [9]. Here, the prefabricated columnar samples of Mn3Zn0.5Sn0.5N/Al composites were sintered at 623 K, 723 K and 823 K, respectively, obtaining the dense composite samples with the powders well-distributed in the matrix Al. Figure 3 displays the XRD patterns of Mn3Zn0.5Sn0.5N, aluminum and the as-prepared 30 vol.%-Mn3Zn0.5Sn0.5N/Al composites after sintering at 623 K, 723 K and 823 K, respectively. When Ts are 623 K and 723 K, all of the diffraction peaks could be indexed as the characteristic peaks of either Mn3Zn0.5Sn0.5N or Al, indicating that no chemical reaction between the Al matrix and nitride compensator occurred during the sintering. However, when Ts is 823 K, the XRD pattern is different from those of the above two, and the characteristic peaks of Mn3Zn0.5Sn0.5N disappear, accompanying with appearance of unknown phase peaks. The characteristic peaks of the unknown phase do not match that of the reported Mn3AlN [22] or other antiperovskite manganese compounds.

Figure 3: X-ray diffraction patterns of 30 vol.%-Mn3Zn0.5Sn0.5N/Al composites at (A) 623 K, (B) 723 K, (C) 823 K. The patterns of matrix Al (D) and compensator Mn3Zn0.5Sn0.5N (E) are added as well for comparison.
Figure 3:

X-ray diffraction patterns of 30 vol.%-Mn3Zn0.5Sn0.5N/Al composites at (A) 623 K, (B) 723 K, (C) 823 K. The patterns of matrix Al (D) and compensator Mn3Zn0.5Sn0.5N (E) are added as well for comparison.

The thermal expansion of the obtained specimens was measured at the temperature range of 290–400 K. Figure 4 shows linear thermal expansion of 30 vol.%-Mn3Zn0.5Sn0.5N/Al composites specimens sintered at 623 K, 723 K and 823 K, respectively. For the samples sintered at 623 K and 723 K, an abnormal change of thermal expansion is observed at the NTE temperature range of Mn3Zn0.5Sn0.5N, though the specimens still display a PTE. The thermal expansion of composites is decreased by mixing the TEC in the Al matrix, resulting in a low thermal expansion about 5.5×10−6 K−1 (Ts=723 K) at 301.3–363.2 K. It was reported that the NTE decreased with increasing the sintering temperature for the antiperovskite manganese nitrides [23]. In this study, both composites sintered at 623 K and 723 K show almost similiar thermal expansion at the measured temperature range. It indicates that the relatively low sintering temperature for Mn3Zn0.5Sn0.5N/Al composite has little influence on thermal expansion, which is conducive to fabricating fine low thermal expansion Mn3Zn0.5Sn0.5N/Al composite. However, for the sample sintered at 823 K, the ΔL/L of the 30 vol.%-Mn3Zn0.5Sn0.5N/Al specimen is kept as a linear dependence with temperature over the measured temperature range, due to the unknown phases existed in composite.

Figure 4: Linear thermal expansion of 30 vol.%-Mn3Zn0.5Sn0.5N/Al composites at different sintering temperatures.
Figure 4:

Linear thermal expansion of 30 vol.%-Mn3Zn0.5Sn0.5N/Al composites at different sintering temperatures.

Based on the results above, the Mn3Zn0.5Sn0.5N/Al composites were fabricated at 723 K. The 30 vol.%-Mn3Zn0.5Sn0.5N/Al composite displays a low thermal expansion compared with that of the Al matrix. It can be expected to obtain the Mn3Zn0.5Sn0.5N/Al composite with particular thermal expansion by adjusting the volume fraction of Mn3Zn0.5Sn0.5N. When the volume fraction of Mn3Zn0.5Sn0.5N is up to 40%, it can be observed that 40 vol.%-Mn3Zn0.5Sn0.5N/Al composite displays a low thermal expansion (α=2.38×10−6 K−1, at T=301.3–363.2 K) in Figure 5.

Figure 5: Linear thermal expansion of Mn3Zn0.5Sn0.5N/Al composites for various Mn3Zn0.5Sn0.5N volume fractions.
Figure 5:

Linear thermal expansion of Mn3Zn0.5Sn0.5N/Al composites for various Mn3Zn0.5Sn0.5N volume fractions.

