Interfacial microstructure and mechanical properties of Si3N4/Invar joints using Ag–Cu–In–Ti with Cu foil as an interlayer

Tong Zhao; Defeng Mo; Xue Li; Haimei Gong

doi:10.1515/mt-2023-0221

Article

Interfacial microstructure and mechanical properties of Si₃N₄/Invar joints using Ag–Cu–In–Ti with Cu foil as an interlayer

Tong Zhao
Tong Zhao, born in 1997, graduated with a Bachelor’s degree from Wuhan University of Science and Technology, Hubei, China, in 2019. She is currently pursuing the joint Ph.D. degree with the University of Chinese Academy of Sciences and the Shanghai Institute of Technical Physics, Chinese Academy of Sciences.
, Defeng Mo
Defeng Mo, born in 1982, graduated with a PhD degree in Materials Science from Tongji University, Shanghai, China in 2010. He is an Associate Professor at Shanghai Institute of Technical Physics, Chinese Academy of Sciences, Shanghai, China. His main research fields are welding, fatigue, and packaging technology.
, Xue Li
Xue Li, born in 1976, graduated with a Bachelor’s degree in Physics at Harbin University of Science and Technology, Harbin, China in 2002. Subsequently, she completed her PhD degree at Shanghai Institute of Technical Physics, Chinese Academy of Sciences, Shanghai, China in 2005. Her main research fields are infrared detector and packaging technology.
and Haimei Gong
Haimei Gong, born in 1965, graduated with a Bachelor’s degree in Physics at University of Science and Technology of China, Hefei, China in 1986. Subsequently, he completed his Master and PhD degree at Shanghai Institute of Technical Physics, Chinese Academy of Sciences, Shanghai, China in 1989 and 1993. His main research fields are infrared detector and packaging technology.

Published/Copyright: January 11, 2024

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From the journal Materials Testing Volume 66 Issue 2

Abstract

Si₃N₄ and Invar alloy brazed joints were achieved using two types of Ag-based interlayers: a Ag–Cu–In–Ti foil and a Ag–Cu–In–Ti/Cu/Ag–Cu multi-interlayer. The results showed that when only using a single Ag–Cu–In–Ti filler, the wave-shaped Fe₂Ti + Ni₃Ti intermetallic compounds are concentrated in the middle of the brazing seam. When adding Cu as the interlayer, the dissolution of the Cu interlayer formed a large number of Cu(s,s) blocks of different sizes in the brazing seam, which hindered the concentrated distribution of Fe₂Ti + Ni₃Ti intermetallic compounds in the brazing seam. As a result, Fe₂Ti and Ni₃Ti were dispersedly distributed in the brazing seam, increasing the shear strength of the brazed joint. The shear strength of brazed joints was increased by 82 % compared to joints brazed with a single Ag–Cu–In–Ti filler when the Cu interlayer was added.

Keywords: Si3N4; Invar alloy; Cu foil; brazing; interfaces

Corresponding author: Defeng Mo, Shanghai Institute of Technical Physics, Shanghai, China, E-mail: dfmo@mail.sitp.ac.cn

About the authors

Tong Zhao

Tong Zhao, born in 1997, graduated with a Bachelor’s degree from Wuhan University of Science and Technology, Hubei, China, in 2019. She is currently pursuing the joint Ph.D. degree with the University of Chinese Academy of Sciences and the Shanghai Institute of Technical Physics, Chinese Academy of Sciences.

Defeng Mo

Defeng Mo, born in 1982, graduated with a PhD degree in Materials Science from Tongji University, Shanghai, China in 2010. He is an Associate Professor at Shanghai Institute of Technical Physics, Chinese Academy of Sciences, Shanghai, China. His main research fields are welding, fatigue, and packaging technology.

Xue Li

Xue Li, born in 1976, graduated with a Bachelor’s degree in Physics at Harbin University of Science and Technology, Harbin, China in 2002. Subsequently, she completed her PhD degree at Shanghai Institute of Technical Physics, Chinese Academy of Sciences, Shanghai, China in 2005. Her main research fields are infrared detector and packaging technology.

Haimei Gong

Haimei Gong, born in 1965, graduated with a Bachelor’s degree in Physics at University of Science and Technology of China, Hefei, China in 1986. Subsequently, he completed his Master and PhD degree at Shanghai Institute of Technical Physics, Chinese Academy of Sciences, Shanghai, China in 1989 and 1993. His main research fields are infrared detector and packaging technology.

Research ethics: Not applicable.
Author contributions: Tong Zhao: Conceptualization, Formal analysis, Writing – original draft. Defeng Mo: Methodology, Writing – review and editing. Xue Li: Project administration. Haimei Gong: Supervision. The authors have accepted responsibility for the entire content of this manuscript and approved its submission.
Competing interests: The authors state no conflict of interest.
Research funding: The Key Project of CAS (No.ZDRW-CN-2019-3) and the Youth Innovation Promotion Association, Chinese Academy of Science (No.2018274).
Data availability: Not applicable.

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Published Online: 2024-01-11

Published in Print: 2024-02-26

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Articles in the same Issue

https://doi.org/10.1515/mt-2023-0221

Keywords for this article

Si3N4; Invar alloy; Cu foil; brazing; interfaces