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On-chip photonic microsystem for optical signal processing based on silicon and silicon nitride platforms

  • Yu Li , Jiachen Li , Hongchen Yu , Hai Yu , Hongwei Chen , Sigang Yang and Minghua Chen EMAIL logo
Published/Copyright: January 18, 2018
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Abstract

The explosive growth of data centers, cloud computing and various smart devices is limited by the current state of microelectronics, both in terms of speed and heat generation. Benefiting from the large bandwidth, promising low power consumption and passive calculation capability, experts believe that the integrated photonics-based signal processing and transmission technologies can break the bottleneck of microelectronics technology. In recent years, integrated photonics has become increasingly reliable and access to the advanced fabrication process has been offered by various foundries. In this paper, we review our recent works on the integrated optical signal processing system. We study three different kinds of on-chip signal processors and use these devices to build microsystems for the fields of microwave photonics, optical communications and spectrum sensing. The microwave photonics front receiver was demonstrated with a signal processing range of a full-band (L-band to W-band). A fully integrated microwave photonics transceiver without the on-chip laser was realized on silicon photonics covering the signal frequency of up 10 GHz. An all-optical orthogonal frequency division multiplexing (OFDM) de-multiplier was also demonstrated and used for an OFDM communication system with the rate of 64 Gbps. Finally, we show our work on the monolithic integrated spectrometer with a high resolution of about 20 pm at the central wavelength of 1550 nm. These proposed on-chip signal processing systems potential applications in the fields of radar, 5G wireless communication, wearable devices and optical access networks.

Acknowledgments

The authors would thank LioniX BV for offering the TriPleX™ waveguide technology, and the IMEC and LETI for offering the SOI waveguide technology. Our works are partially supported by the National Natural Science Foundation of China (NSFC) under Contract no. 61771285 and 61335002, Funder Id: 10.13039/501100001809.

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Received: 2017-9-5
Accepted: 2017-11-30
Published Online: 2018-1-18
Published in Print: 2018-4-25

©2018 THOSS Media & De Gruyter, Berlin/Boston

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