The thermal expansion of composite can be evaluated using two models, such as the rule of mixture (ROM) and Turner’s model [24]. Here, we define the subscripts c, m and t as the composite, matrix and TEC, respectively. Therefore, the coefficient of thermal expansion of composite, matrix and TEC can be described as αc, αm and αt, respectively. Thermal stress is assumed uniform throughout the composite for ROM, which means that the thermal expansion of matrix and compensator is independent. The thermal expansion of composite is represented by the volume-weighted sum of contributions from the matrix and the dispersed phase, which is described as Equation (1):

(1)αc=vαmm+vtαt,

where vm and vt donates as the volume fractions of matrix and compensator, respectively, and vm+vt=1. For Turner’s model, the thermal strain is assumed approximately uniform throughout the composite as a result of interfacial elastic interactions between the matrix and compensator, which is described as Equation (2):

(2)αc=vmEmαm+vtEtαtvmEm+vtEt,

where Em and Et is Young’s modulus of matrix and compensator, respectively. It is confirmed that the larger elastic modulus of constituent contributes more to thermal expansion than the volume fraction in Turner’s model. Figure 6 displays the experimental value of ΔL/L as well as the curves calculated by assuming ROM and Turner’s model. It can be observed that the experimental value of ΔL/L almost coincides with the value calculated from ROM for the obtained 30 vol.%-Mn3Zn0.5Sn0.5N/Al composite. Therefore, the volume fraction, instead of the high stiffness of Mn3Zn0.5Sn0.5N in this composite, dominates the contribution to suppressing thermal expansion. The ROM can be used to predict the thermal expansion of Mn3Zn0.5Sn0.5N/Al composite and design Mn3Zn0.5Sn0.5N/Al composite with a particular thermal expansion.

Figure 6: Experimental plots of thermal expansion as well as curves calculated by assuming ROM and Turner’s model for 30 vol.%-Mn3Zn0.5Sn0.5N/Al composite.
Figure 6:

Experimental plots of thermal expansion as well as curves calculated by assuming ROM and Turner’s model for 30 vol.%-Mn3Zn0.5Sn0.5N/Al composite.

As listed in Table 2, the electrical conductivity and hardness of the composite are measured. It can be seen that the average electrical conductivities of the obtained composites are all at the level of 104 S/cm, because Mn3Zn0.5Sn0.5N is an electrical nonconductor compared with Al. The electrical conductivity deceased significantly with increasing the volume fraction of Mn3Zn0.5Sn0.5N. For example, the electrical conductivity of 40 vol.%-Mn3Zn0.5Sn0.5N/Al composite is less than half of that of 30 vol.%-Mn3Zn0.5Sn0.5N/Al composite even though the volume fraction of Mn3Zn0.5Sn0.5N increases 10%, which indicates that volume fraction of Mn3Zn0.5Sn0.5N has a significant effect on the electrical conductivity of the composite. It can be found that the electrical conductivity decreased slightly with increasing sintering temperature. The sintering temperature, far less than the volume fraction of Mn3Zn0.5Sn0.5N, has a slight effect on electrical conductivity.

Table 2:

The average electrical conductivity and Vickers hardness of Mn3Zn0.5Sn0.5N/Al composites.

Volume fraction of Mn3Zn0.5Sn0.5NSintering temperature (K)Electrical conductivity (104 S/cm)Hardness (HV)
30%6238.0256.2
7237.9460.5
40%6233.6378.3
7233.6084.6

It was reported that Pal developed a new theoretical model and optimized using a differential effective medium approach for accurately evaluating the electrical conductivity of composite [24], which is described as Equation (3):

(3)(σσm)13(σd−σmσd−σ)=(1−vvm)−μvmax

where σ, σm and σd donates as the electrical conductivity of composite, matrix and dispersed phase, respectively, and vd, vmax and μ is the volume fraction, max volume fraction of dispersed phase and correction factor of the order of unity to account for the deviations from the assumptions, respectively. We define the relative electrical conductivity σr and the electrical conductivity ratio λ as σ/σm and σd/σm, respectively. It is known that λ (less than 0.01) approaches 0. Therefore, the Equation (3) can be simplified to Equation (4):

(4)σr=(1−vdvmax)32μvmax.

