Abstract
The quality of wood composites is dependent on the bondlines’ performance and their moisture resistance. The effect of moisture intrusion into bondlines is the focus of this study. The strain profile in the bondline during loading was investigated and the effects of weathering on the bondline were quantified by digital image correlation (DIC), while load deflection data were collected from lap-shear tests (LShTs). A total of 75 LShTs were evaluated including four different adhesive types with Douglas-fir wood, out of which 39 served as controls and 36 as substrates for weathering. The effect of weathering on failure load was not statistically significant. Only the bonded surface and adhesive type have significant effects on failure load, as well as the three-way interaction between the bonded surface, adhesive, and weathering, as revealed by three-way analysis of variance (ANOVA). The average effective shear moduli for the weathered samples were significantly lower than those for the control samples.
Funding source: National Science Foundation
Award Identifier / Grant number: IIP-1331043
Funding statement: We acknowledge the financial support from US National Science Foundation Grant No. IIP-1331043, and NSF Industry/University Cooperative Research Center for Wood-Based Composites Grant No. IIP-1034975 (Funder Id: 10.13039/100000001).
Author contributions: All the authors have accepted responsibility for the entire content of this submitted manuscript and approved submission.
Employment or leadership: None declared.
Honorarium: None declared.
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©2019 Walter de Gruyter GmbH, Berlin/Boston
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Articles in the same Issue
- Frontmatter
- Original Articles
- Cutting forces and chip formation revisited based on orthogonal cutting of Scots pine
- Predicting structural timber grade-determining properties using acoustic and density measurements on young Sitka spruce trees and logs
- Natural resistance of eight Brazilian wood species from the region Caatinga determined by an accelerated laboratory decay test against four fungi
- Understanding the effect of weathering on adhesive bonds for wood composites using digital image correlation (DIC)
- Time-dependent ammonia emissions from fumed oak wood determined by micro-chamber/thermal extractor (μCTE) and FTIR-ATR spectroscopy
- Rheology of moso bamboo stem determined by DMA in ethylene glycol
- Carbon nanomaterials based on interpolyelectrolyte complex lignosulfonate-chitosan
- Radical transfer system in the enzymatic dehydrogenative polymerization (DHP formation) of coniferyl alcohol (CA) and three dilignols
- The gene expression and enzymatic activity of pinoresinol-lariciresinol reductase during wood formation in Taiwania cryptomerioides Hayata
- Applicability of chloroplast DNA barcodes for wood identification between Santalum album and its adulterants
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