Here, Mn3Zn0.5Sn0.5N particles are assumed to have the regular spherical shape, and vmax is 0.637. Figure 7 shows the experimental average electrical conductivity and the curve predicted by assuming of electrical conductivity for Mn3Zn0.5Sn0.5N/Al composites. When μ is 2.5, the experimental data of electrical conductivity coincides with the Pal’s theoretical model. It can be found that the irregular spherical particles, distribution of Mn3Zn0.5Sn0.5N particles, interfacial additive and other correction factors lead a relatively larger μ, and the preparation of Mn3Zn0.5Sn0.5N/Al composite can be optimized in further research.

Figure 7: Experimental data of electrical conductivity and curve calculated by assuming Pal’s theoretical model for Mn3Zn0.5Sn0.5N/Al composites.
Figure 7:

Experimental data of electrical conductivity and curve calculated by assuming Pal’s theoretical model for Mn3Zn0.5Sn0.5N/Al composites.

The Vickers hardness of Al and Mn3Zn0.5Sn0.5N is 29 HV and 538 HV, respectively (load of 4.9 N, Table 1). The function of the compensator is not only decreasing the thermal expansion but also improving the hardness of Mn3Zn0.5Sn0.5N/Al composites. The hardness of composite with a certain volume fraction increases with increasing the sintering temperature. For example, the Vickers hardness of 30 vol.%-Mn3Zn0.5Sn0.5N/Al sintered at 723 K (60.5 HV) is about 10% than that of 30 vol.%-Mn3Zn0.5Sn0.5N/Al sintered at 623 K (56.2 HV), which could be caused by the increase of interface bonding with increasing temperature. When the composite is sintered at the certain temperature, the Vickers hardness of the composites increases efficiently with increasing the volume fraction of Mn3Zn0.5Sn0.5N, which is owing to the effective suppression of plastic deformation of matrix from the increasing the volume fraction of compensator.

4 Conclusions

Mn3Zn0.5Sn0.5N/Al composites were successfully prepared by sintering at 623 K and 723 K. The sintering temperature has little influence on the thermal expansion of Mn3Zn0.5Sn0.5N/Al composites. The thermal expansion of composite decreases effectively by adding the compensator in the NTE temperature range of Mn3Zn0.5Sn0.5N. The coefficient of thermal expansion of Mn3Zn0.5Sn0.5N/Al composites is tailored by adjusting the volume fraction of Mn3Zn0.5Sn0.5N. The thermal expansion of Mn3Zn0.5Sn0.5N/Al composites agree well with that calculated from the ROM estimation. Mn3Zn0.5Sn0.5N/Al composites exhibit excellent electrical conductivity and improved hardness for the potential application in the field of microelectronics and precision instruments.

Acknowledgments

This work is supported by the National Nature Science Foundation of China (51272093), the Natural Science Foundation of the Jiangsu (BK2008224), the Natural Science Foundation of Jiangsu High Education (09KJA43001).

References

[1] Takenaka K, Takagi H. Appl. Phys. Lett. 2005, 87, 261902.10.1063/1.2147726Search in Google Scholar

[2] Takenaka K, Asano K, Misawa M, Takagi H. J. Appl. Phys. 2008, 92, 011927.10.1063/1.2831715Search in Google Scholar

[3] Hamada T, Takenaka K. J. Appl. Phys. 2011, 109, 07E309.10.1063/1.3540604Search in Google Scholar

[4] Sun Y, Wang C, Wen YH, Chu LH, Pan H, Man N. J. Am. Ceram. Soc. 2010, 93, 2178–2181.10.1111/j.1551-2916.2010.03711.xSearch in Google Scholar

[5] Sun Y, Wang C, Wen YH, Chu LH, Man N. J. Am. Ceram. Soc. 2010, 93, 650–653.10.1111/j.1551-2916.2009.03482.xSearch in Google Scholar

[6] Sun Y, Wang C, Wen YH, Zhu KG. Appl. Phys. Lett. 2007, 91, 231913.10.1063/1.2822813Search in Google Scholar

[7] Mary TA, Evans JSO, Vogt T, Sleight AW. Science. 1996, 272, 90–92.10.1126/science.272.5258.90Search in Google Scholar

[8] Nakamura Y, Takenaka K, Kishimoto A, Takagi H. J. Am. Ceram. Soc. 2009, 92, 2999–3003.10.1111/j.1551-2916.2009.03297.xSearch in Google Scholar

[9] Miao JJ, Liu JQ, Pan JM, Wang Y, Chen XY, Zhang WH, Yan XH, Cheng XN. J. Eur. Ceram. Soc. 2015, 35, 3213–3217.10.1016/j.jeurceramsoc.2015.05.021Search in Google Scholar

[10] Huang RJ, Wu ZX, Yang HH, Chen Z, Chu XX, Li LF. Cryogenics. 2010, 50, 750–753.10.1016/j.cryogenics.2010.09.001Search in Google Scholar

[11] Iikubo S, Kodama K, Takenaka K, Takagi H, Shamoto S. Phys. Rev. B. 2008, 77, 020409.10.1103/PhysRevB.77.020409Search in Google Scholar

[12] Matsumoto A, Kobayashi K, Nishio T, Ozaki K. Mater. Sci. Forum. 2003, 426, 2279–2284.10.4028/www.scientific.net/MSF.426-432.2279Search in Google Scholar

[13] Yan X, Cheng X, Xu G, Wang C, Sun S, Riedel R. Materialwiss. Werkst. 2008, 39, 649–653.10.1002/mawe.200800322Search in Google Scholar

[14] Nishiyama S, Yoshida H, Hattori T. In Annual Meeting of the Ceramic Society of Japan. Tokyo, 2002, p. 205.Search in Google Scholar

[15] Yang XB, Cheng XN, Yan XH, Yang J, Fu TB, Qiu J. Compos. Sci. Technol. 2007, 67, 1167–1171.10.1016/j.compscitech.2006.05.012Search in Google Scholar

[16] Tani J, Takahashi M, Kido H. J. Eur. Ceram. Soc. 2010, 30, 1483–1488.10.1016/j.jeurceramsoc.2009.11.010Search in Google Scholar

[17] Kofteros M, Rodriguez S, Tandon V, Murr LE. Scripta. Mater. 2001, 45, 369–374.10.1016/S1359-6462(01)01009-0Search in Google Scholar

[18] Sullivan LM, Lukehart CM. Chem. Mater. 2005, 17, 2136–2141.10.1021/cm0482737Search in Google Scholar

[19] Wu GH, Zhou C, Zhang Q, Pei RS. Scripta. Mater. 2015, 96, 29–32.10.1016/j.scriptamat.2014.10.014Search in Google Scholar

[20] Takenaka K, Hamada T, Kasugai D, Sugimoto N. J. Appl. Phys. 2012, 112, 083517.10.1063/1.4759121Search in Google Scholar

[21] Ding L, Wang C, Na YY, Chu LH, Yan J. Scripta. Mater. 2011, 65, 687–690.10.1016/j.scriptamat.2011.07.008Search in Google Scholar

[22] Lin JC, Wang BS, Tong P, Lu WJ, Zhang L, Zhu XB, Yang ZR, Song WH, Dai JM, Sun YP. Appl. Phys. Lett. 2011, 98, 092507.10.1063/1.3562315Search in Google Scholar

[23] Takenaka K, Takagi H. J. Appl. Phys. 2009, 94, 131904.10.1063/1.3110046Search in Google Scholar

[24] Pal R. J. Compos. Mater. 2007, 41, 2499–2511.10.1177/0021998307076489Search in Google Scholar

Received: 2015-10-8
Accepted: 2016-4-18
Published Online: 2016-9-17
Published in Print: 2018-1-26

©2018 Walter de Gruyter GmbH, Berlin/Boston

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https://doi.org/10.1515/secm-2015-0402
Keywords for this article
electrical properties; metal-matrix composites; sintering; thermal properties
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